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Nanostructured gate dielectric boosts stability of organic thin-film transistors
01/16/2018A nanostructured gate dielectric may have addressed the most significant obstacle to expanding the use of organic semico...
Process Watch: The (automotive) problem with semiconductors
01/11/2018This article is the first in a five-part series on semiconductors in the automotive industry. In this article, we introduce some of the chall...
Korea is at full throttle on memory investments
01/17/20182017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor m...
Worldwide semiconductor revenue grew 22.2% in 2017; Samsung takes over No. 1 position
01/11/2018Worldwide semiconductor revenue totalled $419.7 billion in 2017, a 22.2 percent increase from 2016, according to pr...

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May 20 – 23, 2018


THE COSMOPOLITAN of LAS VEGAS
Tech Papers
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Materials
Date and time TBD Success in electronics manufacturing increasingly relies on the materials used in production and packaging....
MEMS
Date and time TBDMEMS have quite different process and material requirements compared to mainstream microprocessor and memory types...

MAGAZINE




TWITTER


NEWS ANALYSIS & FEATURES


Peregrine Semiconductor is now pSemi

01/17/2018  Peregrine Semiconductor Corporation today announces its corporate name change to pSemi™ Corporation, a Murata company focused on semiconductor integration.

Everspin begins 40nm STT-MRAM volume production

01/17/2018  Everspin Technologies, Inc., a developer and manufacturer of discrete and embedded MRAM, today announced the Company recorded revenue for its first 40nm 256Mb STT-MRAM products in the fourth quarter of 2017 and is in the process of ramping its volume production in 2018

ASML announces appointment of new CFO to the Board of Management

01/17/2018  ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management.

Littelfuse completes acquisition of IXYS Corporation

01/17/2018  Littelfuse, Inc. today announced the completion of its acquisition of IXYS Corporation.

2018 will see first uses of 8K resolution display

01/16/2018  As the demand for super-large TV displays grow, the need for higher resolution is set to increase, seeing the first uses of 8K display in 2018, according to IHS Markit.

Picosun provides 300mm ALD technology for green power electronics

01/16/2018  Picosun Oy, a supplier of Atomic Layer Deposition (ALD) thin film coating technology for global industries, partners with STMicroelectronics S.r.l. to develop the next generation 300mm production solutions for advanced power electronics.

Researchers propose new gas-solid reaction for high-speed perovskite photodetector

01/16/2018  The gas-solid reaction method provides a full coverage of the perovskite film and avoids the damage from the organic solvent, which is beneficial for the light capture and electrons transportation, resulting in a faster response time and stability for the perovskite photodetector.

Expanded SiC Schottky diode line from Littelfuse reduces switching losses, increases efficiency and robustness

01/16/2018  Littelfuse, Inc. today introduced four new series of 1200V silicon carbide (SiC) Schottky Diodes from its GEN2 product family, which was originally released in May 2017.

Advancing the path to organic electronics beyond cell phone screens

01/12/2018  A discovery by an international team of researchers from Princeton University, the Georgia Institute of Technology and Humboldt University in Berlin points the way to more widespread use of an advanced technology generally known as organic electronics.

Worldwide PC shipments declined 2% in 4Q17 and 2.8% for the year

01/12/2018  Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.

UMC files patent infringement lawsuit against Micron

01/12/2018  The lawsuit covers three areas that allegedly infringe upon UMC’s patent rights in China, including specific memory applications that relate to DDR4, SSD and memory used in graphics cards.

Analog IC market forecast with strongest annual growth through 2022

01/12/2018  Power management, signal conversion, and automotive-specific analog markets drive expansion.

Luc Van den hove to receive SEMI Sales and Marketing Excellence Award

01/11/2018  SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

Extremely bright and fast light emission

01/11/2018  An international team of researchers from ETH Zurich, IBM Research Zurich, Empa and four American research institutions have found the explanation for why a class of nanocrystals that has been intensively studied in recent years shines in such incredibly bright colours.

Boston Semi Equipment receives multisystem order for Zeus pressure MEMS test handler

01/11/2018  Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and provider of test automation technical services, announced today that it has received a multisystem order for its Zeus gravity feed systems for handling pressure MEMS devices.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

Making the Internet of Things possible with a new breed of 'memristors'

01/10/2018  Easily printable, organic thin films can retain data for more than 10 years without power, work with low voltages -- and become the building block of future computers that mimic the human brain.

New oxide and semiconductor combination builds new device potential

01/10/2018  Researchers integrated oxide two-dimensional electron gases with gallium arsenide and paved the way toward new opto-electrical devices.

New Multibeam patent enhances highly-localized precision material removal

01/10/2018  Multibeam Corporation today disclosed a new patent that describes the innovative use of e-beam technology for highly localized precision etching in manufacturing advanced memory and logic ICs.

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RESOURCE GUIDE - Get Listed


Latest Article

OEM Group announces post-dice clean solutions for plasma and laser dicing methods

09/28/2017  OEM Group announced today a post-dice clean solution on the proven Cintillio Batch Spray platform following plasma and laser dicing methods.



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Indium Corporation: http://www.indium.com



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers

WEBCASTS

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


More Events

NEW PRODUCTS

Radiant Vision Systems announces new automated visual inspection system
11/06/2017Radiant Vision Systems, a provider of high-resolution imaging solutions for automated visual analysis of devices and surfaces, an...
SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....