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Knowm first to deliver memristors capable of bi-directional learning
09/02/2015Milestone confirmed by groundbreaking new data; bi-directional incremental capability allows startup to leapfrog IBM and other estab...
New AMS fab going to Marcy, NY
08/27/2015Austria-based ams AG, formerly known as Austriamicrosystem, announced plans to locate a new 360,000 ft2 fab in upstate New York at the Nano Utica site in Marcy, NY....
Turning clothing into information displays
09/03/2015Researchers from Holst Centre (set up by TNO and imec), imec and CMST, imec’s associated lab at Ghent University, have demonstrated the world’s first stre...
Pure-play foundry sales forecast to surpass $12B in fourth quarter 2015
08/28/2015Atypical 2015 sales pattern, but stronger growth forecast to resume in second half of this year....
Tune in to the Solid State Watch

New ams fab going to Marcy, NY: Startups and small electronics companies spent $78.3 billion on semiconductors in 2014; Pure-play foundry sales forecast to grow to all-time high in 4Q15; University of Colorado and SRC research accelerates microscopic imaging for next-generation nano electronics

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Tech Papers
Upcoming Webcasts
System Scaling and Integration Platforms for Mobile Devices and IoT
September 9, 2015 at 8:00 p.m. ET In this presentation, recent developments in interconnects and packaging technologies that will ...
Metrology
September 2015 (Date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are ...
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NEWS ANALYSIS & FEATURES


The future of MEMS in the IoT

09/03/2015  SEMI’s European MEMS Summit will be held on 17-18 September 2015 in Milan, Italy. Over the course of the two-day event, more than 20 keynote and invited speakers from the entire supply chain will share their perspectives and latest updates, including participation by European MEMS leaders. In addition, a focused industry exhibition will complement the conferences offering with additional networking opportunities.

GLOBALFOUNDRIES and Catena partner to provide next-generation RF connectivity solutions for wireless markets

09/03/2015  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced it has partnered with Catena, a developer of Radio Frequency (RF) Communication IPs for connectivity, to offer complete Wi-Fi and Bluetooth solutions for System-on-Chip (SoC) designers targeting mobile, Internet-of-Things (IoT), RF connectivity markets.

Automotive industry now the third largest end market for power semiconductors

09/03/2015  In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.

Intel's Bill Holt awarded Robert N. Noyce Award

09/03/2015  Holt will accept the award at SIA's Annual Award Dinner on Thursday, Dec. 3.

Made from solar concentrate

09/02/2015  Solar cell from Berkeley Lab/University of Illinois absorbs high-energy light at 30-fold higher concentration than conventional cells.

Thin, flexible batteries set to become a $400 million market in 2025 mainly by enabling new products

09/02/2015  Batteries have not been a triumph of rapid innovation - from lead acid, nickel-cadmium, to nickel-metal-hydride and lithium-ion batteries, the development of batteries has significantly lagged many other components.

CyberOptics demonstrates new WaferSense and ReticleSense Auto Multi Sensors

09/02/2015  CyberOptics Corporation, a global developer and manufacturer of high precision 3D sensing technology solutions, will demonstrate the first wireless sensor to combine leveling, vibration and Relative humidity (RH) measurement in an all-in-one device at SEMICON Taiwan in Taipei, September 2-4, 2015.

20th annual SEMICON Taiwan 2015 opens today

09/02/2015  SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

Knowm First to Deliver Configurable Artificial Neural Networks using Bi-Directional Learning Memristors

09/02/2015  Breakthrough memristor technology combined with novel adaptive architecture enables machine learning (ML) and artificial intelligence (AI) applications.

Wearables and bioelectronics seek better energy storage

09/01/2015  Energy storage players are eyeing emerging opportunities in bioelectronics as wearable, implantable and other medical devices create energy demands and design requirements beyond conventional batteries, according to Lux Research.

Tech, academic leaders call for robust research investments to bolster U.S. tech leadership, advance IoT

09/01/2015  A coalition of leaders from the tech industry and academia, led by the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), today released a report highlighting the urgent need for robust investments in research to advance the burgeoning Internet of Things (IoT) and develop other cutting-edge innovations that will sustain and strengthen America’s global technology leadership into the future.

Flexible 7 inch touch panel with integrated OLED display developed

09/01/2015  Together with ITRI, Taiwan, Heraeus, demonstrated the integration of Clevios conductive polymer based touch panel with AM OLED technology in a highly flexible device.

Laith Altimime joins SEMI as President of SEMI Europe

09/01/2015  SEMI, the global association serving the electronics supply chain, today announced the appointment of Laith Altimime as president of SEMI Europe, effective October 1, 2015.

Advanced packaging and 3D-IC markets drive growth for EVG's automated 300mm polymer adhesive wafer bonding

08/31/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems.

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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS

System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

EVENTS

European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015

NEW PRODUCTS

DCG Systems extends circuit edit capability to the 10nm node with the introduction of OptiFIB Taipan
09/02/2015DCG Systems today announces the release of the OptiFIB Taipan circuit edit solution for the most adv...
SEMI-GAS unveils new custom-engineered ultra high purity liquid push system
09/02/2015The fully automatic system, operated by a GigaGuard PLC controller, features an intuitive 9” color touchscreen and user-def...
Compact point of use fluid delivery heater replaces multiple components in a system
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater...