TOP STORIES

EDITOR'S PICKS
THE CONFAB
EDUCATION
BLOGS
Applied Materials Releases Selective Etch Tool
06/29/2016Selectra chamber uses downstream plasma on Producer platform. ...
Process Watch: Process control and production cycle time
06/24/2016In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iteratio...
ASML president to receive Robert N. Noyce Award
06/30/2016Van den Brink will accept the award at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose, an event that will commemorate the 25thanniversary o...
SMIC acquires LFoundry
06/27/2016Semiconductor Manufacturing International Corporation jointly announces with LFoundry Europe GmbH and Marsica Innovation S.p.A., the signing of an agreement on June 24, 2016 to p...


June 12-15
Encore at the Wynn
Las Vegas

Register
TUESDAY KEYNOTE ANNOUNCED

WALLY RHINES
CEO & Chairman
Mentor Graphics

Extending Semiconductor Cost Reduction Another 20 years
Featured Sponsor

Semiconductor Device Product Lifecycle Management

Siemens offers a broad suite of industry-proven software solutions enabling design, development and release of SoC and IC devices across the value-chain.

Featured Sponsor

We Design and Build Your Leading Edge Fab

M+W Group is a focused global high-tech engineering, procurement and construction (EPC) company realizing projects of all dimensions on behalf of clients within the semiconductor and high-tech industry.
Featured Sponsor

Linde Electronics is an industry leader in gases for the electronics market—semiconductor, solar, display and LED.

Linde Electronics offers a broad portfolio of electronic specialty gases, bulk/pipeline gases, equipment, and services, and works with electronics customers to meet their evolving needs.
Tech Papers
Upcoming Webcasts
Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques
July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc. Decreasing the time to detect,...
Interconnection Technologies
June 2016 / Sponsored by Air ProductsThis webcast will examine the state-of-the-art in conductors and...

MAGAZINE




TWITTER


NEWS ANALYSIS & FEATURES


Electronic gases market undergoing major shifts

06/30/2016  Techcet forecasts $3.9B gas business for 2016.

SEMI Strategic Materials Conference delivers demand drivers for new device and packaging materials

06/30/2016  The Strategic Materials Conference (SMC 2016), focusing on "Scaling Challenges: The Future of Materials and Packaging," will be held September 20-21, at the Computer History Museum in Mountain View, Calif.

Gartner reports India PC shipments declined 7.4% in first quarter of 2016

06/30/2016  PC shipments in India totalled nearly 2 million units in the first quarter of 2016, a 7.4 percent decrease over the first quarter of 2015, according to Gartner, Inc.

A*STAR'S IME launches Chip-On-Wafer Consortium II and Cost Effective Interposer Consortium

06/30/2016  A*STAR’s Institute of Microelectronics (IME) has partnered semiconductor companies to develop cost-effective solutions in 2.5D and 3D wafer-level integrated circuit (IC) packaging.

HITRS roadmap aims to integrate photonic devices in SiP

06/29/2016  A new roadmap, the Heterogeneous Integration Technology Roadmap for Semiconductors (HITRS), aims to integrate fast optical communication made possible with photonic devices.

ALLVIA launches new product lines for Through Glass Vias and Through Quartz Vias

06/29/2016  ALLVIA, Inc. has expanded its capacity into glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers.

Amkor opens MEMS packaging line in China

06/29/2016  Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. today announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai.

Tiniest imperfections make big impacts in nano-patterned materials

06/28/2016  A Clarkson University research team reports surprising findings that could have significant impact for constructing nano-patterned materials in electronic, magnetic or optical devices.

Ultratech receives multiple system, follow-on order for fan-out wafer-level packaging applications

06/28/2016  Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.

Breakthrough opportunities at SEMICON West for an industry in transition

06/28/2016  With disruptive changes occurring in the electronics supply chain, 26,000 professionals will converge on SEMICON West 2016 (July 12-14) at Moscone Center in San Francisco to hear insider perspectives on what the future holds for the industry.

FormFactor completes acquisition of Cascade Microtech

06/28/2016  FormFactor, Inc. today announced that it has completed the acquisition of Beaverton, Oregon-based Cascade Microtech, Inc.

Digital redefines supply chain: Big change and big opportunity

06/28/2016  With many disruptive changes occurring in the electronics supply chain, the one with the biggest impact may come from smart manufacturing and the emergence of the digital supply chain.

SiC power business is a reality

06/27/2016  Today, SiC benefits are not a secret anymore and progressively lot of industries are considering the development of new products including SiC technologies.

Synopsys and Lattice Semiconductor extend multi-year OEM agreement for FPGA design software

06/27/2016  Synopsys, Inc. today announced a multi-year extension of its OEM agreement with Lattice Semiconductor Corporation for Synopsys' Synplify Pro FPGA synthesis tools.

Building a smart cardiac patch

06/27/2016  'Bionic' cardiac patch could one day monitor and respond to cardiac problems.

Presto Engineering signs agreement with NAGRA for secure product production

06/27/2016  Presto will provide supply chain management and production services for several of NAGRA’s key products in the Pay TV market.

Brite Semiconductor and Semitech Semiconductor collaborate on industrial M2M SoC

06/24/2016  This SoC is designed to support M2M communication in the global industrial and energy transmission market via PLC/wireless modes.

Qualcomm files complaint against Meizu in China

06/24/2016  Qualcomm Incorporated announced that it has filed a complaint against Meizu in the Beijing Intellectual Property Court.

Photovoltaic cells replicate rose petals

06/24/2016  With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.

MORE ANALYSIS & FEATURES

FEATURED INNOVATOR

QuantumClean: Process Improvement Through Consistently Cleaner Parts

QuantumClean is the global leader in high-purity outsourced process tool parts cleaning, performance coatings, refurbishment and analytical & engineering services to the semiconductor, solar and LED industries. QuantumClean operates on the frontier of the sub-20nm high-purity semiconductor parts cleaning market through leading-edge technologies, resources and expertise.
Sponsored By: QuantumClean

RESOURCE GUIDE - Get Listed


Latest Article

Samco boosts shipment capacity with second production center

06/21/2016  Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.



Categories


Featured Supplier


Yield Engineering Systems, Inc.: http://www.yieldengineering.com

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

WEBCASTS

Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

EVENTS

SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

NEW PRODUCTS

NanoFocus AG introduces new inspection system for semiconductors industry
05/31/2016NanoFocus AG, the developer and manufacturer of optical 3D surface measuring technology, introduces the new measuring system µ...
Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
02/18/2016Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of th...