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Worldwide semiconductor revenue grew 2.6% in 2016, reports Gartner
05/15/2017Worldwide semiconductor revenue totaled $343.5 billion in 2016, a 2.6 percent increase from 2015 revenue of $334.9 billion, according...
Infineon rides automotive wave into Top-10 semi supplier ranking
05/09/2017Memory market surge propels SK Hynix and Micron up two spots in the top-10 ranking....
China's semiconductor industry and "win-win" growth
05/22/2017As China embarks on the Made in China 2025 plan with electronics and semiconductor technology as one of the Top 10 focus areas, China's semiconductor...
WIN Semiconductor increases wafer manufacturing capacity by 20%
05/11/2017WIN Semiconductors Corp has completed phase 2 expansion at its newest wafer fab, Fab C....
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBD Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance,...
Materials
Date and time TBD Success in electronics manufacturing increasingly relies on the materials used in production and packaging....

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NEWS ANALYSIS & FEATURES


SEMICON West preview: MEMS

05/23/2017  Autonomous automobiles, smart manufacturing, smart buildings, mobile human health monitoring, and 4G+ communications hardware for connecting all these devices will drive strong 24 percent growth in units and 14 percent in value for the MEMS sector.

IEEE International Electron Devices Meeting announces 2017 Call for Papers

05/23/2017  The 63rd annual IEEE International Electron Devices Meeting (IEDM), to be held at the Hilton San Francisco Union Square hotel December 2-6, 2017, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

North American semiconductor equipment industry posts April 2017 billings

05/23/2017  North America-based manufacturers of semiconductor equipment posted $2.17 billion in billings worldwide in April 2017 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

GLOBALFOUNDRIES and Chengdu partner to expand FD-SOI ecosystem in China

05/23/2017  GLOBALFOUNDRIES and the Chengdu municipality today announced an investment to spur innovation in China's semiconductor industry.

Amkor Technology completes acquisition of NANIUM

05/22/2017  Amkor Technology, Inc. today announced that it has completed the acquisition of NANIUM S.A., a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.

Technology partners at SEMICON West focus on innovations driving industry growth

05/22/2017  SEMI today announced its plans to deliver specialized programs at SEMICON West 2017 (July 11-13 at Moscone Center in San Francisco, Calif.) in partnership with IEEE (Institute of Electrical and Electronics Engineers), Society of Automotive Engineers International (SAE), and imec.

Engaging diamond for next-era transistors

05/22/2017  Materials scientists in Japan have developed a new diamond transistor fabrication process that promises to advance the development of more robust and energy-efficient electronics.

Sensor/actuator sales take off as price erosion eases

05/22/2017  Strong unit growth continues to be driven by the spread of automated embedded controls, wearable systems, and the Internet of Things, says new O-S-D Report.

EV Group announces milestone: More than 1100 wafer bond chambers installed worldwide

05/22/2017  Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices and CMOS image sensors.

Lam Research appoints Dr. Y.B. Koh to Board of Directors

05/15/2017  Lam Research today announced that Dr. Young Bum Koh has joined the company's board of directors effective as of May 10, 2017.

Next-gen solar cells could be improved by atomic-scale redesign

05/15/2017  Researchers have uncovered the exact mechanism that causes new solar cells to break down in air, paving the way for a solution.

2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates

05/15/2017  FlexTech's annual Flexible Electronics Conference and Exhibit -- 2017FLEX -- is set for the Hyatt Regency Hotel & Spa in Monterey, Calif. from June 19-22, 2017.

ON Semiconductor wins Gold Stevie American Business Award for Large Manufacturing Company of the Year

05/15/2017  ON Semiconductor Corporation announced that it is has been named the winner of the Gold Stevie Award for Large Manufacturing Company of the Year in The 15th Annual American Business Awards (ABAs).

Racyics launches 'makeChip' design service platform for GLOBALFOUNDRIES’ 22FDX technology

05/12/2017  Racyics GmbH announced today it has launched makeChip, an design service platform, developed using GLOBALFOUNDRIES' 22FDX process technology and supported by Cadence.

Renesas Electronics announces absorption-type merger with consolidated subsidiary

05/12/2017  Renesas Electronics Corporation announced it will consolidate its subsidiary Renesas System Design, Co., Ltd. through an absorption-type merger.

Hafnia dons a new face

05/12/2017  As computer chips become smaller, faster and more powerful, their insulating layers must also be much more robust -- currently a limiting factor for semiconductor technology. A collaborative University of Kentucky-Texas A&M University research team says this new phase of hafnia is an order of magnitude better at withstanding applied fields.

Soitec names new VP of Strategic Business Development in China

05/11/2017  Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, has appointed Stephen Lin to the newly created position of vice president of strategic business development in China, a key region for the company's future growth plans.

Synopsys IC Validator physical signoff verifies 10 billion+ transistors within hours

05/11/2017  Synopsys, Inc. today announced that its IC Validator was successfully deployed on some of the industry's largest and most advanced designs to accelerate design rule checking (DRC) closure.

At last: Beautiful, consistent carbon belts

05/11/2017  Synthesis of a carbon nanobelt with potential applications in nanotechnology.

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Latest Article

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

WEBCASTS

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

EVENTS

Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...