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THE CONFAB
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BLOGS
Value of semiconductor industry M&A deals slows dramatically in 2017
01/18/2018Numerous smaller deals were made but "megadeals" were scarce last year....
Nanostructured gate dielectric boosts stability of organic thin-film transistors
01/16/2018A nanostructured gate dielectric may have addressed the most significant obstacle to expanding the use of organic semico...
Korea is at full throttle on memory investments
01/17/20182017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor m...
Worldwide semiconductor revenue grew 22.2% in 2017; Samsung takes over No. 1 position
01/11/2018Worldwide semiconductor revenue totalled $419.7 billion in 2017, a 22.2 percent increase from 2016, according to pr...

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May 20 – 23, 2018


THE COSMOPOLITAN of LAS VEGAS
Tech Papers
Upcoming Webcasts
Materials
Date and time TBD Success in electronics manufacturing increasingly relies on the materials used in production and packaging....
MEMS
Date and time TBDMEMS have quite different process and material requirements compared to mainstream microprocessor and memory types...

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TWITTER


NEWS ANALYSIS & FEATURES


Qualcomm receives authorization from the European Commission and Korea Fair Trade Commission for NXP Semiconductors acquisition

01/19/2018  Qualcomm Incorporated today announced that the European Commission and the Korea Fair Trade Commission authorized the acquisition by Qualcomm River Holdings B.V. of NXP Semiconductors N.V.

2-D tin (stanene) without buckling: A possible topological insulator

01/19/2018  Nagoya University-led researchers produce 2D sheets of tin atoms predicted to have exotic uses in electronics.

Method uses DNA, nanoparticles and lithography to make optically active structures

01/19/2018  Technique could lead to new classes of materials that can bend light, such as for those used in cloaking devices.

Silicon photonics has reached its tipping point

01/19/2018  Silicon photonics is still a small market today, with sales at die level estimated to be US$30 million in 2016. However, it has big promise, with a 2025 market value of US$560 million at chip level and almost US$4 billion at transceiver level.

LCD TV panel demand expected to go through a correction in first quarter of 2018

01/18/2018  Demand for liquid crystal display (LCD) panels from South Korean and Chinese TV makers was strong in the fourth quarter of 2017, but implementation of their panel purchasing strategies for the first quarter of 2018 may result in a correction as demand expectations change.

SkyWater Technology Foundry appoints Steve Wold as Chief Financial Officer

01/18/2018  SkyWater Technology Foundry, the industry's most advanced U.S.-based and U.S.-owned trusted foundry, announced today that it has appointed Steve Wold as Chief Financial Officer.

Ultra-thin memory storage device paves way for more powerful computing

01/18/2018  A team of electrical engineers at The University of Texas at Austin, in collaboration with Peking University scientists, has developed the thinnest memory storage device with dense memory capacity, paving the way for faster, smaller and smarter computer chips for everything from consumer electronics to big data to brain-inspired computing.

X-rays reveal 'handedness' in swirling electric vortices

01/18/2018  Scientists at Berkeley Lab study exotic material's properties, which could make possible a new form of data storage.

NAURA Akrion Inc. acquired Akrion’s surface preparation business

01/18/2018  Beijing NAURA Microelectronics Equipment Co.,Ltd. and Akrion Systems LLC today jointly announced that the previously announced acquisition by NAURA has been completed.

2018FLEX highlights opportunities, advances in flexible hybrid electronics

01/18/2018  2018FLEX, the Flexible Hybrid Electronics (FHE) Conference and Exhibition, will bring together more than 600 experts from around the world for business-critical insights and the latest technology in both flexible electronics and MEMS and sensors.

Peregrine Semiconductor is now pSemi

01/17/2018  Peregrine Semiconductor Corporation today announces its corporate name change to pSemi™ Corporation, a Murata company focused on semiconductor integration.

Everspin begins 40nm STT-MRAM volume production

01/17/2018  Everspin Technologies, Inc., a developer and manufacturer of discrete and embedded MRAM, today announced the Company recorded revenue for its first 40nm 256Mb STT-MRAM products in the fourth quarter of 2017 and is in the process of ramping its volume production in 2018

ASML announces appointment of new CFO to the Board of Management

01/17/2018  ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management.

Littelfuse completes acquisition of IXYS Corporation

01/17/2018  Littelfuse, Inc. today announced the completion of its acquisition of IXYS Corporation.

2018 will see first uses of 8K resolution display

01/16/2018  As the demand for super-large TV displays grow, the need for higher resolution is set to increase, seeing the first uses of 8K display in 2018, according to IHS Markit.

Picosun provides 300mm ALD technology for green power electronics

01/16/2018  Picosun Oy, a supplier of Atomic Layer Deposition (ALD) thin film coating technology for global industries, partners with STMicroelectronics S.r.l. to develop the next generation 300mm production solutions for advanced power electronics.

Researchers propose new gas-solid reaction for high-speed perovskite photodetector

01/16/2018  The gas-solid reaction method provides a full coverage of the perovskite film and avoids the damage from the organic solvent, which is beneficial for the light capture and electrons transportation, resulting in a faster response time and stability for the perovskite photodetector.

Expanded SiC Schottky diode line from Littelfuse reduces switching losses, increases efficiency and robustness

01/16/2018  Littelfuse, Inc. today introduced four new series of 1200V silicon carbide (SiC) Schottky Diodes from its GEN2 product family, which was originally released in May 2017.

Advancing the path to organic electronics beyond cell phone screens

01/12/2018  A discovery by an international team of researchers from Princeton University, the Georgia Institute of Technology and Humboldt University in Berlin points the way to more widespread use of an advanced technology generally known as organic electronics.

MORE ANALYSIS & FEATURES

RESOURCE GUIDE - Get Listed


Latest Article

OEM Group announces post-dice clean solutions for plasma and laser dicing methods

09/28/2017  OEM Group announced today a post-dice clean solution on the proven Cintillio Batch Spray platform following plasma and laser dicing methods.



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Yield Engineering Systems, Inc.: http://www.yieldengineering.com
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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers

WEBCASTS

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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NEW PRODUCTS

Radiant Vision Systems announces new automated visual inspection system
11/06/2017Radiant Vision Systems, a provider of high-resolution imaging solutions for automated visual analysis of devices and surfaces, an...
SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....