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SEMI appoints Ajit Manocha as president and CEO
02/21/2017SEMI today announced the appointment of Ajit Manocha as its president and CEO....
Intel continues to drive semiconductor industry R&D spending
02/16/2017Among Top-10 R&D spenders, Intel accounted for 36% of R&D outlays....
Taiwan maintains largest share of global IC wafer fab capacity
02/23/2017South Korea narrows gap with Taiwan; China shows biggest increase, accounts for nearly 11%....
SiPs Simplify Wireless IoT Design
02/16/2017System-in-package solutions, running a proven software stack, are easing wireless design for Internet of Things end node applications....

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NEWS ANALYSIS & FEATURES


Semitrex changes name to Helix Semiconductors

02/24/2017  Fabless power semiconductor company Semitrex announced today that it has changed its name to Helix Semiconductors.

Researchers pave the way for ionotronic nanodevices

02/24/2017  Discovery helps develop a new kind of electrically switchable memories.

Versum Materials names Edward Shober as senior VP of Materials

02/24/2017  Versum Materials, Inc., a materials supplier to the semiconductor industry, announced today that Edward “Ed” Shober has been appointed to the position of senior vice president of its Materials segment.

NXP joins Auto-ISAC to collaborate on security challenges of connected cars

02/24/2017  NXP Semiconductors N.V., the world's largest supplier of automotive semiconductors, announced that it has joined the Automotive Information Sharing and Analysis Center (Auto-ISAC).

Picosun and Hitachi MECRALD Process

02/24/2017  ALD fab films at lower temperatures.

Gigaphoton extends the lifetime of collector mirrors in EUV pilot light sources

02/23/2017  Company demonstrates that magnetic-field debris mitigation, a new technology, extends collector mirror lifetime in Pilot light source for EUV lithography mass production plants, a major step towards eliminating bottlenecks.

STMicroelectronics works with Sigfox to extend plug-and-play IoT security to industrial and consumer device makers

02/23/2017  STMicroelectronics (NYSE: STM) announced the expansion of its STSAFE family of secure elements with the introduction of a powerful plug-and-play solution that provides state-of-the-art security features to devices connected to the Sigfox low-power wide-area network (LPWAN).

LG Innotek unveils the world's first 70mW UV-C LED

02/23/2017  LG Innotek today announced that the company has developed the world's first 70mw UV-C LED for sterilization applications.

KLA-Tencor introduces new metrology systems for leading-edge integrated circuit device technologies

02/23/2017  KLA-Tencor Corporation today introduced four innovative metrology systems that enable development and high-volume manufacturing of sub-10nm integrated circuit (IC) devices.

Microhotplates for a smart gas sensor

02/22/2017  Toyohashi University of Technology researchers have developed microhotplates (MHPs), in which an SU-8 photoresist was employed as a supporting material. The MHP can moderate the requirement for the layout design and the process condition of integrated smart gas sensors.

Improved polymer and new assembly method for ultra-conformable 'electronic tattoo' devices

02/22/2017  Process uses household inkjet printer without soldering to create 750nm-thin elastomeric sheet.

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

North American semiconductor equipment industry posts January 2017 billings

02/22/2017  North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in January 2017 (three-month average basis).

New window into the nanoworld

02/21/2017  Scientists combine the ultra-fast with the ultra-small to pioneer microscopy at terahertz frequencies.

Flemish government increases financial support of imec

02/21/2017  Today, the research and innovation hub in nanoelectronics and digital technology imec, and the Flemish Government announced a new, 5-year strategic commitment that aims at strengthening the pioneering role of Flanders' renowned research hub.

GlobalFoundries announces availability of 45nm RF SOI

02/21/2017  Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations.

Brooks Instrument names Mohamed Saleem as new Chief Technology Officer

02/21/2017  Mohamed Saleem has joined Brooks Instrument as the company's new chief technology officer (CTO), where he will oversee its California-based technology development center.

Breakthrough with a chain of gold atoms

02/17/2017  In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport.

'Lossless' metamaterial could boost efficiency of lasers and other light-based devices

02/17/2017  Engineers at the University of California San Diego have developed a material that could reduce signal losses in photonic devices.

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Latest Article

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.



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VIDEOS

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EVENTS

LithoVision 2017
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http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
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http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
CMC Conference 2017
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http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
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ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

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