U.S. trade tensions with China hit fever pitch
03/21/2018Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industr...
Trump blocks Broadcom's takeover of Qualcomm
03/13/2018Qualcomm Incorporated received a Presidential Order to immediately and permanently abandon the proposed takeover of Qualcomm by Broadcom Limited....
Mechanism and improvements of Cu voids under via bottom
03/22/2018This work explores the effect of underlying metallic alloys and the influence of Cu loss under via bottom after dry etching and wet cleaning proc...
The ConFab 2018 announces conference agenda and speakers
03/16/2018Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests....

Connect with Industry Experts at The ConFab 2018!

May 20 – 23, 2018





Synopsys acquires Silicon and Beyond Private Limited

03/22/2018  Synopsys, Inc. today announced it has acquired Silicon and Beyond Private Limited, a provider of high-speed SerDes technology used in data intensive applications such as machine learning, cloud computing, and networking.

Golden touch: Next-gen optical disk to solve data storage challenge

03/22/2018  New technology offer cost-efficient and sustainable solution to global data storage challenge, while enabling the pivot from Big Data to Long Data and opening new realms of scientific discovery.

Electric textile lights a lamp when stretched

03/22/2018  Working up a sweat from carrying a heavy load? That is when the textile works at its best. Swedish researchers have developed a fabric that converts kinetic energy into electric power. The greater the load applied to the textile and the wetter it becomes the more electricity it generates.

High-performance, cost-effective, thin-film solar cell technology provides an attractive source of portable and mobile power

03/22/2018  Magnolia Optical Technology, Inc. announced that it is working with the Defense Advanced Research Projects Agency (DARPA) under the Phase II SBIR Program for Development of High-Performance Thin-Film Solar Cells for Portable Power Applications.

"Technology, Circuits & Systems for Smart Living" theme for 2018 Symposia on VLSI Technology & Circuits

03/21/2018  Bringing together a technical program that encompasses 'big integration' of a number of critical industry trends -- machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing -- the 2018 Symposia on VLSI Technology & Circuits will showcase a convergence of technologies needed for 'smart living.'

Samsung Electronics diversifies its 8-inch foundry offerings with new RF/IoT and fingerprint technology solutions

03/21/2018  Samsung Electronics Co., Ltd. today announced more value added 8-inch (200mm) technology solutions for its foundry customers.

'Candy cane' polymer weave could power future functional fabrics and devices

03/21/2018  If scientists are going to deliver on the promise of implantable artificial organs or clothing that dries itself, they'll first need to solve the problem of inflexible batteries that run out of juice too quickly. Today, researchers report that they've developed a new material by weaving two polymers together in a way that increases charge storage capacity.

Automotive chip manufacturing in Japan drives innovation

03/21/2018  In Tokyo, Shanghai, Moscow, London, Paris or New York – wherever you are in the world –Japanese vehicles passing by on the roadways are a common sight.

RIT researchers improve fabrication process of nano-structures for electronic devices

03/21/2018  Use of indium gallium phosphide with I-MacEtch processing shows promise for more cost effective fabrication and increased performance in devices from photonics to telecommunications.

SEMICON West 2018 to spotlight smart technologies, workforce development

03/20/2018  SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.

CEA shows path to creating building blocks of quantum processors

03/20/2018  CEA-Leti, a French technology research institute of the CEA and Inac, a joint fundamental research institute between the CEA and the University Grenoble Alpes, today announced a breakthrough towards large-scale fabrication of quantum bits, or qubits, the elementary bricks of future quantum processors.

GLOBALFOUNDRIES launches RF ecosystem program to accelerate time-to-market for wireless connectivity, radar and 5G applications

03/20/2018  GLOBALFOUNDRIES today announced a new ecosystem partner program, called RFWave, designed to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks.

UnitySC acquires HSEB Dresden GMBH

03/20/2018  Following the acquisition, the new entity's extended line of leading-edge process control solutions will provide a unique and essential inspection and metrology capability to semiconductor manufacturers.

Everspin signs long-term patent license agreement with Alps Electric

03/19/2018  Under the agreement, Alps and Everspin will mutually grant licenses to magnetoresistive-based 3D sensor patent portfolios for magnetoresistive sensor products.

SPONSORED: At LED Expo Thailand 2018, exhibition space is filling up fast. Hurry, book your space now!

03/19/2018  The 6th annual LED Expo Thailand 2018, which is aimed at bringing together LED & lighting industry with buyers, specialists and suppliers to the Challenger 1, IMPACT Exhibition Center in Bangkok, Thailand on May 10-12, 2018.

Unexpected effect could lead to lower-power memory, computing devices

03/19/2018  An unexpected phenomenon known as zero field switching (ZFS) could lead to smaller, lower-power memory and computing devices than presently possible.

A future colorfully lit by mystifying physics of paint-on semiconductors

03/19/2018  Some novel materials that sound too good to be true turn out to be true and good. An emergent class of semiconductors, which could affordably light up our future with nuanced colors emanating from lasers, lamps, and even window glass, could be the latest example.

Broadcom withdraws offer to acquire Qualcomm

03/16/2018  The Trump administration issued a Presidential Order this week to block the acquisition.

Synopsys and industry technologists to address the path to 2nm SoC design

03/16/2018  Synopsys, Inc. today announced it is hosting an advanced-technology panel on "EUV, High-NA, Metallurgy and FinFET++ - Where We Go from Here for Next-Generation Design" at the Synopsys Users Group (SNUG) Silicon Valley event on Thursday, March 22.



Latest Article

Understanding ALD, MLD and SAMs as they enter the fab

03/01/2018  As the world of advanced manufacturing enters the sub-nanometer scale era, it is clear that ALD, MLD and SAM represent viable options for delivering the required few-atoms-thick layers required with uniformity, conformality, and purity.


Featured Supplier

Indium Corporation:



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers


3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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CMC Conference 2018
Phoenix, AZ
April 26, 2018 - April 27, 2018
LED Expo Thailand
Bangkok, Thailand
May 10, 2018 - May 12, 2018

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Radiant Vision Systems announces new automated visual inspection system
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SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
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