JSAP research highlights - Power electronics: Silicon carbide gains traction
10/08/2015Research reported in the Japanese Journal of Applied Physics by researchers at Mitsubishi Electric Corporation describes the...
Monolithic 3D - Game-Changing 2.0 at IEEE S3S
10/05/2015The path to alternative scaling is now open....
First circularly polarized light detector on a silicon chip
10/01/2015Invention of the first integrated circularly polarized light detector on a silicon chip opens the door for development of small, portable ...
Novati Technologies launches advanced integrated sensor platform
09/30/2015Novati Technologies Inc. announced the availability of an advanced Integrated Sensor Platform, placing a wide variety of sensors onto mu...
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New ams fab going to Marcy, NY: Startups and small electronics companies spent $78.3 billion on semiconductors in 2014; Pure-play foundry sales forecast to grow to all-time high in 4Q15; University of Colorado and SRC research accelerates microscopic imaging for next-generation nano electronics

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Upcoming Webcasts
September 2015 (Date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are ...
September 2015 (Date and time TBD) EUV lithography has been under intense development for years and appears to be ...
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mCube introduces smallest and most power-efficient accelerometer for wearables and Internet of Moving Things

10/08/2015  mCube announced the sampling of its new MC3635 3-axis accelerometer featuring the industry's lowest power consumption and a microscopic 1.6x1.6 mm Land Grid Array package.

Two polymer-blend could boost efficiency of LEDs

10/08/2015  A blend of two polymers can be used to boost the efficiency of LEDs, according to a research study published in the journal Applied Materials Today.

Organic semiconductors get weird at the edge: University of British Columbia research

10/08/2015  As the push for tinier and faster electronics continues, a new finding by University of British Columbia scientists could help inform the design of the next generation of cheaper, more efficient devices.

Leti joins GLOBALFOUNDRIES' ecosystem partners supporting 22FDX platform

10/07/2015  CEA-Leti announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES' 22FDX (TM) technology platform.

Imec and Cadence complete tapeout of first 5nm test chip

10/07/2015  Nano-electronics research center imec and Cadence Design Systems, Inc. today announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) and 193 immersion (193i) lithography.

SEMI announces FlexTech Alliance as first Strategic Association Partner

10/07/2015  SEMI announced today that FlexTech Alliance has become the first SEMI Strategic (Association) Partner.

DCG Systems introduces Meridian M for static optical failure analysis

10/06/2015  DCG Systems announced the release of the Meridian M (TM) system for isolation of routine and challenging electrical faults at the wafer level.

Entegris introduces SmartStack 300 mm contactless horizontal wafer shipper

10/06/2015  Entegris, Inc. has expanded its wafer shipper family of products with the SmartStack (R) 300 mm Contactless Horizontal Wafer Shipper.

Mentor Graphics Tackles SoC Design Challenges

10/06/2015  System-on-a-chip designs are complex endeavors, and they are growing more complicated by the day. Mentor Graphics is cognizant of the many challenges in SoC design and is working to ease the troubles of chip designers.

JEOL introduces the JSM-6000PLUS NeoScope

10/06/2015  JEOL's benchtop SEM makes it possible to bring basic high resolution imaging and analysis features of a full-sized Scanning Electron Microscope into the lab.

Applied Materials Prospers in CMP, Deposition, Etch

10/06/2015  The company, founded in 1967, has a Silicon Systems Group which last year accounted for 66 percent of Applied's revenue. The SSG includes a number of other wafer fab equipment categories, such as epitaxy, ion implantation, metrology and wafer inspection, rapid thermal processing, and wet cleaning.

Dielectric precursors market outlook Is $230M in 2015

10/06/2015  The 2015 market for dielectric precursors is expected to total $230M, of which over $45M is attributed to low-k dielectrics.

Altatech adds new high-speed inspection system dedicated to ultra-thin substrates for 3D applications

10/05/2015  Altatech announced the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS, and mobile technologies.

Global semiconductor sales decrease slightly in August

10/05/2015  The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors reached $27.7 billion for the month of August 2015.




Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers



September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:


September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Trends in Flexible and Printed Electronics

October 2015 (Date and time TBD)

Printed electronics are at a pivotal moment. There are not only tremendous opportunities for innovation and growth in new verticals and industries, but a new way of thinking about how electronics are made, combining techniques and materials used by printed electronics with those of 3D printing. Presenters will review printed electronics and discuss future directions, from smart labels and wearables, to trends and technologies that enable the printing of IoT devices with embedded sensors, transistors, displays, batteries and memory.

Sponsored By:

More Webcasts


International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015


Greenpeak and Dusan Launch Smart Parking system
09/14/2015GreenPeak Technologies and Dusun Electron Ltd recently announced a partnership with the launch of their first Smart City assisted parking application tha...
Greenpeak and Dusan Launch Smart Parking system
09/14/2015GreenPeak Technologies and Dusun Electron Ltd recently announced a partnership with the launch of their first Smart City assisted parking application tha...
Entegris expands CMP filtration technology solutions and research, analytical and manufacturing capabilities
09/04/2015The Entegris filter platform using NMB media now includes the Planargard bulk, Solaris point...