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Rhines Expounds on the Deconsolidation of the Semiconductor Industry
04/27/2016“By 2020, we are all going to work for the same company,” Wally Rhines, chairman and chief executive officer of Mentor Graphics,...
IoT: Powering small devices
04/22/2016Are the power solutions the IoT needs arriving quickly enough?...
AMOLED growth is a bright spot for the display industry
04/28/2016Active matrix organic light-emitting diode (AMOLED) displays are rising fast, thanks to lowering costs, wider use in end-market consumer electron...
Apple drove entire foundry sales increase at TSMC in 2015
04/26/2016Without Apple, TSMC’s 2015 foundry sales would have dropped by 2% as compared to a 6% increase....


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Tech Papers
Upcoming Webcasts
Advanced Packaging: A Changing Landscape Rife with Opportunities
May 10, 2016 at 1 PM ET / Sponsored by Brewer Science Die stacking enables better chip performance...
Trends in MEMS
May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment MEMS have quite different process...
Fan-Out Wafer Level Packaging
May 2016 / Sponsored by Zeta Instruments Wafer level...

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NEWS ANALYSIS & FEATURES


Many mixes to match litho apps

04/29/2016  The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?

Market for Analog ICs/MEMS/Sensors and Supply Chain Opportunities

04/29/2016  The demand for smartphones and other portable devices that need efficient power management is driving the analog IC market, as is the Internet of Things (IoT) and the MEMS/sensors devices that enable it.

Global Semiconductor Packaging Materials Market to grow at 4.79% CAGR from 2016-2020

04/29/2016  Research and Markets’ recent report, "Global Semiconductor Packaging Materials Market 2016-2020", expects the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period of 2016-2020.

Cypress CEO to step down

04/28/2016  Cypress Semiconductor Corp. (NASDAQ: CY) today announced that its CEO, T.J. Rodgers, will step down this week and that a search—both internal and external—would be launched to replace him.

Hybrid nanoantennas -- next-generation platform for ultradense data recording

04/28/2016  A group of scientists from ITMO University in Saint Petersburg has put forward a new approach to effective manipulation of light at the nanoscale based on hybrid metal-dielectric nanoantennas.

University of Illinois researchers create 1-step graphene patterning method

04/28/2016  Researchers from the University of Illinois at Urbana-Champaign have developed a one-step, facile method to pattern graphene by using stencil mask and oxygen plasma reactive-ion etching, and subsequent polymer-free direct transfer to flexible substrates.

Cypress to acquire Broadcom's Wireless of Internet of Things business

04/28/2016  Cypress Semiconductor Corp. (Nasdaq: CY) and Broadcom Limited (Nasdaq: AVGO) today announced the signing of a definitive agreement under which Cypress will acquire Broadcom's Wireless Internet of Things (IoT) business and related assets in an all-cash transaction valued at $550 million.

Cartamundi, imec and Holst Centre win "Best Product" award at Printed Electronics Europe

04/27/2016  Cartamundi, imec and Holst Centre (set up by imec and TNO) are proud to announce to have just won the "Best Product" - Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi's playing cards.

NREL finds nanotube semiconductors well-suited for PV systems

04/27/2016  Researchers at the Energy Department's National Renewable Energy Laboratory (NREL) discovered single-walled carbon nanotube semiconductors could be favorable for photovoltaic systems because they can potentially convert sunlight to electricity or fuels without losing much energy.

Leti's CoolCube 3D Transistor Stacking Improves with Qualcomm Help

04/27/2016  Collaborating to build out design to fabrication ecosystem.

NREL theory establishes a path to high-performance 2-D semiconductor devices

04/26/2016  Researchers at the Energy Department's National Renewable Energy Laboratory (NREL) have uncovered a way to overcome a principal obstacle in using two-dimensional (2D) semiconductors in electronic and optoelectronic devices.

Spintronic majority gates: A new paradigm for scaling

04/26/2016  Spintronic majority gates could revolutionize circuit design. They will completely change the paradigm – both at device and circuit level – in how to approach scaling.

ams AG announces $77M intellectual property judgment against Intersil Corporation

04/26/2016  Court upholds ruling on trade secret and patent infringement suit.

Latest advancements in sensor technology examined at SEMI European MEMS Summit

04/25/2016  SEMI today announced the second annual edition of the SEMI European MEMS Summit, dedicated to MEMS and sensors, to be held on September 15-16.

Cadence CFO Geoff Ribar to retire in March 2017

04/25/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that, Geoff Ribar, senior vice president and chief financial officer, who joined the company in 2010, has decided to retire from Cadence effective March 31, 2017.

MagnaChip begins delivery of e-Compass sensors in China

04/25/2016  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it is now shipping its e-Compass sensor (MXG2320) in China to a major smartphone manufacturer that is targeting mobile markets in China and India.

Rare Earth atoms see the light

04/25/2016  Physicist Dirk Bouwmeester discovers a promising route for combined optical and solid state-based quantum information processing.

The human-machine interface: Automotive touch screens on the rise

04/25/2016  With consumers becoming increasingly comfortable using smartphones and tablet PCs, touch screens are now increasingly making their way into their vehicles, too.

Indium Corporation announces Andreas Karch as Regional Technical Manager

04/25/2016  Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.

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FEATURED INNOVATOR

QuantumClean: Process Improvement Through Consistently Cleaner Parts

QuantumClean is the global leader in high-purity outsourced process tool parts cleaning, performance coatings, refurbishment and analytical & engineering services to the semiconductor, solar and LED industries. QuantumClean operates on the frontier of the sub-20nm high-purity semiconductor parts cleaning market through leading-edge technologies, resources and expertise.
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Latest Article

SEMICON West 2016: New high-speed EtherCAT mass flow controllers from Brooks Instrument

04/14/2016  Celebrating its 70th anniversary, Brooks Instrument will be exhibiting at SEMICON West 2016 with new mass flow controllers (MFC) equipped with the high-speed EtherCAT interface, along with a broad range of other mass flow meters, controllers, vaporizers and capacitance manometers for semiconductor manufacturing.



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WEBCASTS

Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

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Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

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Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

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May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
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June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
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San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

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Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
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Versatile high throughput SEM from JEOL
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