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Cautious expectations amid a slow-growth global economy
02/04/2016The health of the IC industry is increasingly tied to the health of the worldwide economy. Rarely can there be strong IC market growth without at...
Cadence Debuts Product for Reducing Test Time, Costs
02/02/2016Cadence Design Systems is introducing the Modus Test Solution, a product that it touts as capable of reducing IC testing time and test costs, while ...
What's happening in the China market?
02/05/2016A brief recap of China market news for January 2016....
Apple products are driving market growth for MEMS microphones
02/03/2016The popularity of Apple’s iPhone 6S and other products is boosting the microelectromechanical-systems (MEMS) microphones market to a comp...
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Pete Singer talks with Ravi Laxman and Ravi Gukathasan from Digital Specialty Chemicals about the company's recent funding from Intel.

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Trends in MEMS
February 2016 MEMS have quite different process and material requirements compared to mainstream microprocessor and ...
2.5D and 3D Integration
March 2016 Die stacking enables better chip performance in a small form factor, meeting the ...

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NEWS ANALYSIS & FEATURES


TSMC approved to build 12-in wafer fab in China

02/05/2016  Taiwan's Investment Commission on Wednesday gave Taiwan Semiconductor Manufacturing Co. (TSMC) approval to build its first 12-inch wafer fab in mainland China.

The iron stepping stones to better wearable tech without semiconductors

02/05/2016  The road to more versatile wearable technology is dotted with iron. Specifically, quantum dots of iron arranged on boron nitride nanotubes (BNNTs).

Panel level packaging: The high volume manufacturing roadmap has yet to be built

02/05/2016  When will the panel industry take off? How will it evolve?

ON Semiconductor extends tender offer to acquire Fairchild Semiconductor

02/04/2016  Extension of tender offer pursuant to previously executed merger agreement.

Researchers develop hack-proof RFID chips

02/04/2016  New technology could secure credit cards, key cards, and pallets of goods in warehouses.

Scientists guide gold nanoparticles to form 'diamond' superlattices

02/04/2016  Scientists have devised a way to trap and arrange nanoparticles in a way that mimics the crystalline structure of diamond. The achievement of this complex yet elegant arrangement may open a path to new materials that take advantage of the optical and mechanical properties of this crystalline structure for applications such as optical transistors, color-changing materials, and lightweight yet tough materials.

Microchip Technology appoints Ganesh Moorthy to President and COO

02/04/2016  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that its Board of Directors has appointed Ganesh Moorthy as President and Chief Operating Officer effective today.

Researchers discover new phase of boron nitride and a new way to create pure c-BN

02/03/2016  Researchers at North Carolina State University have discovered a new phase of the material boron nitride (Q-BN), which has potential applications for both manufacturing tools and electronic displays.

Gartner says worldwide wearable devices sales to grow 18.4 percent in 2016

02/03/2016  Gartner, Inc. forecasts that 274.6 million wearable electronic devices will be sold worldwide in 2016, an increase of 18.4 percent from 232.0 million units in 2015.

Self-calibrated 10 Mbit/s phase modulator exceeds state-of-the-art performance

02/03/2016  At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a self-calibrated high-speed (10Mbits/s) phase modulator achieving an excellent Error Vector Magnitude (EVM) of -37dB at 10.25 GHz.

Imec and Vrije Universiteit Brussel present small, low-cost, low-power chip for multi-gigabit 60GHz communication

02/03/2016  At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a four-antenna path beamforming transceiver for 60GHz multi Gb/s communication in 28nm CMOS technology.

Presto Engineering expands turnkey IC production management services with three new operations in Asia

02/02/2016  Presto Engineering Inc. announced this week that it has significantly expanded its turnkey capabilities with the opening of two new manufacturing hubs and a world-wide logistics center in Asia.

Spin dynamics in an atomically thin semiconductor

02/02/2016  Researchers at the National University of Singapore and Yale-NUS College have established the mechanisms for spin motion in molybdenum disulfide, an emerging 2-dimensional material.

Nova selected by a leading foundry for its most advanced 10nm and 7nm FinFET nodes

02/02/2016  Nova Measuring Instruments, a provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today that a leading foundry recently selected Nova's optical and X-ray metrology solutions for multiple process steps.

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QuantumClean: Process Improvement Through Consistently Cleaner Parts

QuantumClean is the global leader in high-purity outsourced process tool parts cleaning, performance coatings, refurbishment and analytical & engineering services to the semiconductor, solar and LED industries. QuantumClean operates on the frontier of the sub-20nm high-purity semiconductor parts cleaning market through leading-edge technologies, resources and expertise.
Sponsored By: QuantumClean

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Nova selected by a leading foundry for its most advanced 10nm and 7nm FinFET nodes

02/02/2016  Nova Measuring Instruments, a provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today that a leading foundry recently selected Nova's optical and X-ray metrology solutions for multiple process steps.



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WEBCASTS

Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

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March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

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Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

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SEMICON China 2016
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http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
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May 22, 2016 - May 27, 2016

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