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Deep Learning Could Boost Yields, Increase Revenues
03/23/2017Deep learning is “a shiny new hammer” that chip industry may figure out how to use....
U.S. companies still hold largest share of fabless company IC sales
03/16/2017Largest fabless IC marketshare increase has come from Chinese suppliers, who now hold a 10% share....
European SEMI Award honors advanced packaging technologists
03/23/2017At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016....
The ConFab 2017 announces leading semiconductor industry keynotes
03/14/2017The ConFab announces keynotes in the May 14-17 event being held at the Hotel del Coronado in San Diego....

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NEWS ANALYSIS & FEATURES


Intel elects two new members to Board of Directors

03/23/2017  Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to Intel’s board of directors.

Mentor Graphics Team Receives the Harvey Rosten Award for Thermal Heatsink Optimization Methodology

03/23/2017  Mentor Graphics Corporation today announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics.

Microsemi to close China manufacturing facility

03/23/2017  Microsemi Corporation, a provider of semiconductor solutions, today announced the planned closure of its manufacturing facility in China.

Researchers discover new type of memory effect in transition metal oxides

03/23/2017  Dr. Amos Sharoni of Bar-Ilan University's Department of Physics, and Institute of Nanotechnology and Advanced Materials (BINA), has now uncovered a new kind of memory effect, unrelated to memory effects previously reported.

Scientists discover new 'boat' form of promising semiconductor GeSe

03/23/2017  Uncommon form attenuates semiconductor's band gap size.

Samsung and eSilicon taped-out 14nm network processor with Rambus 28G SerDes solution

03/22/2017  Samsung Electronics Co., Ltd.today announced a successful network processor tape-out based on Samsung’s 14LPP (Low-Power Plus) process technology in close collaboration with eSilicon and Rambus.

Linde Invests Over EUR 110M in China to Strengthen Position as Supplier of Choice for Electronics Manufacturers

03/22/2017  Gases and engineering company The Linde Group, through its electronics gases joint venture in China, Linde LienHwa, is expanding its commitment to China and the Asia Pacific region through investments of over EUR 110 million.

MicroLEDs for displays: How we can make it happen

03/22/2017  Many large companies and startups are currently working on microLED technologies for display applications: from LED makers such as Epistar, Nichia or Osram to display makers like AUO, BOE or CSOT and OEMs such as Apple or Facebook/Oculus.

Imec scientist awarded ERC Advanced Grant to develop material stacks for video-rate holography

03/22/2017  Imec announces that Jan Genoe, one of its distinguished scientists, has been awarded an ERC Advanced Grant.

Unexpected, star-spangled find may lead to advanced electronics

03/20/2017  For several years, a team of researchers at The University of Texas at Dallas has investigated various materials in search of those whose electrical properties might make them suitable for small, energy-efficient transistors to power next-generation electronic devices.

Peregrine Semiconductor acquires Arctic Sand Technologies

03/20/2017  Peregrine Semiconductor Corp., a Murata company and the founder of RF SOI (silicon on insulator), today announces the acquisition of Arctic Sand Technologies.

SEMI headquarters relocates

03/20/2017  SEMI today announced that it has moved its headquarters office to Milpitas, Calif.

Semiconductor Industry Association announces support of House tax reform blueprint

03/17/2017  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, this week announced its support for the House "Better Way" corporate tax reform proposal as an appropriate starting point for reform.

Nano-polycrystalline film leads to stronger magnetism compared to single-crystal films

03/17/2017  Oxygen defects like nanopillars enhanced magnetic and magnetooptical response of STF films.

UC researchers use gold coating to control luminescence of nanowires

03/17/2017  University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper.

North American semiconductor equipment industry posts February 2017 billings

03/17/2017  North America-based manufacturers of semiconductor equipment posted $1.97 billion in billings worldwide in February 2017 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

AIM Photonics welcomes Coventor as newest member

03/16/2017  US-backed initiative taps process modeling specialist to enable manufacturing of high-yield, high-performance integrated photonic designs.

Synopsys' IC Compiler II certified for TSMC's 12nm process technology

03/16/2017  Synopsys, Inc. today announced that TSMC has certified the complete suite of products in the Synopsys Galaxy Design Platform for the most current version of 12nm FinFET process technology.

Electro-optical switch transmits data at record-low temperatures

03/16/2017  A silicon optical switch newly developed at Sandia National Laboratories is the first to transmit up to 10 gigabits per second of data at temperatures just a few degrees above absolute zero.

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Latest Article

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.



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Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

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Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

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EVENTS

CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

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Tektronix introduces Keithley S540 power semiconductor test system
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