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Advancements in spintronics
09/25/2017Applications now include nanoscale Spintronics sensors that further enhance the areal density of hard disk drives, through MRAMs that are seriously being considered to repla...
Laser marking meets diverse challenges in fab and packaging
09/22/2017The basics of laser marking are reviewed, as well as current and emerging laser technologies....
DSA and EUV: Complementary technologies to enable fine- pitch lithography
09/22/2017DSA and EUV should be envisioned as complementary, not competing, techniques that will eventually become mainstream for fine-pi...
Leading-edge paves the way for pure-play foundry growth
09/20/2017Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries....

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May 20 – 23, 2018


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Tech Papers
Upcoming Webcasts
3D NAND: Trends in Processes, Circuits
October 3, 2017 at 1 p.m. ET Conventional planar flash memory technology is approaching critical scaling limitations that...
Materials
Date and time TBD Success in electronics manufacturing increasingly relies on the materials used in production and packaging....

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NEWS ANALYSIS & FEATURES


Cree names Gregg Lowe as CEO

09/25/2017  Mr. Lowe succeeds Chuck Swoboda, per the transition plan announced in May.

Cypress appoints Jeff Owens to Board of Directors

09/25/2017  Cypress Semiconductor Corp. today announced the appointment of Jeffrey J. Owens to its board of directors.

Measuring metals, dielectrics, resists and CDs in advanced packaging

09/25/2017  A new system combines acoustic, optical and reflectometric techniques to enable measurement of metals, dielectrics, resists and critical dimensions on a single platform.

Samsung certifies Synopsys Design Platform for 28nm FD-SOI process technology

09/25/2017  Synopsys, Inc. today announced that the Synopsys Design Platform has been fully certified for use on Samsung Foundry's 28FDS (FD-SOI) process technology.

Applied Materials focuses on enabling artificial intelligence era at 2017 Analyst Day

09/22/2017  Applied Materials, Inc. will explore the future of computing in the era of artificial intelligence (A.I.) at its 2017 Analyst Day on Wednesday, September 27 in New York.

North American semiconductor equipment industry posts August 2017 billings 

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

Synopsys Design Platform certified by GLOBALFOUNDRIES for 22nm FD-SOI process technology

09/21/2017  GF worked closely with Synopsys to complete the rigorous certification process of the Synopsys Design Platform on our 22FDX process platform.

Scientists make atoms-thick Post-It notes for solar cells and circuits

09/21/2017  A study led by UChicago researchers describes an innovative method to make stacks of semiconductors just a few atoms thick. The technique offers scientists and engineers a simple, cost-effective method to make thin, uniform layers of these materials, which could expand capabilities for devices from solar cells to cell phones.

Application of air-sensitive semiconductors in nanoelectronics

09/21/2017  2-D semiconductor gallium selenide in encapsulated nanoelectronic devices.

Leti develops proof of concept to test wireless systems in aircraft

09/20/2017  Leti, a technology research institute of CEA Tech, announced today it has developed a methodology for testing high-speed wireless communications on airplanes that allows different system deployments in cabins, and assesses wireless devices before they are installed.

SEMICON Europa moves to Munich: Empowering innovation and shaping the value chain

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

Seoul Semiconductor files patent litigation for infringement of 12 Acrich patents

09/19/2017  Seoul Semiconductor Co., Ltd. announced on Sept. 19, 2017 that it has filed a patent infringement lawsuit, together with its affiliate, Seoul Viosys Co., Ltd., against Archipelago Lighting, Inc. in the U.S. District Court for the Central District of California.

Graphene and other carbon nanomaterials can replace scarce metals

09/19/2017  Scarce metals are found in a wide range of everyday objects around us. They are complicated to extract, difficult to recycle and so rare that several of them have become "conflict minerals" which can promote conflicts and oppression. A survey at Chalmers University of Technology now shows that there are potential technology-based solutions that can replace many of the metals with carbon nanomaterials, such as graphene.

GLOBALFOUNDRIES and Soitec enter into long-term supply agreement on FD-SOI wafers

09/19/2017  GLOBALFOUNDRIES and Soitec today announced that they have entered into a five-year agreement to ensure the volume supply of state-of-the-art fully depleted silicon-on-insulator (FD-SOI) wafers.

SEMI and SAE announce strategic partnership

09/19/2017  The future of smart, self-driving cars means massive change for electronics suppliers, from advanced internal networks, to 5G communications with the road ahead − and even AI drivers' licenses.

Samsung Electronics joins Semiconductor Research Corporation on research consortium

09/19/2017  Semiconductor Research Corporation (SRC), today announced that Samsung Electronics Company Ltd. (Samsung), one of the world's largest chipmakers, has signed an agreement to join SRC's research consortium. Samsung will participate in two SRC platforms – the New Science Team (NST) project and the Global Research Collaboration (GRC) program.

DARPA calls for Monolithic 3D – 3DSoC

09/19/2017  Learn all about Monolithic 3D at IEEE S3S.

Cadence recognized with three TSMC Partner of the Year awards

09/18/2017  Cadence Design Systems, Inc. today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform (OIP) Ecosystem Forum.

Andrew Wilson elected to Intel Board of Directors

09/18/2017  Intel Corporation today announced that Andrew Wilson, CEO of Electronic Arts Inc., has been elected to Intel's board of directors. Wilson's election brings Intel's board membership to 12.

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Latest Article

New deionized water vapor delivery module from Brooks Instrument

09/11/2017  Brooks Instrument will be exhibiting at SEMICON Taiwan 2017 with a new vaporization product, mass flow controllers with high-speed EtherCAT, and a broad range of other mass flow meters, controllers and capacitance manometers for semiconductor manufacturing.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

WEBCASTS

3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

EVENTS

Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

NEW PRODUCTS

Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...