TOP STORIES

EDITOR'S PICKS
THE CONFAB
EDUCATION
BLOGS
4Q DRAM sales put exclamation point on an amazing year of growth
12/13/2017Forecast for record quarterly DRAM sales of $21.1 billion, with 74% annual growth expected....
Deep Learning Joins Process Control Arsenal
12/08/2017Where does the machine win, and where does the brain still win?” Howard Witham, APC keynote speaker....
Industry enters the age of WOW
12/13/2017The semiconductor industry has been there before, with large increases in investments followed by dramatic downturns. While the most dramatic downturns, 2001 and 2009, we...
$55.9B semiconductor equipment forecast: New record with Korea at top
12/12/2017Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forec...

Join us for The ConFab 2018!




May 20 – 23, 2018


THE COSMOPOLITAN of LAS VEGAS
Tech Papers
Upcoming Webcasts
Materials
Date and time TBD Success in electronics manufacturing increasingly relies on the materials used in production and packaging....
MEMS
Date and time TBDMEMS have quite different process and material requirements compared to mainstream microprocessor and memory types...

MAGAZINE




TWITTER


NEWS ANALYSIS & FEATURES


Increase in the wafer size drives wafer mounter equipment market

12/15/2017  The global wafer mounter equipment market is expected to grow at a CAGR of more than 4% from 2017-2021, according to a new market research report by Technavio.

Invensas completes DBI technology transfer to Teledyne DALSA

12/15/2017  One of the world's largest independent MEMS foundries ready to manufacture MEMS and image sensor products utilizing Invensas wafer bonding and 3D interconnect technology.

More electronic materials opened up with new metal-organic framework

12/15/2017  More materials for electronic applications could be identified, thanks to the discovery of a new metal-organic framework (MOF) that displays electrical semiconduction with a record high photoresponsivity, by a global research collaboration.

North American semiconductor equipment industry posts November 2017 billings

12/15/2017  North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

Toshiba and Western Digital reach global settlement and agree to strengthen flash memory collaboration

12/14/2017  As part of this agreement, TMC and Western Digital will participate jointly in future rounds of investment in Fab 6, the memory fabrication facility now under construction at Yokkaichi, including the upcoming investment round announced by Toshiba in October 2017.

IXYS announces 200V power MOSFETs with fast body diodes and lowest on-resistances

12/14/2017  Fabricated using a charge compensation principle and IXYS' own process technology, these new MOSFETs exhibit the lowest on-state resistances in the industry.

Detecting sleep apnea: Leti embeds sensors in wristband to measure heart rate and three other indicators

12/14/2017  Leti, a research institute of CEA Tech, will demonstrate at CES 2018 its new wristband that measures physical indicators of a range of conditions, including sleep apnea, dehydration and dialysis-treatment response.

New insight into battery charging supports development of improved electric vehicles

12/14/2017  First technique capable of determining lithium metal plating during lithium ion battery charging reported in Materials Today.

QuickLogic collaborates with Mentor to provide seamless design environment for eFPGA technology

12/14/2017  QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, announced that it has collaborated with Mentor, a Siemens business, to provide a seamless design and development environment for its embedded FPGA (eFPGA) technology.

The world's 1st "7-axis" motion tracking devices: tiner package & better response time

12/13/2017  Accelerometers and gyroscopes are fueling the robotic revolution, especially the drones’ market segment. However, these MEMS devices are not the only ones on the market place anymore, with environmental sensors penetrating this industry too.

Plasmonic biosensors enable development of new easy-to-use health tests

12/13/2017  Researchers at Aalto University have developed a biosensor that enables creating a range of new easy-to-use health tests similar to home pregnancy tests. The plasmonic biosensor can detect diseased exosomes even by the naked eye. A rapid analysis by biosensors helps recognize inflammatory bowel diseases, cancer and other diseases rapidly and start relevant treatments in time. In addition to using discovery in biomedicine, industry may use advanced applications in energy.

USC Viterbi faculty design thermal 'skin' to maintain temperature of satellites

12/13/2017  VO2 coated silicon material designed in collaboration with Northrop Grumman performs 20 times better than current semiconductors.

aveni extends copper interconnects to 5nm and below for BEOL integration

12/12/2017  aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.

New silicon structure opens the gate to quantum computers

12/12/2017  In a major step toward making a quantum computer using everyday materials, a team led by researchers at Princeton University has constructed a key piece of silicon hardware capable of controlling quantum behavior between two electrons with extremely high precision.

ProPlus and MPI Corporation establish strategic partnership

12/12/2017  ProPlus Design Solutions Inc. and MPI Corporation today announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus' SPICE modeling and noise characterization solution with MPI's advanced probing technologies.

National Academy of Inventors announces SUNY Poly professor Dr. Bin Yu selected as 2017 NAI Fellow

12/12/2017  Dr. Yu selected for significant contributions to semiconductor-based devices, nanotechnology research after being awarded more than 300 U.S. patents.

EVG installs low-temp plasma activation system at the University of Tokyo

12/12/2017  EVG 810LT system enables low-temperature direct wafer bonding of III-V compound semiconductor materials and germanium-on-silicon wafers with field-proven high-quality plasma surface preparation.

Discovery sets new world standard in nano generators

12/11/2017  Researchers discover new way to power electrical devices.

A diamond as the steppingstone to new materials, using plasma physics technology

12/11/2017  Heating a mixture of gases to furnace temperatures is one way to make a diamond film, nature's hardest substance. Adding boron to the gas mixture may create new materials.

MORE ANALYSIS & FEATURES

RESOURCE GUIDE - Get Listed


Latest Article

OEM Group announces post-dice clean solutions for plasma and laser dicing methods

09/28/2017  OEM Group announced today a post-dice clean solution on the proven Cintillio Batch Spray platform following plasma and laser dicing methods.



Categories


Featured Supplier


Busch Vacuum Pumps & Systems: http://www.buschusa.com



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

WEBCASTS

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


More Events

NEW PRODUCTS

Radiant Vision Systems announces new automated visual inspection system
11/06/2017Radiant Vision Systems, a provider of high-resolution imaging solutions for automated visual analysis of devices and surfaces, an...
SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....