Countdown to The ConFab 2014
December 06, 2013
IFTLE 172 Sony TSV Stacked CMOS Image Sensors Finally Arrive in 2013
December 09, 2013
IEDM 2013 Preview
December 06, 2013
MEMS: An Enabler of the Next Internet Revolution
December 09, 2013
NEWS ANALYSIS & FEATURES
STMicroelectronics launches new advanced energy-harvesting IC
12/10/2013 STMicroelectronics is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).
Research Alert: Dec. 10, 2013
12/10/2013 Thin, flexible solar cells; Polymers can be semimetals; MOF materials
CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology
12/09/2013 CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.
Growing interest in the physics of nanostructures to drive demand for thin films
12/06/2013 GIA invites senior industry executives, domain experts, technologists and market strategists to participate in a comprehensive global research initiative studying the “Thin Films” markets.
Graphene: Growing giants
12/06/2013 While searching for an ideal growth platform for the material, investigators developed a promising new recipe for a graphene substrate: a thin film of copper with massive crystalline grains.
The Week in Review: Dec. 6, 2013
12/06/2013 Worldwide semiconductor sales; Soitec announces high-volume manufacturing of eSI substrates; SEMI releases World Fab Forecast; Micron announces new VP of Quality; Industry on track for highest-ever annual sales in 2013
Equipment spending down 2013; expect 33% growth in 2014
12/06/2013 Fab construction projects boom in 2013 but slow in 2014.
Brewer Science commercializes thermal slide debonder
12/06/2013 Brewer Science, a supplier of thin-wafer-handling materials, processes, and equipment to the microelectronics industry, announced today the first commercial placement of its Cee 1300CSX thermal slide debonder.
Nikkiso initiates shipments of deep ultraviolet LEDs
12/05/2013 NIKKISO CO. has announced that it has initiated shipments of commercial LED product samples emitting at a range of wavelengths in the UVB and UVC spectral regimes for industrial, biomedical, and environmental applications.
Laser light at useful wavelengths from semiconductor nanowires
12/05/2013 Nanowire lasers could work with silicon chips, optical fibers, even living cells.
RF-SOI Wafers for Wireless Applications
12/05/2013 The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.
FinFET on SOI: Potential Becomes Reality
12/05/2013 We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions. However, significant compromise is unavoidable when using doping as a means of isolation, as in bulk-based FinFETs.
STMicroelectronics imaging technology helps visually impaired
12/04/2013 STMicroelectronics announced that its 5.1 mega-pixel camera module and low-power digital image processor are being used in the revolutionary OrCam camera, a small device that clips on to eyeglasses and dramatically improves the mobility and ability of visually-impaired people to "read" signs, packaging and publications.
Micron Technology appoints Rajan Rajgopal as VP of QualityMORE ANALYSIS & FEATURES
12/04/2013 Micron Technology, Inc. today announced that the company has named Rajan Rajgopal, vice president of Quality.
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Micron Technology appoints Rajan Rajgopal as VP of Quality