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How SEMI Standard E175 is saving energy and cutting costs
06/20/2017Industry experts answer questions about the new standard in a virtual roundtable....
What TechInsights analysts are watching in 2017
06/19/2017TechInsights analysts share their view on where technology is going, how it’s changing, and what new developments are emerging....
Cellphone IC sales will top total personal computing in 2017
06/20/2017Higher memory prices accelerate sales growth in both cellphones and personal computing systems but cellular handsets will become the largest...
The automotive electronics market: A view from a material supplier
06/16/2017With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will...

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NEWS ANALYSIS & FEATURES


It’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

EV Group optimizes resist and lithographic processing for plasma dicing

06/20/2017  EVG resist processing and lithography systems provide pre-processing solution to enable complete damage-free advanced dry plasma dicing on thin semiconductor wafers.

Synopsys, GlobalFoundries collaborate to deliver design platform and IP enablement for 7nm finFET process

06/20/2017  Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare Embedded Memory IP on GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET process technology.

ULVAC Technologies opens California office

06/20/2017  ULVAC Technologies, Inc., a supplier of production systems, instrumentation and vacuum pumps for technology industries, has opened an office in Santa Clara, California.

Exploring smart sensor explosive growth at SEMICON West 2017

06/20/2017  MEMS & Sensors Industry Group announces programs and speakers for SEMICON West 2017 (July 11-13).

GLOBALFOUNDRIES, ON Semiconductor deliver the industry's lowest power Bluetooth low energy SoC family

06/19/2017  GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices, on GF's 55nm Low Power Extended (55LPx), RF-enabled process technology platform.

MagnaChip to offer 0.13 micron BCD process technology with high-density embedded flash

06/19/2017  This BCD process offers 40V power LDMOS and delivers 64K Bytes flash memory, making it suitable for programmable PMIC, wireless power chargers and USB-C power-delivery IC products.

Pixelligent Technologies named 2017 Manufacturer of the Year by Frost & Sullivan

06/19/2017  It won this award in the small/midsize company category for companies with revenues under $1B, for its PixClearProcess that is revolutionizing chemical composite technology.

To connect biology with electronics, be rigid, yet flexible

06/19/2017  Researchers uncover design principles to make polymers that can transport both ions and electrons.

Alloying materials of different structures offers new tool for controlling properties

06/19/2017  New research into the largely unstudied area of heterostructural alloys could lead to greater materials control and in turn better semiconductors, advances in nanotechnology for pharmaceuticals and improved metallic glasses for industrial applications.

New prospects for universal memory -- high speed of RAM and the capacity of flash

06/16/2017  Thin films created at MIPT could be the basis for future development of ReRAM.

Fast and precise surface measurement of back-grinding silicon wafers

06/16/2017  A new type of scattered light measurement method will be presented, capable of measuring the full wafer surface of a 300 mm wafer in less than 30 seconds. Besides the roughness, the sensor simultaneously measures warpage, waviness and defects.

North American semiconductor equipment industry posts May 2017 billings

06/16/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in May 2017 (three-month average basis)

HPC, chiplets and interposers

06/15/2017  The need for ever more computational power continues to grow and exaflop (1018 ) capabilities may soon become necessary.

UMC restructures executive team

06/15/2017  UMC today announced that its board of directors has appointed senior vice presidents SC Chien and Jason Wang as co-presidents of the company, following Po-Wen Yen’s retirement as UMC CEO.

Samsung achieves 220 lumens per watt with new mid-power LED package

06/15/2017  Samsung Electronics Co., Ltd. today announced that it has begun mass producing a new mid-power LED package, the LM301B, which features the industry's highest luminous efficacy of 220 lumens per watt.

Development of low-dimensional nanomaterials could revolutionize future technologies

06/15/2017  Javier Vela, scientist at the US Department of Energy's Ames Laboratory, believes improvements in computer processors, TV displays and solar cells will come from scientific advancements in the synthesis of low-dimensional nanomaterials.

7 of the top 10 smartphone suppliers headquartered in China

06/15/2017  China accounted for 10 of top 14 leading smartphone suppliers in 2016, share grows to 39%.

GLOBALFOUNDRIES on track to deliver Leading-Performance 7nm FinFET technology

06/14/2017  GLOBALFOUNDRIES this week announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost.

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EV Group optimizes resist and lithographic processing for plasma dicing

06/20/2017  EVG resist processing and lithography systems provide pre-processing solution to enable complete damage-free advanced dry plasma dicing on thin semiconductor wafers.



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VIDEOS

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Learn the Basics of Power Amplifier and Front End Module Measurements

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EVENTS

Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

NEW PRODUCTS

3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...