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Process Watch: Salami slicing your yield
09/26/2016The Process Watch series explores key concepts about process control -- defect inspection and metrology -- for the semiconductor industry. This new series of ar...
2016 a sequel to last year’s M&A mania
09/21/2016Value of semiconductor industry M&A agreements already over $50 billion this year....
Leading-edge leads the way in pure-play foundry growth
09/28/2016Sales of ICs built using <40nm process technology forecast to rise 23% at pure-play foundries....
Linde Launches Asian R&D Center in Taiwan
09/23/2016Strategic investment serves IC, FPD, LED, and PV fabs...

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NEWS ANALYSIS & FEATURES


TSMC recognizes Synopsys with three partner awards

09/28/2016  Synopsys, Inc. today announced that TSMC is recognizing Synopsys with three "2016 Partner of the Year" awards for Interface IP and joint development of 7-nanometer (nm) mobile and HPC design platforms.

INVECAS and GlobalFoundries announces availability of advanced 14nm FinFET design IP library

09/28/2016  Silicon-proven and optimized IP from INVECAS is now available for foundry customers on GLOBALFOUNDRIES' 14LPP process.

North American semiconductor equipment industry posts August 2016 book-to-bill ratio of 1.03

09/27/2016  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

SiTime introduces high-precision MEMS oscillators

09/27/2016  SiTime Corporation today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators.

NXP introduces low power ARM Cortex-A7 based processor to fuel growth of the IoT

09/27/2016  At NXP FTF China today, NXP Semiconductors N.V. (NASDAQ:NXPI), officially announced the i.MX 6ULL applications processor which delivers up to 30 percent more power efficiency than its nearest competitors.

Elusive Analog Fault Simulation Finally Grasped

09/27/2016  The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.

MEMS & Sensors Industry Group highlights near-term and future connected tech at annual Executive Conference

09/26/2016  MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016.

EV Group extends volume manufacturing expertise to biotech and medical applications

09/26/2016  EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.

SEMI European 3D Summit 2017: Creating high-density systems

09/26/2016  The advanced semiconductor summit will take place on 23-25 January, 2017 at Minatec in Grenoble, France, with the theme "European 3D Summit 2017 – Creating High Density Systems."

SID announces new award for outstanding contributions for active matrix addressed information displays

09/23/2016  The Peter Brody Prize will be awarded to a young researcher under age 40 who has made outstanding contributions in innovating the design and enhancing the performance of active matrix addressed information displays.

NIST illuminates transfer of nanoscale motion through microscale machine

09/23/2016  For the first time, the NIST researchers have measured the transfer of motion through the contacting parts of a microelectromechanical system at nanometer and microradian scales.

Shanhai Capital to acquire Analogix Semiconductor

09/23/2016  Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced that they have entered into a definitive merger agreement under which a consortium led by Shanhai Capital will acquire all of the outstanding shares of Analogix for over $500 million.

Synopsys and TSMC collaborate to certify Custom Compiler for 16FFC process

09/22/2016  Synopsys, Inc. today announced a collaboration with TSMC to complete the certification for its 16-nanometer (nm) FinFET Compact (16FFC) process for a suite of Synopsys' digital, custom and signoff tools from the Galaxy Design Platform.

SRC honors professors from University of Chicago and University of Michigan

09/22/2016  The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from the University of Chicago and the University of Michigan in recognition of their outstanding contributions to semiconductor research.

iPhone 7 materials costs higher than previous versions

09/22/2016  The bill of materials (BOM) for an iPhone 7 equipped with 32 gigabytes (GB) of NAND flash memory carries $219.80 in bill of materials costs, according to a preliminary estimate from IHS Markit.

Kateeva's YIELDjet FLEX inkjet printing system takes commanding lead in OLED TFE market

09/21/2016  Since the novel inkjet printing solution debuted in manufacturing in 2014, the company has secured the vast majority of available TFE orders.

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies

09/21/2016  Mentor Graphics Corp. today announced further enhancements and optimizations for various products within the Calibre Platform, and Analog FastSPICE (AFS) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes.

Leti orders HERCULES NIL system from EV Group for joint nanoimprint lithography program

09/21/2016  EV Group (EVG) and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group.

Mentor Graphics Veloce Emulation Platform Used by Starblaze for Verification of SSD Enterprise Storage Design

09/21/2016  Mentor Graphics Corporation today announced that the Veloce emulation platform was successfully used by Starblaze Technology for a specialized high-speed, enterprise-based Solid State Drive (SSD) storage design.

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Lam Research introduces dielectric atomic layer etching capability for advanced logic

09/07/2016  Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.



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New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
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NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
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Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

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EVENTS

SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

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