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Tsunami of M&A deals underway in the semiconductor industry in 2015
07/29/2015Marketshare expansion, Internet of Things opportunities, rising costs of R&D, and China’s aggressive new focus on the semic...
Semiconductor market worth $332B in 2015
07/28/2015ReportsnReports.com added 2015 semiconductor market research reports that forecast a 2.9 percent CAGR to 2020 for semiconductor industry and a 6.7 percent rise ...
Intel and Micron produce breakthrough memory technology
07/28/2015Intel and Micron begin production on new class of non-volatile memory, creating the first new memory category in more than 25 years....
Opportunities in packaging are driving photolithography equipment demand
07/27/2015Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest g...
Tune in to the Solid State Watch

ROHM Semiconductor acquires Powervation, SEMI posts book-to-bill report; Amkor Technology to expand operations in China; Analog Devices joins SRC's research program Trustworthy and Secure Semiconductors and Systems.

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Tech Papers
Upcoming Webcasts
The Path to Future Interconnects
August 6, 2015 at 1:00 p.m. ET Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, ...
Lock-in Thermography for Advanced Assembly Qualification
August 26, 2015 at 1:00 p.m. ET Increasing IoT business opportunities drive a need for new packaging techniques such ...
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NEWS ANALYSIS & FEATURES


Samsung 3D TSV stacked DDR4 DRAM: the first analyzed memory product with via- middle TSV

07/31/2015  According to Yole, 3D TSV technology is expected to reach $4.8B billion in revenues by 2019.

SPTS Technologies receives a $16M multiple system order from WIN Semiconductors Corp.

07/31/2015  ORBOTECH LTD. today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received an order, worth approximately US$16M, for multiple etch and deposition systems from WIN Semiconductors Corp.

Apple is using 20% of worldwide sapphire capacity – and that may be just the beginning

07/31/2015  In 2015, 20 percent of sapphire will be used in Apple’s iPhone, for the camera lens, fingerprint readers and heart rate monitors covers, and the Apple watch’s window.

SEMICON West: The road forward is 3DIC

07/31/2015  SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.

Sol-gel capacitor dielectric offers record-high energy storage

07/30/2015  Using a hybrid silica sol-gel material and self-assembled monolayers of a common fatty acid, researchers have developed a new capacitor dielectric material that provides an electrical energy storage capacity rivaling certain batteries, with both a high energy density and high power density.

The confidence of the Wide Band Gap industry

07/30/2015  WBG companies are slowly but surely reshaping the industry and accelerate the market adoption with numerous strategic mergers and acquisitions and the development of disruptive solutions.

Process Watch: The most expensive defect - Part 2

07/30/2015  The December 2014 edition of Process Watch suggested that the most expensive defect is the one that goes undetected until the end of line. Indeed, undetected excursions typically result in the scrap of millions of dollars per year of defective semiconductor chips.

Meet the high-performance single-molecule diode

07/29/2015  A team of researchers from Berkeley Lab and Columbia University has passed a major milestone in molecular electronics with the creation of the world's highest-performance single-molecule diode.

IBM launches new Internet of Things community for developers

07/29/2015  IBM today announced the launch of a new community, IBM developerWorks Recipes, designed to help developers – from novice to experienced – quickly and easily learn how to connect Internet of Things (IoT) devices to the cloud and how to use data coming from those connected devices.

Advanced materials enable a smart and interconnected world - SEMI Strategic Materials Conference 2015

07/29/2015  The SEMI Strategic Materials Conference (SMC), taking place September 22–-23 in Mountain View, Calif., will uncover the drivers for new materials and how material suppliers are impacted by the value chain they serve.

Chinese automotive semiconductor revenues to hit $6.2B in 2015

07/28/2015  The growth rate for vehicle shipments in China is slowing, but more and better performing semiconductors will still be required in automotive applications in the coming years.

Flat panel display revenues forecast to fall in 2015

07/28/2015  Led by declining thin-film-transistor liquid-crystal display (TFT LCD) revenues, global flat panel display (FPD) industry revenue is forecast to fall 2 percent, from $131.4 billion in 2014 to $129 billion in 2015.

Short wavelength plasmons observed in nanotubes

07/28/2015  A team of researchers with Berkeley Lab's Materials Sciences Division, working at the Advanced Light Source (ALS), has generated and detected plasmons that boast one of the strongest confinement factors ever: the plasmon wavelength is only one hundredth of the free-space photon wavelength.

Reshaping the solar spectrum to turn light to electricity

07/28/2015  A team of chemists at the University of California, Riverside found an ingenious way to make solar energy conversion more efficient.

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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS

The Path to Future Interconnects

August 6, 2015 at 1:00 p.m. ET

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
Advanced Packaging

August 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
More Webcasts

EVENTS

SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015

NEW PRODUCTS

Compact point of use fluid delivery heater replaces multiple components in a system
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater...
New fiber optic temperature sensing and control system ideal for RF environments
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announced its new EZ-ZONE RM fiber optic temperature me...