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Process Watch: Having confidence in your confidence level
04/20/2017This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits fo...
Samsung completes qualification of its 2nd gen 10nm process technology
04/19/2017Samsung expands 10nm capacity, to be ready for production by the fourth quarter of this year....
March billings reached levels not seen since March 2001, reports SEMI
04/21/2017North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in March 2017, according to...
Global semiconductor wafer-level equipment revenue to grow 11% in 2016
04/20/2017Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled $37.4 billion in 2016, an 11.3 percent increase ...
Tech Papers
Upcoming Webcasts
Metrology Challenges and Opportunities
Wednesday, April 26, 2017 at 2 p.m. ET Continued scaling and more complex device structures, including FinFETs and...
Advanced Packaging
Date and time TBD Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance,...

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NEWS ANALYSIS & FEATURES


Engineering technique is damaging materials, research reveals

04/21/2017  Widely used microscopy technique has unintended consequences, new Oxford University research reveals.

New quantum liquid crystals may play role in future of computers

04/21/2017  New state of matter may have applications in ultrafast quantum computers.

Avantor acquires Puritan Products

04/21/2017  Avantor Performance Materials, LLC, announced today the acquisition of Puritan Products, Inc., a supplier of cGMP buffers and solutions for Biopharma customers, and high-purity chemistries for Research and Electronic Materials customers.

Will I see you at The ConFab?

04/20/2017  The ConFab — an executive conference now in its 13th year — brings together influential executives from all parts of the semiconductor supply chain for three days of thought-provoking talks and panel discussions, networking events and select, pre-arranged breakout business meetings.

New ClassOne chamber cuts copper plating costs 95%

04/20/2017  ClassOne Technology announced it's new CopperMax chamber -- a design that is demonstrating major copper plating cost reductions for users of ≤200mm wafers.

Gartner reports worldwide PC shipments declined 2.4% in first quarter of 2017

04/19/2017  Worldwide PC shipments totaled 62.2 million units in the first quarter of 2017, a 2.4 percent decline from the first quarter of 2016, according to preliminary results by Gartner, Inc.

Brewer Science earns GreenCircle Certification for zero waste to landfill for second consecutive year

04/19/2017  Brewer Science announced the achievement of Zero Waste to Landfill Certification for the second consecutive year.

Graphene 'copy machine' may produce cheap semiconductor wafers

04/19/2017  Engineers use graphene as a 'copy machine' to produce cheaper semiconductor wafers.

3D-Micromac receives large volume orders from solar industry for its microCELL TLS system

04/18/2017  3D-Micromac AG today announced that the total received order volume for its microCELL TLS high-throughput half-cell cutting tools tops 1.5 GW for tool deliveries in 2017 to date.

InvenSense receives regulatory clearances

04/18/2017  InvenSense, Inc., a provider of MEMS sensor platforms, today announced that all necessary regulatory clearances have been received for the acquisition by TDK Corporation of InvenSense.

NREL researchers capture excess photon energy to produce solar fuels

04/18/2017  Scientists at the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) have developed a proof-of-principle photoelectrochemical cell capable of capturing excess photon energy normally lost to generating heat.

Global ESD packaging market driven by the miniaturization of semiconductors, says Technavio

04/17/2017  According to the latest market study released by Technavio, the electrostatic discharge (ESD) packaging market is projected to grow to USD 5.42 billion by 2021, at a CAGR of more than 8% over the forecast period.

Columbia engineers invent method to control light propagation in waveguides

04/17/2017  New technique using nano-antennas to make photonic integrated devices smaller with a broader working wavelength range could transform optical communications.

SEMICON Southeast Asia 2017: Disruption and the value of digital transformation in manufacturing

04/17/2017  At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector.

GaN Systems' investors receive Venture Capital Awards

04/17/2017  Investor of the Year, Chrysalix Venture Capital selected over 11,000 nominees Cycle Capital Management named Canada's 2nd most active VC in 2016.

Axcelis announces multiple Purion orders from several leading chip makers in Asia Pacific

04/14/2017  Axcelis Technologies, Inc. announced today that it has received multiple orders for the Purion H high current, Purion XE high energy, and Purion EXE extended high energy system from several leading chip manufacturers in the Asia Pacific region.

New switching process in non-volatile spintronics devices

04/14/2017  Physicists achieved a robust and reliable magnetization switching process by domain wall displacement without any applied fields. The effect is observed in tiny asymmetric permalloy rings and may pave the way to extremely efficient new memory devices.

Kulicke & Soffa opens latest process and applications laboratory

04/13/2017  Kulicke & Soffa Industries, Inc. announced today the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.

PolyU develops novel semiconductor nanofiber with superb charge conductivity

04/13/2017  The Department of Mechanical Engineering of The Hong Kong Polytechnic University (PolyU) has developed a novel technology of embedding highly conductive nanostructure into semiconductor nanofiber.

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RESOURCE GUIDE - Get Listed


Latest Article

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.



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Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
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WEBCASTS

Metrology Challenges and Opportunities

Wednesday, April 26, 2017 at 2 p.m. ET

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:
Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

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Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

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EVENTS

CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

NEW PRODUCTS

3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...