Countdown to The ConFab 2014
December 06, 2013
IFTLE 172 Sony TSV Stacked CMOS Image Sensors Finally Arrive in 2013
December 09, 2013
IEDM 2013 Preview
December 06, 2013
MEMS: An Enabler of the Next Internet Revolution
December 09, 2013
NEWS ANALYSIS & FEATURES
Micron's high-density 45nm serial NOR Flash doubles programming speed for embedded applications
12/10/2013 Micron Technology, Inc. today announced the availability of 45nm Serial NOR Flash memory samples in 512Mb, 1Gb, and 2Gb densities with a standard SPI interface.
SEMICON West “Call for Papers” for New Semiconductor Technology Symposium, Science Park and TechXPOTs
12/10/2013 SEMI today announced a “Call for Papers” for the new Semiconductor Technology Symposium, the popular TechXPOT programs, and a new Science Park program featuring university research and advanced R&D subjects at SEMICON West, North America’s premier microelectronics event, to be held July 8-10 at the Moscone Center in San Francisco, Calif.
Singapore-MIT Alliance for Research Technology orders EV Group automated production bonding system
12/10/2013 SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.
STMicroelectronics launches new advanced energy-harvesting IC
12/10/2013 STMicroelectronics is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).
Research Alert: Dec. 10, 2013
12/10/2013 Thin, flexible solar cells; Polymers can be semimetals; MOF materials
CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology
12/09/2013 CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.
Growing interest in the physics of nanostructures to drive demand for thin films
12/06/2013 GIA invites senior industry executives, domain experts, technologists and market strategists to participate in a comprehensive global research initiative studying the “Thin Films” markets.
Graphene: Growing giants
12/06/2013 While searching for an ideal growth platform for the material, investigators developed a promising new recipe for a graphene substrate: a thin film of copper with massive crystalline grains.
The Week in Review: Dec. 6, 2013
12/06/2013 Worldwide semiconductor sales; Soitec announces high-volume manufacturing of eSI substrates; SEMI releases World Fab Forecast; Micron announces new VP of Quality; Industry on track for highest-ever annual sales in 2013
Equipment spending down 2013; expect 33% growth in 2014
12/06/2013 Fab construction projects boom in 2013 but slow in 2014.
Brewer Science commercializes thermal slide debonder
12/06/2013 Brewer Science, a supplier of thin-wafer-handling materials, processes, and equipment to the microelectronics industry, announced today the first commercial placement of its Cee 1300CSX thermal slide debonder.
Nikkiso initiates shipments of deep ultraviolet LEDs
12/05/2013 NIKKISO CO. has announced that it has initiated shipments of commercial LED product samples emitting at a range of wavelengths in the UVB and UVC spectral regimes for industrial, biomedical, and environmental applications.
Laser light at useful wavelengths from semiconductor nanowires
12/05/2013 Nanowire lasers could work with silicon chips, optical fibers, even living cells.
RF-SOI Wafers for Wireless ApplicationsMORE ANALYSIS & FEATURES
12/05/2013 The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.
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