TOP STORIES

EDITOR'S PICKS
FEATURED VIDEO
EDUCATION
BLOGS
Tablet shipments lose momentum; Total PC unit forecast downgraded
05/29/2015IC Insights has downgraded its forecast for the overall personal computing market, including much lower growth in tablets and continued...
New Applied PVD system targets TiN hardmasks for 10nm, 7nm chips
05/19/2015Applied Materials introduced the Applied Endura Cirrus HTX PVD, a physical vapor deposition system for creating titanium nitride hardmas...
Samsung to put 10nm chips into mass production by end of 2016
05/22/2015Samsung Semiconductor on Thursday announced that it will have 10-nanometer FinFET chips in volume production by the end of next year....
Growing in maturity, the MEMS industry is getting its second wind
05/19/2015In 2014, the MEMS sector represented an $11.1B business for Si-based devices. According to Yole Développement (Yole) latest MEMS repor...
Tune in to the Solid State Watch

First quarter semiconductor sales up 6% compared to last year; New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead; Microchip and GlobalFoundries announce new55nm embedded NVM; ASE and TDK announce plans for joint venture agreement

Click here for more videos

Tech Papers
Upcoming Webcasts
Interconnects
June 2015 (Date and time TBD) This webcast will examine the state-of-the-art in conductors and dielectrics, -- including ...
Understanding Defects
July 2015 (Date and time TBD) Yield improvement and production engineers working on today's ICs encounter many challenges as ...
Miss a webcast? Watch it On-Demand

Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


Flat panel display equipment spending forecast to reach $9B in 2015

06/02/2015  Revenues for flat panel display (FPD) manufacturing equipment are expected to grow for the third consecutive year to reach $9.1 billion.

Avago Technologies acquisition of Broadcom creates new semiconductor powerhouse

06/02/2015  Merger activity in the semiconductor industry moved to a new level with the announcement of the agreement for Avago Technologies to acquire Broadcom.

Smartwatch display shipments to reach record 34M units in 2015

06/02/2015  Smartwatch display unit shipments are expected to grow 250 percent year-over-year, reaching a record 34 million units in 2015, led by demand for the new Apple Watch.

GLOBALFOUNDRIES solidifies 14nm finFET design infrastructure for next-generation chip design

06/02/2015  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced it has reached a critical milestone in providing a design infrastructure for its 14-nanometer (nm) FinFET process technology.

Fujifilm and imec demonstrate full-color OLEDs with photoresist technology for organic semiconductors

06/02/2015  FUJIFILM Corporation and nano-electronics research institute, imec have demonstrated full-color organic light-emitting diodes (OLED) by using their jointly-developed photoresist technology for organic semiconductors.

Leti demos new process to fabricate high-brightness micro-LED arrays for next-gen head-mounted and head-up displays

06/02/2015  CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.

Eulitha delivers PHABLE Photolithography System to MESA+ NanoLab

06/02/2015  EULITHA, a Swiss startup company offering innovative lithography equipment and services for the nanotechnology, photonics and optoelectronic markets announced today the delivery of its unique PhableR 100 photolithography tool to the MESA + NanoLab of the University of Twente in the Netherlands.

Intel CEO looks to 3D tech at display conference

06/02/2015  Intel CEO Brian Krzanich touted the capabilities of his company’s RealSense technology in a keynote address at the Society of Information Display conference in San Jose, California.

North America: A critical player in the advanced semiconductor market

06/01/2015  As the fabless business model has transformed the semiconductor manufacturing landscape, Taiwan and South Korea have undeniably grown into key semiconductor producing regions. However, it should be noted that North America is home to Intel, Texas Instruments, Micron, GLOBALFOUNDRIES, Freescale, Fairchild, Microchip, ON Semiconductor, significant operations of Samsung, and other manufacturers.

Silicon Technology Extensions shown at MRS Spring 2015

06/01/2015  New ultra-fast crystallization using lasers or plasma-jets.

Technology for tomorrow’s market opportunities and challenges at LetiDays Grenoble

05/29/2015  The 17th annual LetiDays Grenoble on June 24-25 will expand the conversation with presentations about Internet of Things-augmented mobility, which is revolutionizing the way we interact with appliances, infrastructure and countless common objects that are part of our daily lives.

Fan-in WLP manufacturing capacities are full and more volume is required

05/29/2015  The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore’s law in its foundation.

Diverse packaging and test issues up for debate at SEMICON West 2015

05/29/2015  SEMI this week announced the SEMICON West 2015 test and packaging program agendas.

NXP and Stora Enso to develop intelligent packaging solutions

05/29/2015  NXP Semiconductors and Stora Enso have entered into joint development of intelligent packaging solutions.

MORE ANALYSIS & FEATURES


Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 2015 (Date and time TBD)

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

EVENTS

Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...