07/21/2016 Paper-submission deadline is August 10 this year; Supplier exhibition to be held in conjunction with technical program.
07/21/2016 Contributing editor and blogger Phil Garrou received the 3D InCites "Device of the Year" award during the 2016 SEMICON West conference for "Excellence in 3D Packaging Technologies."
07/20/2016 Amkor Technology, Inc. recently received the 3D InCites "Device of the Year" award during SEMICON West for its' SWIFT semiconductor package.
07/15/2016 Toshiba Corporation and Western Digital Corporation today celebrated the opening of the New Fab 2 semiconductor fabrication facility located in Yokkaichi, Mie Prefecture, Japan.
07/13/2016 Leti, an institute of CEA Tech, and the Korea Institute of Science and Technology (KIST) today announced an agreement to jointly explore a variety of technologies, including monolithic 3D, neuromorphic architectures, non-volatile 3D memory, spintronics and ultra-low power semiconductors.
07/12/2016 Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.
07/11/2016 Applied Materials, Inc. today announced its next-generation e-beam inspection system is delivering the highest resolution and image quality at the fastest throughput to leading foundry, logic, DRAM and 3D NAND customers as they move to advanced nodes.
07/08/2016 Weak global economy and poor DRAM market to drag down growth this year.
07/01/2016 Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC), a designer and manufacturer of semiconductor and LED assembly equipment, has joined A*STAR’s Institute of Microelectronics (IME)’s Chip-on-Wafer Consortium II, together with other major industry players.
06/30/2016 A*STAR’s Institute of Microelectronics (IME) has partnered semiconductor companies to develop cost-effective solutions in 2.5D and 3D wafer-level integrated circuit (IC) packaging.
06/29/2016 ALLVIA, Inc. has expanded its capacity into glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers.
06/28/2016 Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.
06/22/2016 Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.
July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.
Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.
June 2016 (Date and time TBD)/ Sponsored by Air Products
June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
This whitepaper provides a comprehensive overview of parylene conformal
coating, advantages of parylene, and applications for parylene to
protect electronic devices.
As technology continues to advance, devices will encounter rugged
environments and it is vital that they are properly protected. Parylene
conformal coating is one way that manufacturers are giving their devices
a higher level of protection, along with increasing the overall quality
of their products.
Parylene conformal coating applications for Electronics include:
· I/O & PCI Modules
· Power Converters and Supplies
· Other Embedded Computing applications
· Other specialty electronics and assemblies April 26, 2016Sponsored by Diamond-MT