3D Integration

MAGAZINE



3D INTEGRATION ARTICLES



Hybrid Memory Cube Consortium releases new specification

11/24/2014  The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

European 3D TSV Summit 2015: Keynote speakers announced

11/19/2014  This week, SEMI announced the keynote speakers for the third edition of the European 3D TSV Summit, event that will take place on January 19-21, 2015 in Grenoble, France.

TSV integration is creating growth and significant interest in the equipment and materials industry

11/18/2014  The materials market will grow from $789M in 2013 to over $2.1B with a CAGR of 18%.

Kandou introduces in-package chip interconnect enabling lower cost semiconductor solutions

11/04/2014  Kandou Bus has announced the Glasswing family of chip interconnects targeted for in-package chip-to-chip links.

SEMI extends ASMC Call for Papers deadline to November 10

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

KLA-Tencor reveals 'leveraged recapitalization' plan and an expanded stock repurchase program

10/24/2014  Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.

Samsung starts mass production of 8Gb DDR4 based on 20nm process technology

10/22/2014  Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

MORE 3D-INTEGRATION ARTICLES

HEADLINES

Videon's Avia Now Supports Apple TV, Roku and LG Smart TVs
November 26, 2014

Computer Graphics Market by Software (CAD/CAM, Visualization/Simulation, Digital video, Imaging, Modeling/Animation), Service (Consulting, Training & Support, Integration), End-User (Enterprise and SMB) - Worldwide Forecasts & Analysis (2014-2019)
November 25, 2014

Eyelit's Advanced Integrated Manufacturing Execution System (MES) Selected by BinOptics to Support Dramatic Growth at New York Production Site; Implementation is underway for innovative integrated optoelectronic components manufacturing
November 25, 2014

Global PCB Design Software Market 2014-2018
November 25, 2014

INVESTOR ALERT: Glancy Binkow & Goldberg LLP Reminds Investors of the Lead Plaintiff Deadline in the Class Action Lawsuit Against GT Advanced Technologies Inc.
November 25, 2014

GameStop Announces Its Black Friday Specials; GameStop has great deals on new and pre-owned video games, consoles, accessories, and smartphones, tablets and other consumer electronics; To help customers save even more money this holiday, GameStop expects to give nearly $250 million dollars in cash or credit through buying customers' video games and consumer electronic products; Stores closed on Thanksgiving Day, but will open at 12:01 a.m. on Black Friday
November 25, 2014

InformationWeek Releases Fitness Tracker Gift Guide; With the Internet of Things market growing, wearables are in this holiday season. InformationWeek spotlights a dozen fitness trackers that can make great gifts.
November 25, 2014

Newegg Celebrates Black Friday with Awesome Deals and Special Anniversary Hybrid Center Event; Newegg Hybrid Center Offers More Than 96 Incredible On-Site Deals on Nov. 28
November 25, 2014

Solid GDP Data May Aid In Preserving Momentum
November 25, 2014

SCHOTT announces launch of HermeS wafers
November 20, 2014

FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Extending Moore's Law

January 2014 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2014 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
FinFETs

February 2014 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



2014 IEEE International Electron Device Meeting
San Francisco, CA
http://www.his.com/~iedm/
December 15, 2014 - December 17, 2014
International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015