3D Integration

MAGAZINE



3D INTEGRATION ARTICLES



KLA-Tencor reveals 'leveraged recapitalization' plan and an expanded stock repurchase program

10/24/2014  Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.

Samsung starts mass production of 8Gb DDR4 based on 20nm process technology

10/22/2014  Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

European 3D TSV Summit: “Smarter system integration” theme to focus on both business and technology

09/30/2014  On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France.

A new dimension for integrated circuits: 3D nanomagnetic logic

09/30/2014  Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.

Tessera Technologies names Craig Mitchell as CTO and president of Invensas

09/29/2014  Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately.

TSMC delivers first fully functional 16 finFET networking processor

09/29/2014  TSMC today announced that its has successfully produced the foundry segment's first fully functional ARM-based networking processor with FinFET technology, through its collaboration with HiSilicon Technologies Co, Ltd.

Rudolph introduces new acoustic metrology and defect inspection technology

09/18/2014  Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

MORE 3D-INTEGRATION ARTICLES

HEADLINES

MONDI PLC - Upgrade of Moody's Long Term Credit Rating to Baa2
October 30, 2014

Alpine Electronics In-Dash Receiver with Apple CarPlay Now Shipping
October 30, 2014

Lucintel anticipates the global adhesive pastes and films market in semiconductor packaging industry to grow at a CAGR of 5.9% during 2012-2017; Global Adhesive Pastes and Films Market in Semiconductor Packaging Industry 2012-2017: Trends, Forecast, and Opportunity Analysis
October 29, 2014

Panasonic Introduces Powerful and Flexible Rugged 7-inch AndroidTM Tablet; Toughpad FZ-B2 enables affordable professional-grade productivity in the field
October 29, 2014

GameStop and St. Jude Children's Research Hospital® Invite Consumers to Play it Forward During the Annual St. Jude Thanks and Giving® Campaign; GameStop to build on the $1 million raised last year for the treatment and research of childhood cancer
October 29, 2014

MingJian Releases First ICRT-Certified Reviews of Xiaomi Mi4 and OnePlus One; "iPhone killers?" Not quite, but say goodbye to the mid-range smartphone segment as Xiaomi and OnePlus have narrowed the playing field and are nipping at the heels of the flagship brands.
October 29, 2014

Germany : Bayer MaterialScience at Compamed in Dusseldorf
October 29, 2014

United States : Mentor Graphics Announces Xpedition System Designer for Comprehensive Multi-board Systems Development
October 29, 2014

Alibaba may partner with Apple
October 29, 2014

Whitfield Bryson & Mason LLP Files Class Action Against Apple, Inc. For Defective 2011 MacBook Pro Laptops
October 28, 2014

FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

More Webcasts

VIDEOS