3D Integration



Entegris introduces SmartStack 300 mm contactless horizontal wafer shipper

10/06/2015  Entegris, Inc. has expanded its wafer shipper family of products with the SmartStack (R) 300 mm Contactless Horizontal Wafer Shipper.

Monolithic 3D - Game-Changing 2.0 at IEEE S3S

10/05/2015  The path to alternative scaling is now open.

Novati Technologies launches advanced integrated sensor platform

09/30/2015  Novati Technologies Inc. announced the availability of an advanced Integrated Sensor Platform, placing a wide variety of sensors onto multi-layer stacks of wafers in order to consume less power and perform significantly faster while reducing overall footprint.

2015 IEEE International Electron Devices meeting to showcase the latest technology developments in micro/nanoelectronics

09/30/2015  At the 61st annual IEEE International Electron Devices Meeting (IEDM) subjects under discussion will encompass a range of topics critical to the continuing progress of the industry.

2016 Symposia on VLSI Technology and Circuits announces call for papers

09/28/2015  The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits).

Semiconductor Manufacturing: ASMC 2016 - Nov. 2 "call for papers" deadline

09/22/2015  SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2.

S3S - the conference for IoT technologies

09/18/2015  The upcoming IEEE S3S Conference 2015 in Sonoma, CA, on October 5-8, will focus on key technologies for the IoT era.

Automotive industry now the third largest end market for power semiconductors

09/03/2015  In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.

20th annual SEMICON Taiwan 2015 opens today

09/02/2015  SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

Advanced packaging and 3D-IC markets drive growth for EVG's automated 300mm polymer adhesive wafer bonding

08/31/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems.





Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers



September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:


September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Trends in Flexible and Printed Electronics

October 2015 (Date and time TBD)

Printed electronics are at a pivotal moment. There are not only tremendous opportunities for innovation and growth in new verticals and industries, but a new way of thinking about how electronics are made, combining techniques and materials used by printed electronics with those of 3D printing. Presenters will review printed electronics and discuss future directions, from smart labels and wearables, to trends and technologies that enable the printing of IoT devices with embedded sensors, transistors, displays, batteries and memory.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015