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Orbotech's SPTS Technologies honored with Queen's Award for Enterprise in Innovation 2018

04/24/2018  The award recognizes SPTS's development of novel physical vapor deposition (PVD) process solutions for Fan-Out Wafer Level Packaging (FOWLP) of semiconductor devices.

Semiconductor assembly and packaging services: Rising number of fabs is driving the market

04/23/2018  Technavio market research analysts forecast the global semiconductor assembly and packaging services market to grow at a CAGR of close to 5% during the period 2018-2022, according to their latest report.

Nexperia secures $800M financing to fund future growth plans

04/19/2018  Discrete semiconductor company’s refinancing supported by major global banks.

SEMI and TechSearch International report global semiconductor packaging materials market reaches $16.7B

04/18/2018  SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017.

Toshiba releases automotive 40V N-channel power MOSFETs in new package

04/11/2018  Reduced on-resistance from use of a small low-resistance package.

6 key takeaways from ISS Europe 2018

04/11/2018  With its leading research and development hubs, materials and equipment companies and chipmakers, the EU is in a strategic position in the global electronics value chain to support the growth of emerging applications such as autonomous driving, internet of things, artificial intelligence and deep learning.

ON Semiconductor introduces digital image sensor with low light sensitivity and signal-noise ratio

04/10/2018  ON Semiconductor introduced the industry’s first 1/1.7-inch 2.1 megapixel CMOS image sensor featuring ON Semiconductor’s newly developed 4.2μm Back Side Illuminated (BSI) pixels.

China now world's largest consumer of semiconductor packaging equipment and materials

04/02/2018  Fueled by heavy government investment, IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world's largest consumer of packaging equipment and materials.

Optoelectronics, sensors/actuators, and discretes hit record-high sales

03/29/2018  Total revenues in the three O-S-D market segments climbed 11% in 2017 -- the strongest growth rate since 2010 -- and continue to be driven by high demand for sensors, actuators, CMOS imaging devices, light sensors, laser transmitters, and power discretes.

New insights from failures

03/26/2018  To be able to guarantee the reliability of transistors, we have been conducting research for some years now at imec to see what happens when transistors operate properly and when they fail.

U.S. companies maintain largest share of fabless company IC sales

03/23/2018  China-based companies show the largest fabless IC marketshare gain since 2010.

Synopsys acquires Silicon and Beyond Private Limited

03/22/2018  Synopsys, Inc. today announced it has acquired Silicon and Beyond Private Limited, a provider of high-speed SerDes technology used in data intensive applications such as machine learning, cloud computing, and networking.

"Technology, Circuits & Systems for Smart Living" theme for 2018 Symposia on VLSI Technology & Circuits

03/21/2018  Bringing together a technical program that encompasses 'big integration' of a number of critical industry trends -- machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing -- the 2018 Symposia on VLSI Technology & Circuits will showcase a convergence of technologies needed for 'smart living.'

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3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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