3D Integration

3D INTEGRATION ARTICLES



Micron and Intel unveil new 3D NAND flash memory

03/26/2015  Micron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory.

Optoelectronics, sensors/actuators, and discretes growth accelerates

03/25/2015  After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.

NXP-Freescale merger to result in world's eighth largest chip maker

03/18/2015  The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.

Ziptronix licenses DBI hybrid bonding patents to Sony for advanced image sensor applications

03/18/2015  Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement with Sony Corporation for application in advanced image sensors.

XMC ships over 100 million units of backside illumination CMOS image sensors

03/12/2015  XMC, a 300mm semiconductor manufacturing company, today announces it has shipped over 100 million Backside Illumination (BSI) CMOS Image Sensor (CIS) units.

11 IC product categories to exceed total IC market growth in 2015

03/12/2015  IC Insights’ March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.

IRT Nanoelec and CMP team up to offer world’s first service for post-process 3D technologies on multi-project-wafer

03/05/2015  IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW).

Embedded die in substrate: Challenges are still ahead

03/03/2015  Embedded die in substrate: what are the next steps for the growth?

Freescale and NXP agree to $40 Billion merger

03/03/2015  Chipmaker NXP Semiconductors NV announced Sunday night that it has agreed to buy Freescale Semiconductor Ltd for $11.8 billion and merge business operations.

Imec demonstrates compact wavelength-division multiplexing CMOS silicon photonics transceiver

02/26/2015  This week, at the 2015 International Solid State Circuits Conference (ISSCC), imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceive

Applied Materials unveils breakthrough e-beam metrology tool for finFET transistors and 3D NAND devices

02/23/2015  At the SPIE Advanced Lithography conference in San Jose, Calif., Applied Materials, Inc., today announced the industry's first in-line 3D CD SEM metrology tool for solving the challenges of measuring the high aspect ratio and complex features of 3D NAND and FinFET devices.

Thermal performance of 3DICs

02/20/2015  3DICs are assumed to suffer from stronger thermal issues when compared to equivalent implementations in traditional single-die integration technologies.

Micron appoints Robert Peglar as Vice President of Advanced Storage Solutions

02/19/2015  Micron Technology, Inc. today announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.

Samsung announces mass production of industry’s first 14nm finFET mobile application processor

02/17/2015  Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

Amkor Technology names Susan Kim to Board of Directors

02/11/2015  Amkor Technology, Inc. today announced that Susan Y. Kim has been appointed as a new member of the Company’s Board of Directors.

Mentor Graphics launches broadest embedded systems solution for industrial automation

02/09/2015  Mentor Graphics Corporation today announced the embedded systems industry's broadest portfolio for industrial automation.

Spansion and XMC expand partnership to jointly develop 3D NAND

02/09/2015  Spansion Inc. and XMC, China's fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology.

The CMOS image sensors industry is about to change, with major investment in manufacturing & design

02/03/2015  Driven by mobile and automotive applications, the CIS industry is expected to grow at a CAGR of 10.6 percent from 2014 – 2020.

2015 outlook: Tech trends and drivers

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Amkor Technology announces settlement with Tessera

01/15/2015  Amkor Technology, Inc. today announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.




FINANCIALS



TECHNOLOGY PAPERS



High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

April 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015