3D Integration

3D INTEGRATION ARTICLES



Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

Integrated circuit technology advances continue to amaze

02/21/2018  Despite increasing costs of development, IC manufacturers are still making great strides.

Joseph Stockunas appointed to SEMI Foundation Board of Trustees

02/21/2018  Nordson Corporation announces that the SEMI Foundation has appointed Joseph Stockunas, Corporate Vice President for Electronics Systems at Nordson Corporation and the immediate past chair of the SEMI North America Advisory Board, to the SEMI Foundation Board of Trustees in accordance with the association's by-laws.

3D depth sensing & VCSEL technology surges: Key takeaways from SEMI Member Forum

02/16/2018  Since Apple unveiled iPhone X with face-recognition functionality in early November 2017, interest in 3D sensing technology has reached fever pitch and attracted huge investments across the related supply chains.

MagnaChip offers 2nd-generation 0.13 micron BCD process technology with high-density embedded flash memory

02/12/2018  MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.

Samsung begins mass production of 256GB embedded Universal Flash Storage for automotive applications

02/09/2018  Samsung Electronics Co., Ltd. today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.

SK Hynix ramps up enterprise SSDs with its 72-layer 512Gb 3D NAND flash

02/05/2018  With its 72-Layer 512Gb (Gigabits) 3D NAND Flash chips, the company is paving the way for its full-fledged entrance to the high value-added eSSD market.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

Nordson MARCH MesoSPHERE Plasma Systems enable very high throughput processing for 3D and wafer-level package assembly

02/02/2018  Nordson MARCH, a Nordson company introduces the MesoSPHERE Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level – handling wafers up to 450mm and panels up to 480mm.

Air Products to supply Samsung Electronics' second 3D V-NAND fab in western China

02/02/2018  Air Products today announced it has been awarded the industrial gases supply for Samsung Electronics' second semiconductor fab in Xi'an, Shaanxi Province, western China.

Mobile system-on-chip designs, embedded processing lift MPU market

02/01/2018  Though accounting for less than half of total MPU sales, data-handling cellphones, tablets, and MPUs for embedded processing applications to keep MPU market active through 2022.

Alpha and Omega Semiconductor announces the newest generation of XSPairFET

01/30/2018  Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package which is ideal for synchronous buck converters.

GLOBALFOUNDRIES delivering 45nm RF SOI customer prototypes for 5G applications

01/26/2018  Company's advanced 300mm RF SOI offering is ready for volume production.

Gartner says Samsung and Apple extended their lead as top global semiconductor customers in 2017

01/25/2018  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2017, representing 19.5 percent of the total worldwide market, according to Gartner, Inc.

Micron launches industry's first enterprise SATA solid state drives built on 64-layer 3D NAND technology

01/23/2018  Micron Technology, Inc. today launched the Micron 5200 series of SATA solid state drives.

Korea is at full throttle on memory investments

01/17/2018  2017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor market will have grown 20 percent, exceeding $400 billion for the first time.

Everspin begins 40nm STT-MRAM volume production

01/17/2018  Everspin Technologies, Inc., a developer and manufacturer of discrete and embedded MRAM, today announced the Company recorded revenue for its first 40nm 256Mb STT-MRAM products in the fourth quarter of 2017 and is in the process of ramping its volume production in 2018

Worldwide PC shipments declined 2% in 4Q17 and 2.8% for the year

01/12/2018  Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

SEMI European 3D Summit makes Dresden debut

12/22/2017  The SEMI European 3D Summit will make its Dresden, Germany, debut 22-24 January, 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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VIDEOS