3D Integration

3D INTEGRATION ARTICLES



Automotive industry now the third largest end market for power semiconductors

09/03/2015  In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.

20th annual SEMICON Taiwan 2015 opens today

09/02/2015  SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

Knowm First to Deliver Configurable Artificial Neural Networks using Bi-Directional Learning Memristors

09/02/2015  Breakthrough memristor technology combined with novel adaptive architecture enables machine learning (ML) and artificial intelligence (AI) applications.

Advanced packaging and 3D-IC markets drive growth for EVG's automated 300mm polymer adhesive wafer bonding

08/31/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems.

Solid State Watch: August 21-27, 2015

08/31/2015  New ams fab going to Marcy, NY: Startups and small electronics companies spent $78.3 billion on semiconductors in 2014; Pure-play foundry sales forecast to grow to all-time high in 4Q15; University of Colorado and SRC research accelerates microscopic imaging for next-generation nanoelectronics

Tessera to acquire Ziptronix for $39M

08/28/2015  The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D-IC solutions to semiconductor industry customers.

Comfortable Consumer EEG Headset Shown by Imec and Holst Centre

08/27/2015  Medical-quality data acquisition of signals tracing emotions and moods.

Managing Dis-Aggregated Data for SiP Yield Ramp

08/24/2015  In general, there is an accelerating trend toward System-in-Package (SiP) chip designs including Package-On-Package (POP) and 3D/2.5D-stacks where complex mechanical forces—primarily driven by the many Coefficient of Thermal Expansion (CTE) mismatches within and between chips and packages—influence the electrical properties of ICs.

Small electronics companies spent $78.3B on semiconductors in 2014

08/21/2015  Startups and small electronics companies spent $78.3 billion on semiconductors in 2014, representing 23 percent of the total market, compelling semiconductor companies to revisit their sales strategy to focus on the large number of smaller organizations than relying on big deals from large customers, research firm Gartner said.

Book-to-bill ratio reports indicate a solid year for the industry

08/20/2015  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

Update for exporters: Trade wins and delays

08/18/2015  With trade policy dominating headlines in recent weeks, all eyes were on Maui in the waning days of August as trade ministers from twelve nations convened for perhaps the final time to finalize the Trans-Pacific Partnership (TPP).

Leon Panetta to deliver keynote address at annual SIA Award Dinner

08/18/2015  The Semiconductor Industry Association (SIA) announced former Defense Secretary Leon Panetta will deliver the keynote address at the upcoming SIA Award Dinner, taking place on Thursday, Dec. 3 in San Jose, Calif.

Comparison 1Y nanometer NAND architecture and beyond

08/17/2015  Do we still think the 2D NAND Flash technologies have hit the scaling wall?

Rice U. discovery may boost memory technology

08/11/2015  Scientists at Rice University have created a solid-state memory technology that allows for high-density storage with a minimum incidence of computer errors.

Samsung Begins Mass Producing Industry First 256-Gigabit, 3D V-NAND

08/11/2015  Samsung Electronics has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).

Toshiba launches 16MP CMOS image sensors targeting smartphones and tablets

08/10/2015  Designed for use in smartphones and tablets, the backside-illuminated (BSI) chips are among the world's smallest class of CMOS image sensors, and achieve both high-performance image capture and low power consumption.

Toshiba develops world's first 16-die stacked NAND flash memory with TSV tech

08/06/2015  Toshiba Corporation today announced the development of the world’s first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology.

STATS ChipPAC appoints co-president and CEO

08/05/2015  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today the promotion and appointment of Dr. Han Byung Joon as Co-President and Chief Executive Officer for the Company, together with Mr. Tan Lay Koon.

Samsung 3D TSV stacked DDR4 DRAM: the first analyzed memory product with via- middle TSV

07/31/2015  According to Yole, 3D TSV technology is expected to reach $4.8B billion in revenues by 2019.

SEMICON West: The road forward is 3DIC

07/31/2015  SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015