3D Integration

3D INTEGRATION ARTICLES



Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

01/20/2017  Breakthrough results pave the way to multi-layer 3D ICs with high density interconnects realized by automated wafer-to-wafer bonding technology.

Analog Devices announces changes to membership of Board of Directors

01/19/2017  Richard Beyer and John Hodgson will retire from the Company's Board of Directors, effective as of the Company's 2017 Annual Meeting of Shareholders.

TechSearch International analysis predicts growth for fan-in and FO-WLP

01/19/2017  TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan- out WLP (FO-WLP).

Fire, rain, and M&A 

01/19/2017  The expert panel, "The Future of M&A in the Semiconductor Industry," was a hot topic at SEMI's Industry Strategy Symposium (ISS) conference on January 11.

$24B semiconductor assembly and testing services market poised for steady growth

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

Pure-play foundry market surges 11% in 2016 to reach $50B

01/12/2017  X-Fab, SMIC, and TowerJazz each grew by ≥30% last year.

Memory market poised for strongest annual growth through 2021

01/09/2017  Solid upside potential for DRAM, flash memory markets in 2017 and much of forecast period.

ON Semiconductor, Hexius Semiconductor expand scope of analog functionality for next gen mixed signal ASICs

01/09/2017  ON Semiconductor announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process.

Telecommunications light amplifier could strengthen integrity of transmitted data

01/05/2017  Imagine a dim light which is insufficiently bright enough to illuminate a room. An amplifier for such a light would increase the brightness by increasing the number of photons emitted. Photonics researchers have created such a high gain optical amplifier that is compact enough to be placed on a chip. The developed amplifier would help to efficiently increase the power of the transmitted light before it is completely depleted through optical losses.

2017 Symposia on VLSI Technology & Circuits opens online submission for papers

01/05/2017  Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits, to be held at the Rihga Royal Hotel in Kyoto, Japan from June 5 - 8, 2017.

Mentor Graphics Joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/22/2016  Mentor Graphics Corp. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

GLOBALFOUNDRIES expands Partner Program to speed time-to-market of FDX solutions

12/16/2016  GLOBALFOUNDRIES today announced the addition of eight new partners to its growing FDXcelerator Program, including Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Rambus, Sasken, Sonics, and QuickLogic.

North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

Embedded die: From incubation to high volume production

12/15/2016  Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms.

Linde Korea acquires Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business

12/15/2016  Linde Korea, a member of The Linde Group, today announced that it has completed the takeover of Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business in South Korea.

Amkor completes product qualification of SWIFT packaging

12/14/2016  Amkor Technology, Inc. today announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT).

Global Semiconductor Alliance announces 2016 Award recipients

12/09/2016  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2016 GSA Awards Dinner Celebration that took place in Santa Clara, California.

ClassOne reports record sales, crediting WLP and "More than Moore"

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

Five suppliers to hold 41% of global semiconductor marketshare in 2016

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

Tessera completes acquisition of DTS

12/02/2016  Tessera Holding Corporation today announced it has completed the acquisition of DTS, Inc.




TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS