3D Integration

3D INTEGRATION ARTICLES



Surface matters: Huge reduction of heat conduction observed in flat silicon channels

04/23/2015  A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.

ITRS 2.0: Top-Down System Integration

04/22/2015  ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

Synopsys' modeling of 10nm parasitic variation effects ratified by open-source standards board

04/21/2015  Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node.

SOI: Revolutionizing RF and expanding in to new frontiers

04/17/2015  SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

Solid State Watch: April 10-16, 2015

04/17/2015  SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne enters ECD lab partnership with Shanghai Sinyang

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

KLA-Tencor introduces new portfolio for advanced semiconductor packaging

04/16/2015  Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

A*STAR's IME and partners to enable low cost packaging technology for system scaling within smart devices

04/15/2015  A*STAR’s Institute of Microelectronics (IME), together with industry partners, have formed a High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium to extend FOWLP capabilities for applications in devices such as smart phones, tablets, navigation tools and gaming consoles.

ClassOne enters ECD lab partnership with Shanghai Sinyang

04/14/2015  Semiconductor equipment manufacturer ClassOne Technology announced today that it has signed a joint electrochemical deposition (ECD) applications lab agreement with Shanghai Sinyang Semiconductor Materials Co., Ltd.

Duke University research advances testing of 3D integrated circuits for cost-effective development of electronics

04/14/2015  Duke University researchers are working to advance the tools and methodologies used to test 3D integrated circuits (ICs), which promise to help ensure the ongoing development of higher performance, lower power semiconductor chips.

Solid State Watch: April 3-9, 2015

04/10/2015  SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC certifies Synopsys design tools for 16nm finFET plus production

Consider packaging requirements at the beginning, not the end, of the design cycle

04/02/2015  Consider these eight issues where the packaging team should be closely involved with the circuit design team.

Imaging tomorrow’s components, acoustically

04/02/2015  Packages are changing. Acoustic methods provide a way to image and analyze them.

Supplier Hub answers the needs of a changing semiconductor industry

04/02/2015  Supplier Hub answers the needs of a changing semiconductor industry.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

Micron and Intel unveil new 3D NAND flash memory

03/26/2015  Micron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

Optoelectronics, sensors/actuators, and discretes growth accelerates

03/25/2015  After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.

NXP-Freescale merger to result in world's eighth largest chip maker

03/18/2015  The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.

Ziptronix licenses DBI hybrid bonding patents to Sony for advanced image sensor applications

03/18/2015  Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement with Sony Corporation for application in advanced image sensors.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Interconnects

July 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015