3D Integration

3D INTEGRATION ARTICLES



Synopsys' IC Compiler II certified for TSMC's 12nm process technology

03/16/2017  Synopsys, Inc. today announced that TSMC has certified the complete suite of products in the Synopsys Galaxy Design Platform for the most current version of 12nm FinFET process technology.

Synopsys and TSMC collaborate to develop interface, analog and foundation IP for 12nm finFET process

03/16/2017  Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with TSMC to develop DesignWare Interface, Analog and Foundation IP for TSMC's 12FFC process.

STATS ChipPAC achieves 1.5B unit milestone in fan-out wafer level packaging shipments

03/15/2017  STATS ChipPAC Pte. Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB).

Cadence achieves certification for TSMC's 7nm process technology

03/14/2017  Cadence Design Systems, Inc. today announced several new capabilities resulting from its close collaboration with TSMC to further 7nm FinFET design innovation for mobile and high-performance computing (HPC) platforms.

Walker discusses emergence of new business models in semiconductor industry

03/14/2017  Jim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.

Cadence expands capabilities of integrated design and analysis flow for TSMC InFO packaging technology

03/13/2017  Cadence Design Systems, Inc. today announced new optimization capabilities within its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

NXP launches single-chip SoC with integrated microcontroller

03/09/2017  NXP Semiconductors today announced the world's smallest single-chip SoC solution -- the MC9S08SUx microcontroller (MCU) family -- with an integrated 18V-to-5V LDO and MOSFET pre-driver that delivers ultra-high-voltage solution for drones, robots, power tools, DC fan, healthcare and other low-end brushless DC electric motor control (BLDC) applications.

Eutelsat, ST announce low-cost, low-power System-on-Chip for interactive satellite terminals

03/08/2017  ST and Eutelsat complete development of chip for Eutelsat's next-generation SmartLNB.

Mentor Graphics Launches Unique Xpedition PCB Systems Vibration and Acceleration Simulation Solution

03/06/2017  Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.

January semiconductor sales up 14% compared to last year

03/06/2017  Year-to-year growth is market's largest since November 2010; month-to-month sales decrease slightly.

Imec presents InGaAs TFET with sub-60 mV/decade sub-threshold swing

03/06/2017  Promising alternative for MOSFET in future ultralow power chips.

Advanced substrates: A key enabler of future advanced packaging solutions

03/03/2017  Yole analysts provide an overview of advanced substrate technologies, markets, and supply chain.

Dream Chip Technologies presents first 22nm FD-SOI silicon of new automotive driver assistance SoC

02/27/2017  Dream Chip Technologies announced today the presentation of the industry`s first 22nm FD-SOI silicon for a new ADAS System-on-Chip (SoC) for automotive computer vision applications at the Mobile World Congress in Barcelona.

Picosun and Hitachi MECRALD Process

02/24/2017  ALD fab films at lower temperatures.

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

3D processing at Tohoku U

02/20/2017  At the recent IEEE 3DIC Conference, Koyanagi and co-workers at Tohoku Univ reported on their studies of Ti as a 3D TSV barrier layer.

Invensas announces Teledyne DALSA sign DBI technology transfer and license agreement

02/17/2017  Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

GE Ventures and Samsung Electro-Mechanics announce global microelectronics packaging patent agreement

02/17/2017  With this partnership, SEMCO will license GE microelectronics packaging patent portfolio, covering the fabrication of substrates embedded with electronic circuits.

Huge growth in cloud memory changes semiconductor supply chain

02/17/2017  The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.

Vital Control in Fab Materials Supply-Chains - Part 2

02/16/2017  Expert panel discussion at Critical Materials Council (CMC) Conference




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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VIDEOS