3D Integration

3D INTEGRATION ARTICLES



Mentor OSAT Alliance program streamlines IC high-density advanced packaging design and manufacturing

06/05/2017  Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs.

Engineer unveils new spin on future of transistors with novel design

06/05/2017  All-carbon, spintronic proposal could lead to smaller, better performing structures in electronics.

Seeing the invisible with a graphene-CMOS integrated device

06/05/2017  Flagship researchers integrate graphene and quantum dots with CMOS technology to create an array of photodetectors, producing a high resolution image sensor.

"Billion Dollar Capex Club" forecast to swell to 15 companies in 2017

06/01/2017  Top spenders expected to represent 83% of total semiconductor industry spending this year.

Volatility in electronic equipment supply chain

06/01/2017  SEMI’s year-to-date worldwide semiconductor equipment billings year-to-date through March show a 59.6 percent gain to the same period last year.

Imec and Cascade Microtech develop first automatic probe system for advanced 3D chips

05/31/2017  Imec and Cascade announced the successful development of a fully-automatic system for pre-bond testing of advanced 3D chips.

2017 automotive IC market on pace for record year

05/31/2017  22% forecast increase driven by system growth, rising ASPs for memory and logic devices.

Synopsys IC Validator physical signoff verifies 10 billion+ transistors within hours

05/11/2017  Synopsys, Inc. today announced that its IC Validator was successfully deployed on some of the industry's largest and most advanced designs to accelerate design rule checking (DRC) closure.

Reducing down to 1/3 of thermal resistance by WOW technology for 3D DRAM application

04/24/2017  Researchers at Tokyo institute of Technology presented a design guide for reducing 30% of thermal resistance for 3-dimensional (3D) stacked devices compared with the conventional ICs using solder bump joint structure.

Samsung completes qualification of its 2nd gen 10nm process technology

04/19/2017  Samsung expands 10nm capacity, to be ready for production by the fourth quarter of this year.

Global ESD packaging market driven by the miniaturization of semiconductors, says Technavio

04/17/2017  According to the latest market study released by Technavio, the electrostatic discharge (ESD) packaging market is projected to grow to USD 5.42 billion by 2021, at a CAGR of more than 8% over the forecast period.

DDR4 set to account for largest share of DRAM market by architecture

04/14/2017  DDR4 and DDR3 forecast to represent 97% of sizzling 2017 DRAM market.

2016: The MOSFETs market recovered

04/13/2017  In 2016, the MOSFET market recovered, after a minor downturn in 2015.

Cadence unveils expanded Virtuoso Advanced-Node Platform for 7nm processes

04/05/2017  Cadence Design Systems, Inc. today announced the release of the new Virtuoso Advanced-Node Platform supporting advanced 7nm designs.

A novel method for the fabrication of active-matrix 3-D pressure sensors

04/05/2017  A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

Advanced packaging industry: What we could expect in 2017

04/04/2017  2016 was the year of strong consolidations in the semiconductor industry. Yole Developpement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.

IEEE unveils next lifecycle phase of the IRDS to drive computing industry beyond Moore’s Law

03/31/2017  Series of nine white papers mark milestone effort for strategic initiative that identifies challenges and solutions to help guide future roadmaps.

Semiconductor industry sets out research needed to advance emerging technologies

03/30/2017  New SIA-SRC report calls for robust research investments throughout the semiconductor industry and value chain.

IC Insights more than doubles its 2017 IC market growth forecast

03/30/2017  Huge spike in DRAM and NAND flash ASPs prompts market forecast revision to 11% increase.

Synopsys' IC Validator used for physical sign-off on more than 100 finFET production tapeouts

03/29/2017  Synopsys, Inc. today announced that its IC Validator physical verification product has been successfully used for signoff on more than 100 tapeouts at advanced FinFET nodes.




TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS