3D Integration

3D INTEGRATION ARTICLES



GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory solution

08/09/2017  GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

Toshiba announces next generation client SSD with 64-layer 3D Flash memory

08/08/2017  Toshiba America Electronic Components, Inc. (TAEC) announces the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH to deliver better transfer speeds and power efficiency.

IntelliProp announces Gen-Z persistent memory controller combining DRAM and NAND

08/08/2017  This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.

Overcoming challenges in 3D NAND volume manufacturing

07/27/2017  As 3D NAND becomes the mainstream technology, its challenging roadmap poses opportunities for continued innovation.

Laser debonding for ultrathin and stacked fan out packages

07/27/2017  Fan-out packaging is an established technology for many mobile applications. Whereas early semiconductor packages have been single-chip packages, the continuing trend of expanding the wiring surface to support increased functionality has led to more complex packages, stacked packages, systems inpackageaswellashigh-performancepackages. With this development, fan-out technology is bridging a gap between cost-competitive packaging and high performance.

Gartner reports worldwide PC shipments declined 4.3% in second quarter of 2017

07/21/2017  Worldwide PC shipments totaled 61.1 million units in the second quarter of 2017, a 4.3 percent decline from the second quarter of 2016, according to preliminary results by Gartner, Inc.

2017 IEEE IEDM to showcase technology and device breakthroughs in logic, memory, bioelectronics, silicon photonics

07/20/2017  Advances in semiconductor and related devices are driving significant progress in our increasingly digital world, and the place to learn about cutting-edge research in the field is the annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel.

Taiwan largest semiconductor materials market, as SEMICON Taiwan approaches

07/19/2017  Taiwan is the world's largest consumer of semiconductor materials for the seventh consecutive year, bringing new opportunities in this increasingly critical sector.

2H17 DRAM, NAND ASP growth to cool, but yearly growth strong

07/18/2017  Record annual ASP growth rates forecast for both memory segments.

Hamburg researchers develop new transistor concept

07/17/2017  Transistors, as used in billions on every computer chip, are nowadays based on semiconductor-type materials, usually silicon. As the demands for computer chips in laptops, tablets and smartphones continue to rise, new possibilities are being sought out to fabricate them inexpensively, energy-saving and flexibly.

PLAT4M matures three silicon photonic platforms

07/14/2017  Leti today announced that the European FP7 project PLAT4M has now been completed with results that exceeded expectations.

How low can we go?

07/11/2017  In the advanced CMOS technology programs ongoing in the Belgium city of Leuven, imec works to extend the building-blocks of integrated circuits (IC).

Leti and Fraunhofer team up to strengthen microelectronics innovation in France and Germany

06/29/2017  Two European research institutes today announced their new collaboration to develop innovative, next-generation microelectronics technologies to spur innovation in their countries and strengthen European strategic and economic sovereignty.

It’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

Synopsys, GlobalFoundries collaborate to deliver design platform and IP enablement for 7nm finFET process

06/20/2017  Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare Embedded Memory IP on GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET process technology.

Cellphone IC sales will top total personal computing in 2017

06/20/2017  Higher memory prices accelerate sales growth in both cellphones and personal computing systems but cellular handsets will become the largest application for ICs this year.

What TechInsights analysts are watching in 2017

06/19/2017  TechInsights analysts share their view on where technology is going, how it’s changing, and what new developments are emerging.

HPC, chiplets and interposers

06/15/2017  The need for ever more computational power continues to grow and exaflop (1018 ) capabilities may soon become necessary.

Advanced packaging brings more value and cost reduction to future semiconductor products

06/15/2017  Yole Developpement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022: +7% in revenue.

GLOBALFOUNDRIES on track to deliver Leading-Performance 7nm FinFET technology

06/14/2017  GLOBALFOUNDRIES this week announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018

VIDEOS