NEWS ANALYSIS & FEATURES


TSMC approved to build 12-in wafer fab in China

02/05/2016  Taiwan's Investment Commission on Wednesday gave Taiwan Semiconductor Manufacturing Co. (TSMC) approval to build its first 12-inch wafer fab in mainland China.

The iron stepping stones to better wearable tech without semiconductors

02/05/2016  The road to more versatile wearable technology is dotted with iron. Specifically, quantum dots of iron arranged on boron nitride nanotubes (BNNTs).

Panel level packaging: The high volume manufacturing roadmap has yet to be built

02/05/2016  When will the panel industry take off? How will it evolve?

ON Semiconductor extends tender offer to acquire Fairchild Semiconductor

02/04/2016  Extension of tender offer pursuant to previously executed merger agreement.

Researchers develop hack-proof RFID chips

02/04/2016  New technology could secure credit cards, key cards, and pallets of goods in warehouses.

Scientists guide gold nanoparticles to form 'diamond' superlattices

02/04/2016  Scientists have devised a way to trap and arrange nanoparticles in a way that mimics the crystalline structure of diamond. The achievement of this complex yet elegant arrangement may open a path to new materials that take advantage of the optical and mechanical properties of this crystalline structure for applications such as optical transistors, color-changing materials, and lightweight yet tough materials.

Microchip Technology appoints Ganesh Moorthy to President and COO

02/04/2016  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that its Board of Directors has appointed Ganesh Moorthy as President and Chief Operating Officer effective today.

Researchers discover new phase of boron nitride and a new way to create pure c-BN

02/03/2016  Researchers at North Carolina State University have discovered a new phase of the material boron nitride (Q-BN), which has potential applications for both manufacturing tools and electronic displays.

Gartner says worldwide wearable devices sales to grow 18.4 percent in 2016

02/03/2016  Gartner, Inc. forecasts that 274.6 million wearable electronic devices will be sold worldwide in 2016, an increase of 18.4 percent from 232.0 million units in 2015.

Self-calibrated 10 Mbit/s phase modulator exceeds state-of-the-art performance

02/03/2016  At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a self-calibrated high-speed (10Mbits/s) phase modulator achieving an excellent Error Vector Magnitude (EVM) of -37dB at 10.25 GHz.

Imec and Vrije Universiteit Brussel present small, low-cost, low-power chip for multi-gigabit 60GHz communication

02/03/2016  At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a four-antenna path beamforming transceiver for 60GHz multi Gb/s communication in 28nm CMOS technology.

Presto Engineering expands turnkey IC production management services with three new operations in Asia

02/02/2016  Presto Engineering Inc. announced this week that it has significantly expanded its turnkey capabilities with the opening of two new manufacturing hubs and a world-wide logistics center in Asia.

Spin dynamics in an atomically thin semiconductor

02/02/2016  Researchers at the National University of Singapore and Yale-NUS College have established the mechanisms for spin motion in molybdenum disulfide, an emerging 2-dimensional material.

Nova selected by a leading foundry for its most advanced 10nm and 7nm FinFET nodes

02/02/2016  Nova Measuring Instruments, a provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today that a leading foundry recently selected Nova's optical and X-ray metrology solutions for multiple process steps.

TowerJazz completes acquisition of Maxim's San Antonio fabrication facility

02/02/2016  TowerJazz, the global specialty foundry leader, announced today that it completed its previously announced acquisition of an 8-inch wafer fabrication facility in San Antonio, Texas, United States from Maxim Integrated Products, Inc.

Electrons and liquid helium advance understanding of zero-resistance

02/01/2016  The end of Moore's Law -- the prediction that transistor density would double every two years -- was one of the hottest topics in electronics-related discussions in 2015.

ISS Europe 2016: Reaching into a new era

02/01/2016  At the SEMI Industry Strategy Symposium Europe (SEMI ISS Europe) on 6-8 March, industry experts will delve into the disruptions and opportunities impacting the electronics manufacturing supply chain.

Epiluvac and SAMCO collaborate to offer processing equipment for WBG materials in Nordic countries

02/01/2016  Sweden-based SiC CVD developer and manufacturer Epiluvac AB has entered into a collaboration with SAMCO, a semiconductor process equipment developer and manufacturer based in Japan, in which Epiluvac will introduce new clients to SAMCO in Sweden, Norway, Finland and Denmark.

Quantum dot market worth $4.6B by 2021

01/29/2016  The global value of quantum dot markets was $306 million USD in 2014 and is expected at $4.6 billion USD over the forecast period due to the subsequent generation device, display, and system activated by quantum dot.

A new approach to chip fabrication

01/29/2016  MIT researchers and their colleagues report the first chip-fabrication technique that enables significantly different materials to be deposited in the same layer.





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Latest Article

Nova selected by a leading foundry for its most advanced 10nm and 7nm FinFET nodes

02/02/2016  Nova Measuring Instruments, a provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today that a leading foundry recently selected Nova's optical and X-ray metrology solutions for multiple process steps.

Ultratech and Qoniac jointly develop 3D lithography APC solution

01/28/2016  Ultratech, Inc. and Qoniac GmbH announced that the companies are jointly developing a 3D lithography advanced process control (APC) solution for advanced 3D CMOS manufacturing.

Entegris announces new post-CMP cleaning solutions

01/26/2016  Entegris, Inc., a developer of yield-enhancing materials and solutions, today announced new post-chemical mechanical planarization (post-CMP) cleaning solutions for semiconductor manufacturing.

Memristor Variants and Models from Knowm

01/22/2016  Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

01/20/2016  ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Pfeiffer Vacuum presents innovative vacuum solutions at the trade fairs Semicon Korea and Semicon China

01/18/2016  Pfeiffer Vacuum, a global supplier of vacuum technology, will be exhibiting at the SEMICON Korea Trade Fair in Seoul from January 27 to 29 and Semicon China in Shanghai from March 15 to 17.

Stanford researchers advance area selective ALD to develop more energy efficient electronics

01/12/2016  Stanford University researchers sponsored by Semiconductor Research Corporation (SRC) have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.

AKHAN Semiconductor deploys 200mm manufacturing process in new diamond-based chip production facility

01/08/2016  AKHAN Semiconductor, Inc. this week announced that it is deploying 200mm manufacturing equipment and process in its new production facility in Gurnee, Illinois, continuing its preparation for delivering AKHAN diamond semiconductor based-technology products to the company’s first commercial customer this quarter.

The Critical Materials Council to be managed by TECHCET in 2016

01/07/2016  The Critical Materials Council for Semiconductor Fabricators, originally established by ISMI/SEMATECH in the early 1990’s, will be managed by TECHCET CA LLC starting January 01, 2016.

Facilities

01/06/2016  Semiconductor manufacturing facilities or wafer “fabs” are huge affairs costing billions of dollars.

Automated Test Equipment

01/06/2016  Automatic or automated test equipment (ATE) is a system that performs tests on a device, known as the Device Under Test (DUT), using automation to quickly perform measurements and evaluate the test results.

Lithography

01/06/2016  Lithography is used to create a pattern on the wafer.

EUV, multiple patterning, integrated circuits among topics for SPIE Advanced Lithography 2016

01/06/2016  EUV lithography is on the threshold of becoming a mainstream patterning technology for sub-10nm chips, featured speaker Anthony Yen of Taiwan Semiconductor Manufacturing Co. (TSMC) will tell fellow attendees at SPIE Advanced Lithography 2016.

Rudolph Technologies receives order for multiple NSX 330 Systems in Asia

01/05/2016  Rudolph Technologies, Inc., has received an order for over $15 million from a foundry in Asia for multiple NSX 330 Systems.

Startup Works on Ultralow-k Materials for Chips, Displays

12/21/2015  The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.

3D ASIP Conference Hears from EDA, IC Gear Companies

12/18/2015  John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.

SPTS Technologies installs a 300mm MEMS vapor HF etch release solution at CEA-Leti

12/18/2015  SPTS Technologies has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development.

Packaging Conference Addresses Challenges, Opportunities in New Technologies

12/18/2015  On the second day of the 12th annual 3D ASIP conference, the heavy hitters came out to talk. Attendees heard presentations from executives of Amkor Technology, the Defense Advanced Research Projects Agency (DARPA), Northrop Grumman, Taiwan Semiconductor Manufacturing, Teledyne Scientific & Imaging, and Xilinx, among other companies.

Conference Features "The Year of Stacked Memory" in 2015

12/17/2015  The theme of this year's 3D Architectures for Semiconductor Integration and Packading (3D ASIP) conference is "The Year of Stacked Memory," noting how memory die stacked in one package are becoming more commonplace in 2015.





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LithoVision 2016
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SEMI-THERM 32
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March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
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March 15, 2016 - March 17, 2016
SID Display Week 2016
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May 22, 2016 - May 27, 2016

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