NEWS ANALYSIS & FEATURES


Cheaper and easier way found to make plastic semiconductors

04/25/2018  Cheap, flexible and sustainable plastic semiconductors will soon be a reality thanks to a breakthrough by chemists at the University of Waterloo.

North American semiconductor equipment industry posts March 2018 billings

04/25/2018  "March 2018 monthly billings for North American equipment manufacturers remain at robust levels," said Ajit Manocha, president and CEO of SEMI.

Global expansion at more subdued pace

04/25/2018  Most key countries/regions saw a slowdown in growth in March based on their respective Purchasing Managers Indices. And in one case – South Korea – manufacturing moved into contraction.

Getting electrons to move in a semiconductor

04/24/2018  Gallium oxide shows high electron mobility, making it promising for better and cheaper devices.

MicroDevices expands fabrication capability with high rate etcher

04/24/2018  Sensera Inc. (MicroDevices) has acquired and qualified a SPTS ASE-HRM etch platform. This etcher adds capability to the fab that was previously outsourced to partners.

Orbotech's SPTS Technologies honored with Queen's Award for Enterprise in Innovation 2018

04/24/2018  The award recognizes SPTS's development of novel physical vapor deposition (PVD) process solutions for Fan-Out Wafer Level Packaging (FOWLP) of semiconductor devices.

Semiconductor expert Johan Lodenius enters the Board of disruptive Swedish IR sensor developer JonDeTech

04/23/2018  Johan Lodenius is joining the Board of JonDeTech, a Swedish company that develops and markets IR sensor technology based on nanotechnology aimed at consumer electronics and mobile phone mass markets.

Under construction: Intel’s largest water recycling plant

04/23/2018  Intel’s huge water recycling plant, now under construction in Hillsboro, Oregon, is a key step toward meeting the company’s long-term water reduction and recycling goals.

Semiconductor assembly and packaging services: Rising number of fabs is driving the market

04/23/2018  Technavio market research analysts forecast the global semiconductor assembly and packaging services market to grow at a CAGR of close to 5% during the period 2018-2022, according to their latest report.

Shipment area of AMOLED panel expected to more than quadruple by 2024

04/23/2018  With demand growing for active matrix organic light-emitting diode (AMOLED) TV panels, shipments of overall AMOLED panels by area is forecast to more than quadruple to 22.4 million square meters by 2024 from 5.0 million square meters in 2017.

Graphene sets a new record on squeezing light to one atom

04/23/2018  In a recent study published in Science, researchers at ICFO - The Institute of Photonic Sciences in Barcelona, Spain, along with other members of the Graphene Flagship, reached the ultimate level of light confinement. They have been able to confine light down to a space one atom, the smallest possible. This will pave the way to ultra-small optical switches, detectors and sensors.

Semiconductor Industry Association recognizes Senator Mike Crapo, Congressman Peter Roskam with Congressional Leadership Awards

04/20/2018  The Semiconductor Industry Association (SIA) this week presented its Congressional Leadership Awards to Senator Mike Crapo (R-Idaho) and Congressman Peter Roskam (R-Ill.) for their leadership in enacting tax reform legislation, the Tax Cuts and Jobs Act of 2017.

Mobile Semiconductor's 22nm ULL memory compiler joins the GlobalFoundries FDXcelerator Partner Program

04/20/2018  This new embedded SRAM technology on 22nm FDX offers the best in class memory solution using the GLOBALFOUNDRIES low leakage FDSOI bit cells and ultra-low leakage devices.

Versum Materials celebrates the grand opening of its research and development facility in Hometown, PA

04/20/2018  Versum Materials, Inc. announced today the grand opening of its new research and development (R&D) facility at its semiconductor materials manufacturing site in Hometown, Pennsylvania.

Kulicke & Soffa receives the 2017 Texas Instruments Supplier Excellence Award

04/20/2018  Kulicke & Soffa Industries, Inc. announced today that it has received the highest level of recognition, the prestigious 2017 Supplier Excellence Award, from Texas Instruments.

Robot developed for automated assembly of designer nanomaterials

04/20/2018  A current area of intense interest in nanotechnology is van der Waals heterostructures, which are assemblies of atomically thin two-dimensional (2D) crystalline materials that display attractive conduction properties for use in advanced electronic devices.

New research could literally squeeze more power out of solar cells

04/20/2018  Physicists at the University of Warwick have published new research in the journal Science April 19, 2018, (via the Journal's First Release pages) that could literally squeeze more power out of solar cells by physically deforming each of the crystals in the semiconductors used by photovoltaic cells.

Nexperia secures $800M financing to fund future growth plans

04/19/2018  Discrete semiconductor company’s refinancing supported by major global banks.

Building crystals on a very hot surface

04/19/2018  A chemical reactor that operates at extremely high temperatures is being developed by KAUST and could improve the efficiency and economy of a commonly used process in the semiconductor industry, with flow-on benefits for Saudi Arabia's chemical industry.

Flexible TVs and high performance wearable smart tech one step closer

04/19/2018  Flexible televisions, tablets and phones as well as 'truly wearable' smart tech are a step closer thanks to a nanoscale transistor created by researchers at The University of Manchester and Shandong University in China.



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Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.





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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

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WEBCASTS

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April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

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Thursday, May 17, 2018 at 1:00 p.m. ET

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Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018
Display Week 2018
Los Angeles, CA
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May 20, 2018 - May 25, 2018
Design Automation Conference 2018
San Francisco, CA
https://dac.com
June 24, 2018 - June 28, 2018


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