NEWS ANALYSIS & FEATURES


New low-cost technique converts bulk alloys to oxide nanowires

01/20/2017  A simple technique for producing oxide nanowires directly from bulk materials could dramatically lower the cost of producing the one-dimensional (1D) nanostructures.

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

01/20/2017  Breakthrough results pave the way to multi-layer 3D ICs with high density interconnects realized by automated wafer-to-wafer bonding technology.

Analog Devices announces changes to membership of Board of Directors

01/19/2017  Richard Beyer and John Hodgson will retire from the Company's Board of Directors, effective as of the Company's 2017 Annual Meeting of Shareholders.

TechSearch International analysis predicts growth for fan-in and FO-WLP

01/19/2017  TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan- out WLP (FO-WLP).

Market for power semiconductors in automotive to rev up by $3B by 2022

01/19/2017  Demand to soar due to big electrification in vehicles.

New research helps to meet the challenges of nanotechnology

01/19/2017  Research helps to make the most of nanoscale catalytic effects for nanotechnology.

Creating atomic scale nanoribbons

01/19/2017  Researchers have demonstrated the first important step toward integrating atomically precise graphene nanoribbons (APGNRs) onto nonmetallic substrates.

Large area displays market to witness growth owing to the high investments in OLED displays

01/18/2017  According to the latest market study released by Technavio, the global large area displays market is expected to reach USD 78.41 billion by 2021, growing at a CAGR of close to 2%.

AGC unveils innovative glass substrates for semiconductor packaging

01/18/2017  AGC Asahi Glass (AGC), a manufacturer of glass, chemicals and high-tech materials, today announced it has developed a diverse line of glass substrates specifically designed for semiconductor packaging applications and semiconductor manufacturing process support.

Mentor Graphics CEO Walden C. Rhines named IEEE Fellow

01/17/2017  Dr. Rhines is being recognized for leadership and technology innovation in integrated circuit design and automation.

Dressing a metal in various colors

01/17/2017  DGIST research developed a technology to coat metal with several nanometers of semiconducting materials.

Nanotechnology: Lighting up ultrathin films

01/17/2017  Based on a study of the optical properties of novel ultrathin semiconductors, researchers of Ludwig-Maximilians-Universitaet (LMU) in Munich have developed a method for rapid and efficient characterization of these materials.

ams launches world’s first digital multispectral sensor-on-chip leveraging breakthrough wafer-level filter technology

01/17/2017  ams AG today launched the world's first series of cost-effective multispectral sensor-on-chip solutions, opening the way for a new generation of spectral analyzers for consumer and industrial applications.

Dow Corning expands LED packaging design options with launch of new silicone coatings

01/17/2017  Dow Corning significantly expanded the design flexibilities for LED packaging manufacturers today with the addition of three new highly reflective silicone coatings to its fast-growing portfolio of advanced LED solutions.

$24B semiconductor assembly and testing services market poised for steady growth

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

IBM releases new all-flash storage for cognitive workloads

01/13/2017  IBM this week announced new, all-flash storage solutions designed for midrange and large enterprises, where high availability, continuous up-time, and performance are critical.

NUS researchers achieve major breakthrough in flexible electronics

01/13/2017  New classes of printable electrically conducting polymer materials make better electrodes for plastic electronics and advanced semiconductor devices.

Toshiba expands lineup of industrial-grade e-MMC embedded NAND flash memory products

01/12/2017  Toshiba America Electronic Components, Inc. this week announced the launch of its JEDEC e-MMCTM Version 5.1-compliant embedded NAND flash memory products that feature an enhanced operational temperature range of -40°C to +105°C.

Technavio releases market research report and forecast on gallium arsenide components

01/12/2017  The global gallium arsenide (GaAs) components market is expected to grow at a CAGR of over 4% during the forecast period, according to Technavio’s latest report.

Worldwide semiconductor capital spending is forecast to grow 2.9% in 2017

01/12/2017  Worldwide semiconductor capital spending is projected to increase 2.9 percent in 2017, to $69.9 billion, according to Gartner, Inc.



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Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

12/01/2016  ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.





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VIDEOS

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What You Should Know About 802.11ax

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EVENTS

LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
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http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

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