NEWS ANALYSIS & FEATURES


Engineer improves rechargeable batteries with MoS2 nano 'sandwich'

04/17/2015  The key to better cellphones and other rechargeable electronics may be in tiny "sandwiches" made of nanosheets, according to mechanical engineering research from Kansas State University.

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale

04/17/2015  Total top 10 marketshare of semiconductor industry now back over 50 percent.

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

San'an licenses Japanese LED patent portfolio to Luminus Devices

04/16/2015  San'an Optoelectronics Co., Ltd. today announced that it has licensed the United States patents of an LED patent portfolio it recently acquired from a major Japanese company to its subsidiary, Luminus Devices, Inc.

Semiconductor CEOs urge congress to enact Trade Promotion Authority

04/16/2015  The SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter today to congressional leaders expressing support for the legislation and urging its swift passage.

KLA-Tencor introduces new portfolio for advanced semiconductor packaging

04/16/2015  Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

Samsung Galaxy S6 Edge pricier to build, cheaper to buy than comparable Apple iPhone 6 Plus

04/16/2015  The recently released Samsung Galaxy S6 Edge is the most expensive Galaxy S line smartphone yet built, but has a lower retail price than a comparable iPhone 6 Plus, according to a preliminary estimate by IHS and its Technology Mobile Handsets Intelligence Service.

A*STAR's IME and partners to enable low cost packaging technology for system scaling within smart devices

04/15/2015  A*STAR’s Institute of Microelectronics (IME), together with industry partners, have formed a High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium to extend FOWLP capabilities for applications in devices such as smart phones, tablets, navigation tools and gaming consoles.

Solution-grown nanowires make the best lasers

04/14/2015  Take a material that is a focus of interest in the quest for advanced solar cells. Discover a "freshman chemistry level" technique for growing that material into high-efficiency, ultra-small lasers. The result, disclosed Monday, April 13 in Nature Materials, is a shortcut to lasers that are extremely efficient and able to create many colors of light.

Quantization of 'surface Dirac states' could lead to exotic applications

04/14/2015  Researchers from the RIKEN Center for Emergent Matter Science in Japan have uncovered the first evidence of an unusual quantum phenomenon--the integer quantum Hall effect--in a new type of film, called a 3D topological insulator.

ClassOne enters ECD lab partnership with Shanghai Sinyang

04/14/2015  Semiconductor equipment manufacturer ClassOne Technology announced today that it has signed a joint electrochemical deposition (ECD) applications lab agreement with Shanghai Sinyang Semiconductor Materials Co., Ltd.

GaN Systems seals distribution deal in Japan and Asia

04/14/2015  GaN Systems Inc., a developer of gallium nitride power switching semiconductors, today announced it has signed an agreement with Japanese semiconductor and electronic component distributor, Value Integrated Technology (Vitec).

Fifty years of Moore's Law made possible by semiconductor equipment and materials suppliers worldwide

04/14/2015  April 2015 marks the 50th anniversary of one of the business world’'s most profound drivers, now commonly referred to as Moore's Law.

SEMI seminar focuses on European packaging, assembly and test

04/14/2015  On June 18, the SEMI Packaging Tech Seminar will take place in Vila do Conde, Portugal.

SEMI reports 2014 semiconductor photomask sales of $3.2B

04/14/2015  SEMI reports that the worldwide semiconductor photomask market was $3.2 billion in 2014 and is forecasted to reach $3.4 billion in 2016.

Duke University research advances testing of 3D integrated circuits for cost-effective development of electronics

04/14/2015  Duke University researchers are working to advance the tools and methodologies used to test 3D integrated circuits (ICs), which promise to help ensure the ongoing development of higher performance, lower power semiconductor chips.

IDT appoints semiconductor veteran Robert A. Rango to Board of Directors

04/10/2015  Integrated Device Technology, Inc. today announced that Robert A. Rango, a former Broadcom Corp. executive with extensive leadership skills in the global semiconductor market, has been appointed to IDT’s Board of Directors, effective April 6, 2015.

Automotive touch panel revenues to hit $1.5B by 2018

04/10/2015  The explosion of touch-enabled screens used in smartphones, tablets and other consumer devices, along with improvements in touch technology, are increasing demand for touch-screen automotive displays.

New understanding of electromagnetism could enable 'antennas on a chip'

04/10/2015  A team of researchers from the University of Cambridge have unravelled one of the mysteries of electromagnetism, which could enable the design of antennas small enough to be integrated into an electronic chip. These ultra-small antennas - the so-called 'last frontier' of semiconductor design - would be a massive leap forward for wireless communications.

Graphene looking promising for future spintronic devices

04/10/2015  Researchers at Chalmers University of Technology have discovered that large area graphene is able to preserve electron spin over an extended period, and communicate it over greater distances than had previously been known.





Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

More Technology Papers

WEBCASTS

3D Integration: The Most Effective Path for Future IC Scaling

Thursday, April 23, 2015 at 12:00 p.m. EST

It is well recognized that dimensional scaling has reached its diminishing return phase. The industry is now looking at monolithic 3D to be the future technology driver. Yet, until recently, the path to monolithic 3D has required the development of new transistor types and processes. This Webcast will present game-changing monolithic 3D process flows which use the existing transistor of existing manufacturing line and existing process flows. Now the most effective path for future IC scaling is indeed monolithic 3D, which offers the lowest development and manufacturing cost for future ICs.

Sponsored By:
Trends in Materials: The Smartphone Driver

Thursday, April 30, 2015 at 1:00 p.m. EST

To understand 3-D FinFET doping and high mobility channel material, this talk will first review the current doping and Fin/channel mobility enhancement techniques used for 22nm FinFET production by Intel for both high performance logic and SOC devices and the changes they made for their 2nd generation 14nm FinFET.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

EVENTS

SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...