NEWS ANALYSIS & FEATURES


Imec presents compact lens-free digital microscope

02/12/2016  At next week’s SPIE Photonics West 2016, imec will demonstrate a lens-free microscope for large field-of-view live imaging at micrometer resolution.

Mentor Graphics partners with GLOBALFOUNDRIES for 22FDX platform reference flow

02/12/2016  Mentor Graphics Corp. has announced that it is collaborating with GLOBALFOUNDRIES to qualify the Mentor RTL to GDS platform, including the RealTime Designer physical RTL synthesis solution and Olympus-SoC place and route system, for the current version of the GLOBALFOUNDRIES 22FDX platform reference flow.

Graphene leans on glass to advance electronics

02/12/2016  Scientists have developed a simple and powerful method for creating resilient, customized, and high-performing graphene: layering it on top of common glass.

UW scientists create ultrathin semiconductor heterostructures for new technologies

02/12/2016  University of Washington scientists have successfully combined two different ultrathin semiconductors -- each just one layer of atoms thick and roughly 100,000 times thinner than a human hair -- to make a new two-dimensional heterostructure with potential uses in clean energy and optically-active electronics.

2016FLEX to gather over 600 experts in flexible hybrid electronics

02/12/2016  Over 600 electronics professionals are expected to attend the 15th annual Flexible and Printed Electronics Conference and Exhibition (2016FLEX) at the Monterey Marriott February 29-March 3.

EV Group joins IRT Nanoelec 3D Integration Program

02/11/2016  EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies.

Renesas unveils 90nm one-transistor MONOS flash memory tech

02/11/2016  Renesas Electronics Corp. reported the development of 90nm one-transistor MONOS (1T-MONOS) flash memory technology that can be used in combination with a variety of processes.

SEMICON Southeast Asia 2016 comes back to Penang

02/11/2016  SEMI, the global industry association serving the nano- and micro-electronic manufacturing supply chains, will once again be hosting SEMICON Southeast Asia.

FinFET technology market worth $35.12B by 2022

02/11/2016  The FinFET technology market is expected to grow from $4.91 billion USD in 2015 to $35.12 billion by 2022, at a compound annual growth rate (CAGR) of 26.2% between 2016 and 2022.

Teradyne appoints president of semiconductor test division

02/11/2016  Teradyne, Inc. has appointed Gregory Smith as president of the Teradyne semiconductor test division, replacing Mark Jagiela who has been acting division president since 2014.

New thin film transistor may lead to flexible devices

02/10/2016  An engineering research team at the University of Alberta has invented a new transistor that could revolutionize thin-film electronic devices.

SEMI launches new integrated packaging assembly and test group

02/10/2016  SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.

Ultratech announces promotion of two executives

02/10/2016  Ultratech, Inc., a supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high­brightness LEDs (HB­ LEDs), as well as atomic layer deposition (ALD) systems, announced the promotion of two of its executives.

Orbotech collaborates with Nippon Mektron on digital flexible printed circuit board manufacturing

02/10/2016  Orbotech Ltd. today announced that, Nippon Mektron Mektec, a maker of flexible printed circuit boards (FPCBs), is deploying Orbotech direct imaging (DI) and automated optical inspection (AOI) systems in multiple factories.

58% of pure-play foundry capacity under high risk for seismic activity

02/09/2016  As of December 2015, roughly half of the world’s total IC wafer production capacity was located in seismically active areas.

Improved ion implant exhaust management reduces energy, capital costs

02/09/2016  How Texas Instruments got greener, safer and saved money.

Top LED company selects ClassOne's Solstice electroplater

02/09/2016  Semiconductor equipment manufacturer ClassOne Technology announced the purchase of its Solstice S8 electroplating system by one of the world's leading LED manufacturers.

Call for Papers issued for SEMICON Russia

02/08/2016  SEMICON Russia 2016 on 7-9 June will provide insights into market developments, technology, and business opportunities, short and long-term.

Helium reduction at pre-metal sub-atmospheric CVD

02/08/2016  A novel SACVD PMD invention sets the benchmark for helium reduction efforts by achieving four key objectives: cost reduction, quality, process robustness and productivity.

Yield and cost challenges at 16nm and beyond

02/08/2016  A new 5D solution utilizes multiple types of metrology systems to identify and control fab-wide sources of pattern variation, with an intelligent analysis system to handle the data being generated.



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Improved ion implant exhaust management reduces energy, capital costs

02/09/2016  How Texas Instruments got greener, safer and saved money.

Helium reduction at pre-metal sub-atmospheric CVD

02/08/2016  A novel SACVD PMD invention sets the benchmark for helium reduction efforts by achieving four key objectives: cost reduction, quality, process robustness and productivity.

Nova selected by a leading foundry for its most advanced 10nm and 7nm FinFET nodes

02/02/2016  Nova Measuring Instruments, a provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today that a leading foundry recently selected Nova's optical and X-ray metrology solutions for multiple process steps.

Ultratech and Qoniac jointly develop 3D lithography APC solution

01/28/2016  Ultratech, Inc. and Qoniac GmbH announced that the companies are jointly developing a 3D lithography advanced process control (APC) solution for advanced 3D CMOS manufacturing.

Entegris announces new post-CMP cleaning solutions

01/26/2016  Entegris, Inc., a developer of yield-enhancing materials and solutions, today announced new post-chemical mechanical planarization (post-CMP) cleaning solutions for semiconductor manufacturing.

Memristor Variants and Models from Knowm

01/22/2016  Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

01/20/2016  ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Pfeiffer Vacuum presents innovative vacuum solutions at the trade fairs Semicon Korea and Semicon China

01/18/2016  Pfeiffer Vacuum, a global supplier of vacuum technology, will be exhibiting at the SEMICON Korea Trade Fair in Seoul from January 27 to 29 and Semicon China in Shanghai from March 15 to 17.

Stanford researchers advance area selective ALD to develop more energy efficient electronics

01/12/2016  Stanford University researchers sponsored by Semiconductor Research Corporation (SRC) have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.

AKHAN Semiconductor deploys 200mm manufacturing process in new diamond-based chip production facility

01/08/2016  AKHAN Semiconductor, Inc. this week announced that it is deploying 200mm manufacturing equipment and process in its new production facility in Gurnee, Illinois, continuing its preparation for delivering AKHAN diamond semiconductor based-technology products to the company’s first commercial customer this quarter.

The Critical Materials Council to be managed by TECHCET in 2016

01/07/2016  The Critical Materials Council for Semiconductor Fabricators, originally established by ISMI/SEMATECH in the early 1990’s, will be managed by TECHCET CA LLC starting January 01, 2016.

Facilities

01/06/2016  Semiconductor manufacturing facilities or wafer “fabs” are huge affairs costing billions of dollars.

Automated Test Equipment

01/06/2016  Automatic or automated test equipment (ATE) is a system that performs tests on a device, known as the Device Under Test (DUT), using automation to quickly perform measurements and evaluate the test results.

Lithography

01/06/2016  Lithography is used to create a pattern on the wafer.

EUV, multiple patterning, integrated circuits among topics for SPIE Advanced Lithography 2016

01/06/2016  EUV lithography is on the threshold of becoming a mainstream patterning technology for sub-10nm chips, featured speaker Anthony Yen of Taiwan Semiconductor Manufacturing Co. (TSMC) will tell fellow attendees at SPIE Advanced Lithography 2016.

Rudolph Technologies receives order for multiple NSX 330 Systems in Asia

01/05/2016  Rudolph Technologies, Inc., has received an order for over $15 million from a foundry in Asia for multiple NSX 330 Systems.

Startup Works on Ultralow-k Materials for Chips, Displays

12/21/2015  The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.

3D ASIP Conference Hears from EDA, IC Gear Companies

12/18/2015  John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.

SPTS Technologies installs a 300mm MEMS vapor HF etch release solution at CEA-Leti

12/18/2015  SPTS Technologies has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development.





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February 21, 2016 - February 21, 2016
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March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
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http://www.displayweek.org
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