NEWS ANALYSIS & FEATURES


Brite Semiconductor and Semitech Semiconductor collaborate on industrial M2M SoC

06/24/2016  This SoC is designed to support M2M communication in the global industrial and energy transmission market via PLC/wireless modes.

Qualcomm files complaint against Meizu in China

06/24/2016  Qualcomm Incorporated announced that it has filed a complaint against Meizu in the Beijing Intellectual Property Court.

Photovoltaic cells replicate rose petals

06/24/2016  With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.

Increased use of semiconductors in auto industry to boost global semiconductor capital equipment until 2020

06/23/2016  According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.

Gigaphoton first to introduce new excimer laser to flat panel display industry

06/23/2016  Gigaphoton Inc., a major semiconductor lithography light source manufacturer, announced the successful development of a new series of excimer lasers, the GIGANEX series.

SMIC begins mass production of Qualcomm Snapdragon 425 processor in Beijing

06/23/2016  The successful production of 28nm Snapdragon products in Beijing represents an important step for SMIC's 28nm technology.

MagnaChip selects Mentor Graphics Analog FastSPICE platform

06/23/2016  The AFS Platform provides the world's fastest circuit verification for nanometer analog, RF, mixed-signal, memory, and custom digital circuits.

WPG Americas Inc. awarded Fastest Growing Revenue award from Micron

06/23/2016  WPG Americas, Inc. (WPGA), a subsidiary of WPG Holdings, Asia's number one electronics distributor, was recently awarded the Fastest Growing Revenue Recognition Award by Micron Technology, Inc.

AI Technology, Inc. introduces temporary bonding adhesive for thin wafer handling

06/23/2016  For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

POET Technologies announces closing of acquisition of BB Photonics

06/23/2016  POET completes the transaction owning 100% of BB Photonics and its assets, including intellectual property and technologies.

Power transistors to see less volatility in second half of this decade

06/22/2016  Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.

Building U.S. manufacturing ecosystems for emerging advanced packaging technologies

06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

Diamond-based resonators might become highly sensitive detectors

06/22/2016  Physicists from the Technological Institute for Superhard and Novel Carbon Materials, the Moscow Institute of Physics and Technology, and the Siberian Federal University have mathematically modelled diamond-based microstructures for producing compact high sensitivity sensors.

Samsung introduces new line-up of LED components for automotive lighting, featuring chip-scale packaging

06/21/2016  Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.

Amkor Technology receives Qualcomm Technologies’ 2015 Supplier of the Year award

06/21/2016  Amkor Technology Inc., a provider of semiconductor packaging and test services, today announced it has received the Supplier of the Year award from Qualcomm Technologies, Inc.

Ultratech receives follow-on order from major Asian foundry for laser spike annealing system

06/21/2016  The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.

EV Group scores fourth consecutive triple crown win in annual VLSIresearch customer satisfaction survey

06/21/2016  EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey.

Solar cells for greener and safer energies

06/21/2016  ICFO researchers report on low-temperature, solution-processed, environmentally friendly inorganic solar cells made with Earth-abundant materials capable of operating with a power conversion of 6.3 percent.

Accelerate and de-risk materials decisions for semiconductor R&D with IMI Labs from Intermolecular

06/21/2016  Intermolecular, Inc. today announced IMI Labs for Semiconductor, a materials innovation service to help semiconductor companies explore, discover and characterize new materials.

Samco boosts shipment capacity with second production center

06/21/2016  Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.



FEATURED INNOVATOR

QuantumClean: Process Improvement Through Consistently Cleaner Parts

QuantumClean is the global leader in high-purity outsourced process tool parts cleaning, performance coatings, refurbishment and analytical & engineering services to the semiconductor, solar and LED industries. QuantumClean operates on the frontier of the sub-20nm high-purity semiconductor parts cleaning market through leading-edge technologies, resources and expertise.
Sponsored By: QuantumClean

RESOURCE GUIDE - Get Listed


Latest Article

Samco boosts shipment capacity with second production center

06/21/2016  Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.





Categories


Featured Supplier


Yield Engineering Systems, Inc.: http://www.yieldengineering.com

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

WEBCASTS

Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

EVENTS

SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

NEW PRODUCTS

NanoFocus AG introduces new inspection system for semiconductors industry
05/31/2016NanoFocus AG, the developer and manufacturer of optical 3D surface measuring technology, introduces the new measuring system µ...
Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
02/18/2016Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of th...