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University of California, Berkeley places order for PEALD deposition system from Ultratech Cambridge Nanotech

12/08/2016  Ultratech, Inc. announced that the Laboratory for Emerging and Exploratory Devices has chosen the Ultratech-CNT Fiji G2 PEALD system as its instrument of choice for its research activities.

Leti says FD-SOI light-sensing technique can make transistors far more sensitive to visible light

12/08/2016  In IEDM 2016 presentation, institute’s team demonstrates potential sensing advantages of integrating photodiodes below buried oxide.

Imec develops 3D-compatible germanium nMOS gate stack with high mobility and superior reliability

12/08/2016  At this week's IEEE IEDM conference, imec, the research and innovation hub in nano-electronics and digital technologies showed for the first time a silicon (Si)-passivated germanium (Ge) nMOS gate stack with dramatically reduced interface defect density (DIT) reaching the same level as a Si gate stack and with high mobility and reduced positive bias temperature instability (PBTI).

ClassOne reports record sales, crediting WLP and "More than Moore"

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

EVG and Korea National NanoFab Center program on novel display coatings delivers outstanding results

12/07/2016  EV Group and the Korea National NanoFab Center announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays.

Leti shows memristive devices can mimic different kind of synaptic plasticity inspired by biology

12/07/2016  Presented at IEDM 2016, breakthrough suggests path to embedding neuromorphic learning in low-power devices that could enable autonomous systems.

Stanford engineers find that a new memory technology may be more energy efficient than previously thought

12/07/2016  While exploring the atomic-level forces at play in a new type of computer chip, researchers found an energy-saving surprise that could translate into longer battery life for next-generation mobile devices.

Leti shows the way to fabricating CMOS devices for 5nm node using nanowire technology

12/06/2016  IEDM 2016 papers demonstrate novel responses to problems of performance and parasitic capacitances.

Third quarter 2016 worldwide semiconductor equipment billings reach $11B, reports SEMI

12/06/2016  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$11.0 billion in the third quarter of 2016.

Imec demonstrates record tunneling magnetoresistance for one of the world's smallest perpendicular magnetic tunnel junctions

12/06/2016  At the 2016 IEEE International Electron Devices Meeting, in a special poster session on MRAM, world-leading research and innovation hub for nano-electronics and digital technology imec presented a 8nm p-MTJ device with 100 percent tunnel magnetoresistance (TMR) and coercive field as high 1500Oe.

GlobalWafers completes acquisition of SunEdison

12/05/2016  GlobalWafers Co., Ltd. announced that the acquisition of SunEdison Semiconductor Limited by GlobalWafers has been successfully completed.

Delivering a power punch

12/05/2016  Microscale energy storage units for wearable and miniaturized electronic devices are improved using porous materials.

3-D solutions to energy savings in silicon power transistors

12/05/2016  K Tsutsui at Tokyo Institute of Technology and colleagues in Japan have now shown that by scaling down size parameters in all three dimensions their device they can achieve significant energy savings.

Tessera completes acquisition of DTS

12/02/2016  Tessera Holding Corporation today announced it has completed the acquisition of DTS, Inc.

Making graphene using laser-induced phase separation

12/02/2016  IBS & KAIST researchers clarify how laser annealing technology can lead to production of ultra thin nanomaterials.

Physicists decipher electronic properties of materials in work that may change transistors

12/02/2016  University of Texas at Dallas physicists have published new findings examining the electrical properties of materials that could be harnessed for next-generation transistors and electronics.

Kateeva President & COO named "Inventor of the Year" for 2016 by the Silicon Valley Intellectual Property Law Association

12/01/2016  Kateeva, the OLED production equipment leader, today announced that President and COO, Conor Madigan, Ph.D., was named "Inventor of the Year" for 2016 by the Silicon Valley Intellectual Property Law Association (SVIPLA).

QuickLogic joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/01/2016  QuickLogic Corporation, a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

Infineon celebrates the expansion of its Mesa semiconductor fabrication facility

12/01/2016  The multi-million-dollar expansion project added approximately 11,500 square foot and will create more than 20 new high-quality jobs.

Synopsys completes acquisitions of Cigital and Codiscope

12/01/2016  Synopsys, Inc. has completed its acquisitions of Cigital, a privately held provider of software security managed and professional services, and Codiscope, a 2015 spinoff of Cigital and provider of complementary security tools.



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Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

12/01/2016  ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.





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