NEWS ANALYSIS & FEATURES


Analog Devices’ monitoring initiative aims to improve crop quality, yields, and boost profitability of local farmers

08/23/2017  The initiative instructs student farmers how to use Internet of Things and blockchain technologies to track the conditions and movement of produce from “Farm to Fork” to make decisions that improve quality, yields, and profitability.

Bond dissociation energies for transition metal silicides accurately determined

08/23/2017  American researchers develop method to determine bond dissociation energies for transition metal silicides to advance computation efforts and general understanding of chemical bonding.

Infrared laser: At the heart of the industry in coming years

08/23/2017  In a depressed visible LED industry, manufacturers are looking at new opportunities to increase their revenues and margins. In this context, the IR LED market is perceived as a potential new ‘blue ocean’ with attractive opportunities for those players.

Gary Locke joins nLIGHT, Inc. Board of Directors

08/23/2017  nLIGHT, Inc., a U.S. company in high-power semiconductor and fiber lasers, today announced the appointment of Gary Locke to its board of directors effective immediately.

North American semiconductor equipment industry posts July 2017 billings

08/23/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in July 2017.

Stretchable biofuel cells extract energy from sweat to power wearable devices

08/22/2017  A team of engineers has developed stretchable fuel cells that extract energy from sweat and are capable of powering electronics, such as LEDs and Bluetooth radios.

SiFive and Rambus to provide IP to the 'DesignShare' economy

08/22/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus to make Rambus cryptography technology available for the SiFive Freedom platforms.

Silego announces shipping more than 3 billion configurable mixed-signal ICs

08/22/2017  Silego Technology today announced shipping three billion units since its introduction of the pioneering Configurable Mixed-signal ICs (CMICs). In addition, Silego announced it shipped more than one hundred million units in the month of July.

LTX-Credence ships the 600th PAx test system for testing RF front end devices

08/22/2017  LTX-Credence shipped the 600th PAx test system to Skyworks Solutions, Inc.

MRSI Systems launches high speed die bonder for photonics high volume manufacturing

08/22/2017  MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements.

OLED encapsulation materials market to grow 16% CAGR to $233M by 2021

08/21/2017  The popularity of organic light-emitting diode (OLED) TVs and smartphones has boosted not only the OLED display market but also the OLED encapsulation materials market.

SEMI Foundation celebrates New York State United Teachers, Recognizes Applied Materials & KLA-Tencor Volunteers of the Year

08/21/2017  The SEMI Foundation today announced that it will be celebrating its 10th anniversary of partnership with New York State United Teachers (NYSUT) on August 22-23 in Latham, New York at the NYSUT headquarters.

Global GaAs wafers market to grow at a CAGR of 11.9% by 2021

08/21/2017  The global gallium arsenide wafer market to decline at a CAGR of 11.9% during the period 2017-2021.

'Electronic skin' takes wearable health monitors to the next level

08/21/2017  A soft, stick-on patch collects, analyzes and wirelessly transmits a variety of health metrics from the body to a smartphone.

Atomically thin layers bring spintronics closer to applications

08/21/2017  University of Groningen scientists led by physics professor Bart van Wees have created a graphene-based device, in which electron spins can be injected and detected with unprecedented efficiency.

PC DRAM contract price rose by over 10% sequentially and global DRAM revenue increase by 16.9% sequentially Q2

08/18/2017  Global DRAM revenue reached a new historical high in the second quarter of 2017, according to DRAMeXchange.

Lam Research takes uniformity control to the edge

08/16/2017  Chipmakers want every part of the wafer to yield good die. Advances in process technologies have just about made this a reality, even as feature dimensions continue to shrink and devices grow more complex.

Rice University materials scientists create 2-faced 2-D material

08/16/2017  The Rice laboratory of materials scientist Jun Lou has made a semiconducting transition-metal dichalcogenide (TMD) that starts as a monolayer of molybdenum diselenide. They then strip the top layer of the lattice and replace precisely half the selenium atoms with sulfur.

New ultrathin semiconductor materials exceed some of silicon's "secret" powers

08/16/2017  Electrical engineers at Stanford have identified two semiconductors that share or even exceed some of silicon’s desirable traits, starting with the fact that all three materials can "rust."

SIA statement regarding Trump Administration action to protect U.S. intellectual property in foreign markets

08/16/2017  The Semiconductor Industry Association (SIA) released a statement in response to the Trump Administration's decision to set in motion a process led by the United States Trade Representative to investigate China's unfair trade practices.



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ALD tools evolve with industry needs

07/13/2017  Veeco Instruments (Veeco) recently announced that Veeco CNT -- formerly known as Ultratech/Cambridge Nanotech -- shipped its 500th Atomic Layer Deposition (ALD) system to the North Carolina State University.





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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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WEBCASTS

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

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Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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EVENTS

Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

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