NEWS ANALYSIS & FEATURES


$24B semiconductor assembly and testing services market poised for steady growth

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

IBM releases new all-flash storage for cognitive workloads

01/13/2017  IBM this week announced new, all-flash storage solutions designed for midrange and large enterprises, where high availability, continuous up-time, and performance are critical.

NUS researchers achieve major breakthrough in flexible electronics

01/13/2017  New classes of printable electrically conducting polymer materials make better electrodes for plastic electronics and advanced semiconductor devices.

Toshiba expands lineup of industrial-grade e-MMC embedded NAND flash memory products

01/12/2017  Toshiba America Electronic Components, Inc. this week announced the launch of its JEDEC e-MMCTM Version 5.1-compliant embedded NAND flash memory products that feature an enhanced operational temperature range of -40°C to +105°C.

Technavio releases market research report and forecast on gallium arsenide components

01/12/2017  The global gallium arsenide (GaAs) components market is expected to grow at a CAGR of over 4% during the forecast period, according to Technavio’s latest report.

Worldwide semiconductor capital spending is forecast to grow 2.9% in 2017

01/12/2017  Worldwide semiconductor capital spending is projected to increase 2.9 percent in 2017, to $69.9 billion, according to Gartner, Inc.

Synopsys extends Software Integrity Platform with acquisition of Forcheck

01/12/2017  Synopsys, Inc. today announced it has completed its acquisition of certain assets of Forcheck.

Wolfspeed introduces new SiC MOSFET for EV drive trains

01/11/2017  New 900V, 10mΩ chip enables new improvements in range, battery usage and vehicle design.

HID Global predicts top trends for 2017 in the identity technology industry

01/11/2017  Shift in the use of trusted identities fuels broader adoption of mobile and advanced smart card technology, a greater emphasis on the Cloud and emerging IoT use cases.

STMicroelectronics incorporates CWS’ SiPEX in the RF PDK H9 SOI FEM

01/11/2017  Coupling Wave Solutions, S.A. and STMicroelectronics today announced that they partnered together to reduce time-to-market for high-performance radio frequency (RF) silicon-on-insulator (SOI) designs

NIST physicists 'squeeze' light to cool microscopic drum below quantum limit

01/11/2017  Physicists at the National Institute of Standards and Technology (NIST) have cooled a mechanical object to a temperature lower than previously thought possible, below the so-called "quantum limit."

CWRU directly measures how perovskite solar films efficiently convert light to power

01/11/2017  Measurement shows potential for building better solar cells by imaging fundamental properties of the material.

Air Products to expand nitrogen capacity in Pyeongtaek City to support demand of semiconductor industry

01/10/2017  Air Products today announced it will increase nitrogen production to serve the growing demand of its existing customer in Pyeongtaek City, Gyeonggi Province, South Korea.

NXP honored as 2016 Top 100 Global Innovator

01/10/2017  NXP Semiconductors N.V. today announced that Clarivate Analytics, formerly the Intellectual Property & Science business of Thomson Reuters, has listed NXP in its highly anticipated list of 2016 Top 100 Global Innovators.

2-D materials enhance a 3-D world

01/10/2017  2-D layer increases effectiveness of optoelectronics.

SEMI ISS 2017 uncovers new growth, forecast upgrades

01/10/2017  SEMI's Industry Strategy Symposium (ISS) opened yesterday with a theme focused on new industry forces and new markets.

ON Semiconductor, Hexius Semiconductor expand scope of analog functionality for next gen mixed signal ASICs

01/09/2017  ON Semiconductor announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process.

Researchers create practical and versatile microscopic optomechanical device

01/09/2017  Trapping light and mechanical waves within a tiny bullseye, design could enable more sensitive motion detection.

Illinois team advances GaN-on-Silicon for scalable high electron mobility transistors

01/09/2017  A team of researchers at the University of Illinois at Urbana-Champaign has advanced gallium nitride (GaN)-on-silicon transistor technology by optimizing the composition of the semiconductor layers that make up the device

MagnaChip selected as "2016 Best Supplier" by LG Display

01/06/2017  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced it was given the prestigious "2016 Best Supplier Award" by LG Display.



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Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

12/01/2016  ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.





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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

High Efficiency Wireless: 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

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WEBCASTS

Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

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More Webcasts

EVENTS

European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

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