NEWS ANALYSIS & FEATURES


Toshiba develops world’s first 256Gb, 48-layer BiCS FLASH

08/04/2015  Toshiba America Electronic Components, Inc. (TAEC) today unveiled the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory.

A*STAR's IME Consortium announces development of innovative advanced packaging solutions

08/04/2015  Following the launch of the 12th Electronics Packaging Research Consortium (EPRC12) in 2013, A*STAR’s Institute of Microelectronics (IME) and 11 of its consortium partners across the semiconductor supply chain have developed novel solutions in integrated circuit (IC) packaging.

MEMS Industry Group Conference Asia explores MEMS and sensors opportunities in global IoT

08/04/2015  MEMS Industry Group (MIG) will gather the world’s leading providers of micro-electromechanical systems (MEMS) and sensors technology for its second annual MEMS Industry Group Conference Asia in Shanghai, China on September 8-11, 2015.

Microchip Technology completes acquisition of Micrel

08/04/2015  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has completed its previously announced acquisition of Micrel.

ON Semiconductor introduces new ICs for next generation auto designs

08/03/2015  ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.

OMRON to acquire motion control company, Delta Tau Data Systems, Inc.

08/03/2015  OMRON Corporation announced its entry into a stock purchase agreement to acquire a 100 percent stake in Delta Tau Data Systems, Inc. of California (DT), which will result in DT becoming a member of the OMRON Group.

Better together: Graphene-nanotube hybrid switches

08/03/2015  Yoke Khin Yap, a professor of physics at Michigan Technological University, has worked with a research team that created these digital switches by combining graphene and boron nitride nanotubes.

Pixelligent launches new PixClear light extraction materials for OLED lighting

08/03/2015  Pixelligent Technologies, a manufacturer of high index materials for demanding optoelectronics applications, announces the addition of four new OLED lighting products to its PixClear Zirconia nanocrystal family.

Samsung 3D TSV stacked DDR4 DRAM: the first analyzed memory product with via- middle TSV

07/31/2015  According to Yole, 3D TSV technology is expected to reach $4.8B billion in revenues by 2019.

SPTS Technologies receives a $16M multiple system order from WIN Semiconductors Corp.

07/31/2015  ORBOTECH LTD. today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received an order, worth approximately US$16M, for multiple etch and deposition systems from WIN Semiconductors Corp.

Apple is using 20% of worldwide sapphire capacity – and that may be just the beginning

07/31/2015  In 2015, 20 percent of sapphire will be used in Apple’s iPhone, for the camera lens, fingerprint readers and heart rate monitors covers, and the Apple watch’s window.

SEMICON West: The road forward is 3DIC

07/31/2015  SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.

Sol-gel capacitor dielectric offers record-high energy storage

07/30/2015  Using a hybrid silica sol-gel material and self-assembled monolayers of a common fatty acid, researchers have developed a new capacitor dielectric material that provides an electrical energy storage capacity rivaling certain batteries, with both a high energy density and high power density.

The confidence of the Wide Band Gap industry

07/30/2015  WBG companies are slowly but surely reshaping the industry and accelerate the market adoption with numerous strategic mergers and acquisitions and the development of disruptive solutions.

Process Watch: The most expensive defect - Part 2

07/30/2015  The December 2014 edition of Process Watch suggested that the most expensive defect is the one that goes undetected until the end of line. Indeed, undetected excursions typically result in the scrap of millions of dollars per year of defective semiconductor chips.

Meet the high-performance single-molecule diode

07/29/2015  A team of researchers from Berkeley Lab and Columbia University has passed a major milestone in molecular electronics with the creation of the world's highest-performance single-molecule diode.

IBM launches new Internet of Things community for developers

07/29/2015  IBM today announced the launch of a new community, IBM developerWorks Recipes, designed to help developers – from novice to experienced – quickly and easily learn how to connect Internet of Things (IoT) devices to the cloud and how to use data coming from those connected devices.

Advanced materials enable a smart and interconnected world - SEMI Strategic Materials Conference 2015

07/29/2015  The SEMI Strategic Materials Conference (SMC), taking place September 22–-23 in Mountain View, Calif., will uncover the drivers for new materials and how material suppliers are impacted by the value chain they serve.

Chinese automotive semiconductor revenues to hit $6.2B in 2015

07/28/2015  The growth rate for vehicle shipments in China is slowing, but more and better performing semiconductors will still be required in automotive applications in the coming years.

Flat panel display revenues forecast to fall in 2015

07/28/2015  Led by declining thin-film-transistor liquid-crystal display (TFT LCD) revenues, global flat panel display (FPD) industry revenue is forecast to fall 2 percent, from $131.4 billion in 2014 to $129 billion in 2015.





VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

How Software Can Impact Your Processes and Maximize Profit

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Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

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Silicones Meet the Needs of the Electronics Industry

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WEBCASTS

The Path to Future Interconnects

August 6, 2015 at 1:00 p.m. ET

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
Advanced Packaging

August 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

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More Webcasts

EVENTS

SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015

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