NEWS ANALYSIS & FEATURES


ROHM Semiconductor acquires Powervation

07/23/2015  ROHM Co., Ltd., a developer of analog power IC solutions, announced today that it has completed the acquisition of Powervation Ltd., a privately held digital power IC company that develops Digital Power Management system-on-chip (SoC) solutions.

ORNL researchers make scalable arrays of 'building blocks' for ultrathin electronics

07/22/2015  Researchers at the Department of Energy's Oak Ridge National Laboratory have combined a novel synthesis process with commercial electron-beam lithography techniques to produce arrays of semiconductor junctions in arbitrary patterns within a single, nanometer-thick semiconductor crystal.

SIA commends launch of Congressional Semiconductor Caucus

07/22/2015  SIA recognized members of the caucus at a reception on Capitol Hill Tuesday evening and honored the caucus's co-chairs, Sen. James Risch (R-Idaho), Sen. Angus King (I-Maine), Rep. Pete Sessions (R-Texas), and Rep. Zoe Lofgren (D-Calif.).

“Above and beyond TSV for advanced ICs” - SEMI European 3D Summit 2016

07/22/2015  SEMI today announced the fourth annual European 3D Summit. Entitled “European 3D Summit 2016: Above and Beyond TSV,” the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

North American semiconductor equipment industry posts June 2015 book-to-bill ratio

07/22/2015  North America-based manufacturers of semiconductor equipment posted $1.51 billion in orders worldwide in June 2015 (three-month average basis) and a book-to-bill ratio of 0.98, according to the June EMDS Book-to-Bill Report published today by SEMI

Dr. Gary Patton joins The ConFab Advisory Board

07/21/2015  Solid State Technology today announced that Dr. Gary Patton has joined the Advisory Board for its annual conference and networking event, The ConFab.

Amkor Technology announces expansion of China operations

07/21/2015  Amkor Technology, Inc. today announced plans to expand its assembly and test factory located in China’s Shanghai Waigaoqiao Free Trade Zone.

Sticky tape and phosphorus the key to ultrathin solar cells

07/21/2015  Scientists studying thin layers of phosphorus have found surprising properties that could open the door to ultrathin and ultralight solar cells and LEDs.

An easy, scalable and direct method for synthesizing graphene in silicon microelectronics

07/21/2015  In the last decade, graphene has been intensively studied for its unique optical, mechanical, electrical and structural properties.

Analog Devices joins SRC's Trustworthy and Secure Semiconductors and Systems Initiative

07/20/2015  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced that Analog Devices, Inc. has joined SRC’s hardware cybersecurity research program called Trustworthy and Secure Semiconductors and Systems (T3S).

Smartphone and tablets still drive demand for cover glass, as industry looks to smart watches for growth

07/17/2015  With screen sizes increasing, smartphones continue to lead total area demand in the cover glass market; however, as the markets for smartphones and tablets mature, cover glass industry revenue growth is declining from 39 percent year over year in 2013 to 11 percent in 2015.

Got MEMS? Get In Touch With memsstar For Production Equipment

07/17/2015  As you might guess from the company’s name, memsstar is involved in microelectromechanical system (MEMS) devices. The company offers manufacturing equipment for “MEMS-specific production,” says CEO Tony McKie.

Tanaka Precious Metals Is Big in Bonding Wires, Other Products

07/17/2015  Tanaka Precious Metals, a company dating back to 1885, is a leading supplier of gold bonding wire and other types of bonding wire for semiconductor packaging. It also specializes in electroplating equipment, unveiling a new system for research and development applications at SEMICON West 2015.

Wearable systems give major boost to total IoT sales in 2015

07/16/2015  Market revenues associated with network communications, sensing, and control functions in subsystems and objects attached to the Internet of Things (IoT) are forecast to grow 29% in 2015 to $62.4 billion after increasing 21% in 2014 to about $48.4 billion.

CH2M Hill: How being green benefits the bottom line

07/16/2015  CH2M has seen many changes and trends in the semiconductor industry since the company was involved designing many of the industry’s first wafer fabs back in the 1980s.

Business is good for vendors of test and inspection/metrology equipment

07/16/2015  Semiconductor test equipment and inspection/metrology equipment are unglamorous yet critical segments of the equipment field.

Inspection smooths a bumpy road

07/16/2015  Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

International Consortium Sets Up Shop for Advanced Manufacturing Research

07/16/2015  A metropolitan area in the center of the state is putting together a public-private partnership to attract high-tech companies, convincing them to set up shop and create jobs. Part of the attraction is a big public university, engaging in advanced research.

SEMICON West Day 3: Don't Miss

07/15/2015  Check out these events on Day 3 of SEMICON West 2015.

SEMI Standards leaders honored at SEMICON West 2015

07/15/2015  SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries.





VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
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Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
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WEBCASTS

The Path to Future Interconnects

August 6, 2015 at 1:00 p.m. ET

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
Advanced Packaging

August 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

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More Webcasts

EVENTS

SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015

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