NEWS ANALYSIS & FEATURES


ESI appoints new board member

08/25/2014  Electro Scientific Industries, Inc., a supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that Richard H. Wills, former Chairman and Chief Executive Officer of Tektronix, Inc., was appointed to the company’s Board of Directors.

SRC TECHCON 2014 Conference to feature speakers from GLOBALFOUNDRIES, LinkedIn, High Point University

08/25/2014  The TECHCON 2014 conference hosted by Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, will feature immediate past GLOBALFOUNDRIES CEO Ajit Manocha among the list of executive speakers at the Sept. 7-9 annual event.

A breakthrough in imaging gold nanoparticles to atomic resolution by electron microscopy

08/22/2014  Nanometer-scale gold particles are intensively investigated for application as catalysts, sensors, drug delivery devices, biological contrast agents and components in photonics and molecular electronics.

The Week in Review: August 22, 2014

08/22/2014  Collaboration for next-generation smart glasses; Book-to-bill ratio holds steady in July; Intel and Unity to collaborate; MediaTek launches new R&D facility; Amkor appoints new member to board of directors; STATS ChipPAC achieves shipping milestone

Order activity for semiconductor equipment holds steady in July

08/21/2014  North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

Amkor Technology names David Watson to Board of Directors

08/21/2014  Amkor Technology, Inc. today announced that David Watson has been appointed as a new member of the Company’s Board of Directors.

Energy efficiency electrifies SEMICON Europa: Low power and power electronics

08/21/2014  For the first time, SEMICON Europa 2014 will offer two new power-related technical forums — Power Electronics Conference (8-9 October) and Low Power Conference (7-8 October).

Quantum Materials acquires Bayer Technology Services quantum dot patents

08/20/2014  Quantum Materials Corporation today announced the purchase of five diverse sets of patent families from Bayer Technology Services GmbH, the global technological backbone and major innovation driver for Bayer AG of Leverkusen, Germany.

MediaTek launches R&D center in Bengaluru

08/20/2014  MediaTek today announced the establishment of a new research and development facility in Bengaluru, India.

Renesas Electronics expands portfolio of Simple Power Supply ICs

08/20/2014  Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

08/20/2014  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

Promising ferroelectric materials suffer from unexpected electric polarizations

08/19/2014  Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

MIPT and RAS scientists made an important step towards creating medical nanorobots

08/19/2014  Researchers from the Institute of General Physics of the Russian Academy of Sciences, the Institute of Bioorganic Chemistry of the Russian Academy of Sciences and MIPT have made an important step towards creating medical nanorobots.

Himax Technologies and Lumus announce collaboration to develop next-generation smart glasses

08/19/2014  Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

Alpha and Omega Semiconductor announces promotion of Yifan Liang to CFO

08/19/2014  Alpha and Omega Semiconductor Limited, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced that the Board of Directors of AOS has promoted Mr. Yifan Liang, the Interim Chief Financial Officer, to serve as the Chief Financial Officer of AOS, effective immediately.

Intersil announces single-chip display power and LED driver for smartphones

08/19/2014  Intersil Corporation, a provider of power management and precision analog solutions, today announced the ISL98611 display power and LED driver for smartphones.

Mentor Graphics announces 25th annual PCB Technology Leadership Awards program

08/19/2014  Mentor Graphics Corporation today announced the call-for-entries of its 25th annual Technology Leadership Awards (TLA) competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design.

SmartPlay to offer design services for customers of Intel Custom Foundry

08/19/2014  SmartPlay Inc., a design services company with expertise in digital, analog, wireless software and system design, announced that it is ready to offer design services to customers of Intel Custom Foundry that require expertise, know-how and unique IP in critical embedded applications.

Gigaphoton unveils new function that enables 50% reduction of neon gas consumption for ArF immersion lasers

08/18/2014  Gigaphoton Inc., a lithography light source manufacturer, today unveils a new function, called “eTGM,” available for its flagship high-output GT Series of ArF immersion laser products.

ON Semiconductor completes acquisition of Aptina Imaging

08/18/2014  ON Semiconductor today announced the completion of its acquisition of Aptina Imaging.



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS

Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014

FINANCIALS

NEW COMMENTS


Ion Systems launches home page to address static charge control issues
Is silicon wafer pricing on its way up again?
On the road to recovery: Semiconductor growth expected for the next two years

NEW PRODUCTS

SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
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Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...