SEMI-THERM to take place March 19-23

03/13/2018  The 34th annual conference and exhibition will bring together leading industry experts to San Jose, CA to share ideas that will shape future technologies.

Flat gallium joins roster of new 2-D materials

03/12/2018  Scientists at Rice University and the Indian Institute of Science, Bangalore, have discovered a method to make atomically flat gallium that shows promise for nanoscale electronics.

Breakthrough in circuit design makes electronics more resistant to damage and defects

03/12/2018  A newly published paper in Nature Electronics details how researchers at the Advanced Science Research Center, GC/CUNY, used an array of nonlinear resonators to overcome signal disruption when electronic circuits are broken or damaged.

New insights could pave the way for self-powered low energy devices

03/09/2018  Researchers have discovered more details about the way certain materials hold a charge even after two surfaces separate, information that could help improve devices that leverage such energy as a power source.

Immersion files lawsuits against Samsung in U.S. and China

03/09/2018  The complaint seeks to stop further infringement by Samsung and to recover damages.

SCREEN Semiconductor Solutions and Axcelis Technologies announce distribution and support agreement

03/09/2018  Agreement brings Purion ion implant platform to Japan market.

Qualcomm Board names Jeffrey Henderson Non-Executive Chairman

03/09/2018  The Board has discontinued the role of Executive Chairman, which was established in 2014 as part of a leadership transition plan, based on its belief that an independent Chairman is now more appropriate for Qualcomm. The Board has named Jeffrey W. Henderson, an independent Qualcomm director since 2016, to serve as Non-Executive Chairman.

Scientists develop new tool for imprinting biochips

03/09/2018  The new technology could allow researchers to fit more biochemical probes onto a single biochip and reduce the cost of screening and analyzing changes associated with disease development, detecting bioterrorism agents, and other areas of research.

UCLA researchers develop a new class of two-dimensional materials

03/09/2018  New kinds of 'superlattices' could lead to improvements in electronics, from transistors to LEDs.

A universally profitable renewable energy business model

03/08/2018  The solar energy sector shined in a global renewable energy market that maintained steady growth last year despite the United States’ shocking withdrawal from the Paris Agreement. Solar panel costs dropped to an all-time low, driving global demand that surpassed the 100GW mark for the first time on the strength of standout annual 26 percent growth.

Samsung enhances chip-scale LED package lineup with industry’s highest luminous efficacies

03/08/2018  Samsung Electronics Co., Ltd. today announced that it has achieved the industry’s highest light efficacies for its fillet-enhanced chip-scale package (FEC) LED lineup.

Synopsys collaborates with Samsung Foundry to develop DesignWare IP for Samsung 8nm finFET process

03/08/2018  Synopsys, Inc. today announced a collaboration with Samsung Foundry to develop DesignWare Foundation IP for Samsung's 8nm Low Power Plus (8LPP) FinFET process technology.

New approach to measuring stickiness could aid micro-device design

03/08/2018  Brown University engineers have devised a new method of measuring the stickiness of micro-scale surfaces. The technique, described in Proceedings of the Royal Society A, could be useful in designing and building micro-electro-mechanical systems (MEMS), devices with microscopic moving parts.

Simulation and experiment help TU Dresden researchers study next-generation semiconductors

03/08/2018  Theoretical physicists and experimentalists collaborate to identify dopants capable of enabling new designs of semiconducting materials.

KLA-Tencor receives Intel's Preferred Quality Supplier award

03/08/2018  KLA-Tencor Corporation has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award.

Linde LienHwa announces investment commitment in China and additional new special gas production in Taiwan

03/07/2018  Linde LienHwa, a key supplier of gases and chemicals to the electronics industry, continues to invest with its customers in Mainland China and Taiwan.

Palma Ceia closes Series B funding

03/07/2018  Palma Ceia SemiDesign (PCS), a fabless semiconductor company offering wireless chips, modules, systems and IP supporting emerging Machine-to-Machine (M2M) WiFi and cellular standards for the Internet of Things (IoT), today announced it has completed a Series B round of financing.

Researchers reshape the energy landscape of phonons in nanocrystals

03/07/2018  Light and vibrations intertwine inside a nanoscale cavity.

Applied Materials receives Intel's Preferred Quality Supplier award

03/07/2018  Applied Materials, Inc. has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award.

Flexible AMOLED market more than tripled to $12B in 2017

03/06/2018  Thanks to a sudden increase in demand , shipment revenue of flexible active-matrix organic light-emitting diode (AMOLED) displays more than tripled in 2017, accounting for 54.6 percent of total AMOLED panel shipment revenue.



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers


3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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LED Expo Thailand
Bangkok, Thailand
May 10, 2018 - May 12, 2018

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