NEWS ANALYSIS & FEATURES


STMicroelectronics selects GLOBALFOUNDRIES 22FDX to extend its FD-SOI platform

01/09/2018  GLOBALFOUNDRIES and STMicroelectronics today announced that ST has selected GF's 22nm FD-SOI (22FDX) technology platform to support its next-generation of processor solutions for industrial and consumer applications.

Semtech enables IoT of the future with next generation LoRa platform

01/08/2018  Semtech Corporation, a supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced its next generation LoRa devices and wireless radio frequency (RF) technology (LoRa Technology) chipsets enabling innovative LPWAN use cases for consumers with its advanced technology.

Micron and Intel announce update to NAND memory joint development program

01/08/2018  Micron and Intel today announced an update to their successful NAND joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.

Room-temperature multiferroic thin films and their properties

01/08/2018  Scientists at Tokyo Institute of Technology (Tokyo Tech) and Tohoku University have developed high-quality GFO epitaxial films and systematically investigated their ferroelectric and ferromagnetic properties. They also demonstrated the room-temperature magnetocapacitance effects of these GFO thin films.

SEMI and Fab Owners Association strengthen supply chain

01/08/2018  With integration complete, FOA is managed as a Special Interest Group (SIG) within SEMI. FOA member companies will become full SEMI members, with FOA continuing to expand its global membership through SEMI's global network, while maintaining its unique community.

Odyssey Technical Solutions named exclusive distributor for Comet Capacitors in the Americas

01/08/2018  Odyssey Technical Solutions today announced that they have reached agreement with COMET PCT (Plasma Control Technologies) division, located in San Jose, CA. with headquarters in Switzerland, to stock and exclusively distribute the COMET vacuum capacitor line of components for North, Central and South America.

ON Semiconductor joins CharIN Ecosystems in development of electric mobility standards

01/05/2018  ON Semiconductor has joined the global Charging Interface Initiative e.V. (CharIN) ecosystem with the goals of promoting standards for charging systems in electric vehicles.

NRL improves optical efficiency in nanophotonic devices

01/05/2018  A team of physicists, headed by the U.S. Naval Research Laboratory (NRL), have demonstrated the means to improve the optical loss characteristics and transmission efficiency of hexagonal boron nitride devices, enabling very small lasers and nanoscale optics.

Xilinx appoints Victor Peng as president and CEO

01/05/2018  Xilinx, Inc. today announced that its board of directors has appointed Victor Peng as president and chief executive officer, effective January 29, 2018.

APAC tops the global RF power semiconductor devices market

01/05/2018  The latest market research report by Technavio on the global radio-frequency (RF) power semiconductor devices market predicts a CAGR of close to 12% during the period 2017-2021.

Nine SEMI Standards committee members recognized at SEMICON Japan for outstanding contributions

01/05/2018  At the SEMI Standards Friendship Party during SEMICON Japan, JRSC recognized the following nine committee members for outstanding contributions to the development of SEMI Standards.

IHS Markit identifies the top eight technology trends for 2018

01/04/2018  From the Internet of Things to the cloud to artificial intelligence, industries are seeing a new wave of technologies that have the potential to transform and significantly impact the world around us.

Nordson Corporation acquires Sonoscan

01/04/2018  Nordson Corporation has acquired Sonoscan, Inc., an Elk Grove Village, Illinois-based designer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems used in a variety of microelectronic, automotive, aerospace and industrial electronics assembly applications.

Fabless IC company sales top $100B for first time ever

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

Touchy nanotubes work better when clean

01/04/2018  Rice, Swansea scientists show that decontaminating nanotubes can simplify nanoscale devices.

Global semiconductor sales increase 21.5% year-to-year in November

01/03/2018  Worldwide market notches highest-ever monthly sales of $37.7 billion; sales increase 1.6 percent compared to October.

New Vivid Color HDR technology, for thinner, brighter, more colorful experience

01/03/2018  An alternative for power-efficient portable HDR displays, in Notebook, Tablet, SmartPhone, Monitor, TV, AR, and VR applications.

STMicroelectronics and USound deliver first advanced MEMS silicon micro-speakers

01/03/2018  STMicroelectronics (NYSE:STM) and USound, a fast-growing audio company, have delivered the first silicon micro-speakers resulting from their technology collaboration announced last year.

Viewing atomic structures of dopant atoms in 3-D relating to electrical activity in a semiconductor

01/02/2018  Scientists at Tokyo Institute of Technology (Tokyo Tech) and their research team involving researchers of JASRI, Osaka University, Nagoya Institute of Technology, and Nara Institute of Science and Technology have just developed a novel approach to determine and visualize the three-dimensional (3D) structure of individual dopant atoms using SPring-8.

eVaderis completes tape-out of MRAM-based, memory-centric MCU demonstrator for next-gen IoT applications

01/02/2018  eVaderis, a semiconductor IP start-up that provides design solutions to improve the functionality, power efficiency and performance of its customers' semiconductor chips, has successfully demonstrated a fully functioning design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor's BA2X product line.



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Latest Article

Molecular-scale ALD discovery could have industrial-sized impact

03/31/2016  In the world of nano-scale technology, where work is conducted at the atomic level, even the smallest changes can have an enormous impact. And a new discovery by a University of Alberta materials engineering researchers has caught the attention of electronics industry leaders looking for more efficient manufacturing processes.





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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
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Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
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Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
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WEBCASTS

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

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MEMS

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MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

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Interconnects

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This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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EVENTS

DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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