NEWS ANALYSIS & FEATURES


Will new policy in China trigger big changes?

01/21/2015  In June 2014, the State Council of China issued the "National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures.

Ten lighting and LED trends to watch in 2015

01/20/2015  The recent restructuring by major global lighting companies will allow LED makers to raise capital for investments in 2015.

Apple Watch spurs rapid growth of market for wireless charging in wearable technology in 2015

01/20/2015  Propelled by the arrival of the Apple Watch, the global market for wireless power and charging in wearable applications is set to attain a gargantuan 3,000 percent expansion this year compared to 2014.

One of the largest semiconductor companies in Europe signs agreement with Oxford Instruments

01/20/2015  An agreement has been signed between one of the largest semiconductor companies in Europe and Oxford Instruments for the supply of multiple Failure Analysis (FA) systems, to be installed in its manufacturing sites globally over a period of two years.

Underdog DRAM

01/20/2015  DRAM shifts out of a slump, but sector still faces obstacles.

Carbon nanotube finding could lead to flexible electronics with longer battery life

01/16/2015  University of Wisconsin-Madison materials engineers have made a significant leap toward creating higher-performance electronics with improved battery life -- and the ability to flex and stretch.

Rice-sized laser, powered one electron at a time, bodes well for quantum computing

01/16/2015  Princeton University researchers have built a rice grain-sized laser powered by single electrons tunneling through artificial atoms known as quantum dots.

Solving an organic semiconductor mystery

01/16/2015  Berkeley Lab researchers uncover hidden structures in domain interfaces that hamper performance.

AKHAN Semiconductor first to invent fully transparent circuit creation process

01/15/2015  Adam Khan, founder and CEO of AKHAN Semiconductor, Inc. was granted a US patent by the US Patent and Trademark Office today for a groundbreaking process that adheres diamond, the only truly transparent semiconductor, to metals and alloys (including transparent metals) in a way that allows for reliable wire bonding and high conductivity.

Samsung Electronics starts mass producing industry’s first 8-gigabit graphics DRAM

01/15/2015  Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 8 gigabit (Gb) GDDR5 DRAM, based on the company’s leading-edge 20-nanometer (nm) process technology.

Amkor Technology announces settlement with Tessera

01/15/2015  Amkor Technology, Inc. today announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.

UC Berkeley Extension launches three online programs in semiconductor technology

01/15/2015  UC Berkeley Extension announces three online integrated circuit (IC) semiconductor technology programs to meet the training needs of the surging worldwide semiconductor industry; the industry is predicted to reach $345 billion in sales this year.

Orbotech announces collaboration between SPTS and Fraunhofer on process development of wafer level packaging

01/15/2015  Orbotech Ltd. today announced that SPTS Technologies is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial contract research, on next generation wafer level packaging of microelectronic devices.

SAMCO announces MOCVD demonstration availability for the GaN-550 MOCVD system

01/15/2015  SAMCO has announced MOCVD demonstration capability on a new gallium nitride (GaN-on-Si) system, the GaN-550, from Valence Process Equipment Inc.

Two companies honored with SEMI Award

01/14/2015  SEMI today announced that two companies, Brewer Science and Advanced Semiconductor Engineering, Inc. (ASE), are recipients of the 2014 SEMI Award for North America.

Further growth seen for semiconductor equipment and materials at SEMI ISS 2015

01/14/2015  The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Riding the Wave of Silicon Magic.”

JEOL and UC Irvine partner to develop electron microscopy and materials research center

01/14/2015  JEOL USA and the University of California's Irvine Materials Research Institute (IMRI) have entered into a strategic partnership to create a premier electron microscopy and materials science research facility.

SUNY Board appoints Dr. Alain Kaloyeros as founding president of SUNY Polytechnic Institute

01/14/2015  SUNY Polytechnic Institute (SUNY Poly) yesterday announced the SUNY Board of Trustees has appointed Dr. Alain Kaloyeros as the founding President of SUNY Poly.

Zinc oxide materials tapped for tiny energy harvesting devices

01/13/2015  New research helps pave the way toward highly energy-efficient zinc oxide-based micro energy harvesting devices with applications in portable communications, healthcare and environmental monitoring, and more.

MagnaChip offers automotive semiconductor manufacturing process technology

01/13/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has started to offer 0.18um automotive qualified process technology to foundry customers focused on high reliability automotive semiconductor applications.





Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS

FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
More Webcasts

EVENTS

SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015

FINANCIALS

NEW COMMENTS


NXP develops GaN-on-Si for power semiconductors with Singapore’s A*STAR
Quad Systems Corp., Willow Grove, Pa., has appointed Ted Shoneck to chief executive officer.
Large Al Ribbon Bonding: A Reliable Power Interconnect Solution

NEW PRODUCTS

Ultratech Cambridge NanoTech introduces the Savannah G2 ALD system
01/08/2015Ultratech, Inc., a supplier of ALD systems, as well as lithography, laser-processing and inspection systems used to manufacture semico...
Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...