NEWS ANALYSIS & FEATURES


Applied Materials announces 2017 Supplier of the Year Awards

07/14/2017  Applied Materials, Inc. today recognized 10 companies with Supplier of the Year Awards for their contributions to Applied's success over the past year.

ASM International launches Intrepid epitaxy tool

07/13/2017  ASM International introduced the Intrepid ES 300mm epitaxy (epi) tool for advanced-node CMOS logic and memory high-volume production applications.

ALD tools evolve with industry needs

07/13/2017  Veeco Instruments (Veeco) recently announced that Veeco CNT -- formerly known as Ultratech/Cambridge Nanotech -- shipped its 500th Atomic Layer Deposition (ALD) system to the North Carolina State University.

Digital revolution: The path to innovation is opened by disruption

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.

Industry acting to reduce greenhouse gases

07/13/2017  Semiconductor manufacturers use a variety of high global warming potential (GWP) gases to process wafers and to rapidly clean chemical vapor deposition (CVD) tool chambers.

EUV patterning materials evolving

07/13/2017  Global industry R&D hub IMEC defines the “IMEC 7nm-Node” (I7N) for finFETs to have 56 nm Contacted Gate Pitch (CGP) with 40 nm Metal Pitch (MP), and such critical mask layers can be patterned with a single exposure of 0.33 N.A. EUVL as provided by the ASML NXE:3400B tool.

SEMI Awards honor process and technology integration achievements

07/13/2017  SEMI announced the recipients of the 2017 SEMI Awards for the Americas.

Standards industry leaders honored at SEMICON West 2017

07/12/2017  SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards reception held during SEMICON West 2017.

Bridging the macro and micro world of defects

07/12/2017  When it comes to defects and contamination in the semiconductor manufacturing industry, most people tend to think of small, sub-nm defects at the transistor level. As important as those are, there are plenty of things that can go wrong and be seen at the macro level.

New materials, new challenges

07/12/2017  In order to increase device performance, the semiconductor industry has slowly been implementing many new materials.

James C. Morgan unveils Applied Wisdom

07/12/2017  James C. Morgan will be a special guest presenter during the SEMICON West keynote session this morning at the Yerba Buena Center.

AI and collaboration key to future success

07/12/2017  Keynote speakers Terry Higashi of Tokyo Electron Ltd. and Tom Caulfield of GlobalFoundries took the stage at the Yerba Buena Theater Tuesday morning to predict major changes in the goals and operations of the semiconductor industry.

Thinking thin brings new layering and thermal abilities to the semiconductor industry

07/11/2017  In a breakthrough for the semiconductor industry, researchers demonstrate a new layer transfer technique called "controlled spalling" that creates many thin layers from a single gallium nitride wafer.

SEMI's Board election results and leadership appointments announced

07/11/2017  SEMI today announced that Mike Allison, president of the Semiconductor Division at Edwards, and Daisuke Murata, president and CEO of Murata Machinery, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

200mm fabs thriving

07/11/2017  Today, at SEMICON West in San Francisco, Calif., SEMI issued an update to its 200mm Fab Outlook report, with improved and expanded report forecasting of 200mm fab trends out to 2021.

Exploring smart sensor explosive growth

07/11/2017  MEMS & Sensors Industry Group (MSIG), the industry association advancing MEMS and sensors across global markets, is hosting a TechXPOT program today, titled “What’s Next for MEMS & Sensors: Big Growth of Disruptive Applications for Smart Sensing Changes the Business.”

Linde Group announces rare gas capacity expansions

07/11/2017  The Linde Group is expanding production of the rare gases used by the semiconductor industry, including xenon, which is in increasing demand for etching 3D semiconductor structures.

Edwards sees promise in sub-fab data analysis

07/11/2017  Integrating data from various sensors in semiconductor fabs is a key focus in the industry now, and the sub-fab is an increasingly important part of the equation.

Moscone Center construction during SEMICON West

07/11/2017  The Moscone Center will be undergoing major construction during Semicon West week.

China growth surge highlighted at SEMICON West

07/11/2017  SEMI added a new high-profile program on China to its 2017 conference lineup for SEMICON West.



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Latest Article

Impact of triboelectric charging from DI water on transistor gate damage

03/30/2016  Optimized settings for DI water pressure at CMP and careful analysis of interconnect layout are used to improve quality on a complex analog design.





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VIDEOS

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Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Wednesday, August 9, 2017 at 1 p.m. ET

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MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

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EVENTS

Advanced Process Control Conference
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http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
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http://ieee-iedm.org
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SEMI-THERM
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March 19, 2018 - March 23, 2018

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