NEWS ANALYSIS & FEATURES


SEMI reports 2013 semiconductor photomask sales of $3.1B

04/14/2014  SEMI reports that the worldwide semiconductor photomask market was $3.1 billion in 2013 and is forecasted to reach $3.3 billion in 2015.

KLA-Tencor Corporation receives Intel’s Preferred Quality Supplier Award

04/11/2014  KLA-Tencor Corporation has been recognized as one of 18 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2013.

The Week in Review: April 11, 2014

04/11/2014  SIA reports sales of semiconductors in February 2014 increased 11.4 percent from February 2013; GSA celebrates 20 years; SEMI expanding Innovation Village at SEMICON Europa

Domain walls in nanowires cleverly set in motion

04/10/2014  Important prerequisite for the development of nano-components for data storage and sensor technology.

New "switch" could power quantum computing

04/10/2014  A light lattice that traps atoms may help scientists build networks of quantum information transmitters.

Sunlight generates hydrogen in new porous silicon

04/10/2014  Porous silicon manufactured in a bottom up procedure using solar energy can be used to generate hydrogen from water, according to a team of Penn State mechanical engineers, who also see applications for batteries, biosensors and optical electronics as outlets for this new material.

SEMI announces Innovation Village at SEMICON Europa 2014

04/09/2014  After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

SEMI releases fourth quarter 2013 worldwide photovoltaic equipent market statistics report

04/09/2014  Billings and bookings show improvement in the fourth quarter.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

04/08/2014  The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

ROHM Semiconductor and imec join forces for ultra-low power radio R&D

04/07/2014  Nanoelectronics research center imec and ROHM Semiconductor Co. Ltd., a world-leading supplier of electronic components, announced today that they have entered into a strategic partnership for research collaboration on ultra-low power (ULP) radio technology for small battery-operated wireless devices.

To bridge LEDs' green gap, scientists think small

04/04/2014  Nanostructures half the breadth of a DNA strand could improve the efficiency of light emitting diodes (LEDs), especially in the "green gap," a portion of the spectrum where LED efficiency plunges, simulations at the U.S. Department of Energy's National Energy Research Scientific Computing Center (NERSC) have shown.

The sustainable manufacturing imperative

04/03/2014  While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.

UV LED Curing for the Electronics Industry

04/03/2014  This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.

Park Systems introduces automatic defect review for semiconductor wafers

04/03/2014  Park Systems this week introduced the Automatic Defect Review (ADR)AFM for 300mm bare wafers, a fully automated AFM solution that improves throughput of AFM defect review by up to 1,000 percent.

ON Semiconductor to acquire Trusense Imaging, Inc.

04/03/2014  ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.

IP interoperability in SoCs: Mix and match doesn’t always work

03/26/2014  More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified specifications that inevitably raise the bar for performance and power usage, and it will probably contain new IP that must be integrated.

Roll over flat panel displays

03/25/2014  Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes? Semiconductor Manufacturing & Design discussed the issues with Mac McDaniel, Director and Chief Marketing Officer, Display Business Group, Applied Materials, Michael Ciesinski, MD of the Flextech Alliance, and Keri Goodwin, Principal Scientist from the Centre for Process Innovation (CPI), in the UK.

The Week in Review: March 21, 2014

03/21/2014  UC Berkley research in on-chip inductors; Equipment bookings and billings continue along a steady trend; SMIC CEO awarded SEMI Outstanding EHS Achievement Award; EVG opens HQ in China; ChaoLogix offers security for semi chips; Applied Materials named a World's Most Ethical Company

3D EDA brings together proven 2D solutions

03/14/2014  Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Big sell: IP Trends and Strategies

03/10/2014  Experts from Semico Research, Cadence, Uniquify and Sonics challenge growth trends for semiconductor intellectual property (SIP) with FinFETs, the IoT and more.



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS

Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

EVENTS

The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014

FINANCIALS

NEW COMMENTS


Kyocera room-temp epoxy molding compound competes with frozen semiconductor package encapsulants
Nano enables practical, portable fuel cells
Deca Technologies ships 100-millionth wafer-level packaged component

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...