NEWS ANALYSIS & FEATURES


Orbotech's SPTS Technologies' Sigma fxP PVD system chosen by Chipmore

09/14/2017  SPTS Technologies today announced that it has been selected by Chipmore Technology Corporation Limited.

Josh Shiode joins Semiconductor Industry Association as Government Affairs Director

09/13/2017  In this role, Shiode will help advance the U.S. semiconductor industry’s key legislative and regulatory priorities related to semiconductor research and technology, product security, and high-skilled immigration, among others.

Soitec launches FD-SOI pilot line in Singapore

09/13/2017  This is the first stage in beginning FD-SOI production in Singapore and providing multi-site FD-SOI substrate sourcing to the global semiconductor market.

Cadence delivers design and analysis flow enhancements for TSMC InFO and CoWoS 3D packaging tech

09/13/2017  Cadence Design Systems, Inc. today announced new capabilities that complete its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

Entegris expands its Taiwan tech center to add new microcontamination analysis and tech development capacity

09/13/2017  Entegris Inc., a specialty materials provider, today announced the expansion of its Taiwan Technology Center for Research and Development (TTC) in Hsinchu, Taiwan.

Quantum sensors decipher magnetic ordering in a new semiconducting material

09/13/2017  For the first time, physicists have successfully imaged spiral magnetic ordering in a multiferroic material.

New manufacturing process for SiC power devices opens market to more competition

09/13/2017  Researchers from North Carolina State University are rolling out a new manufacturing process and chip design for silicon carbide (SiC) power devices, which can be used to more efficiently regulate power in technologies that use electronics.

SEMI reports second quarter 2017 worldwide semiconductor equipment figures

09/12/2017  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$14.1 billion for the second quarter of 2017.

More than 45,000 expected at SEMICON Taiwan 2017

09/12/2017  Upbeat about the growth prospects of Taiwan's electronics sector, more than 45,000 visitors are expected to attend SEMICON Taiwan 2017 which opens tomorrow at Taipei's Nangang Exhibition Center.

KLA-Tencor releases five patterning control systems for sub-7nm IC manufacturing

09/12/2017  KLA-Tencor Corporation today introduced five patterning control systems that help chipmakers achieve the strict process tolerances required for multi-patterning technologies and EUV lithography at the sub-7nm logic and leading-edge memory design nodes.

Medicine of the future: New microchip technology could be used to track 'smart pills'

09/12/2017  Caltech researchers have developed microscale devices that relay their location in the body.

eBeam Initiative surveys report increased optimism for EUV and new photomask trends

09/11/2017  Survey results to be presented at 2017 Photomask Technology Symposium.

New deionized water vapor delivery module from Brooks Instrument

09/11/2017  Brooks Instrument will be exhibiting at SEMICON Taiwan 2017 with a new vaporization product, mass flow controllers with high-speed EtherCAT, and a broad range of other mass flow meters, controllers and capacitance manometers for semiconductor manufacturing.

Rudolph Technologies launches new Truebump technology at SEMICON Taiwan 2017

09/11/2017  The Dragonfly System now features fast, accurate and repeatable 3D bump metrology.

EV Group receives multiple lithography and metrology system orders for wafer-level optics manufacturing

09/11/2017  Demand for manufacturing solutions driven by consumer electronics, mobile and other applications requiring advanced 3D / optical sensors.

UPMEM announces the first processing in-memory chip accelerating Big Data applications

09/08/2017  UPMEM, a fabless semiconductor startup company, announces UPMEM Processing In-Memory (PIM), the next generation hardware solution for data intensive applications in the datacenter, solving server-level efficiency and performance bottlenecks.

NUS scientists unravel new insights into promising semiconductor material

09/08/2017  Researchers from the National University of Singapore (NUS) have established new findings on the properties of two-dimensional molybdenum disulfide (MoS2), a widely studied semiconductor of the future.

Lam Research acquires Coventor

09/08/2017  Lam Research Corporation announced that it has completed the acquisition of Coventor, Inc.

Cadence delivers comprehensive IP portfolio for TSMC 16FFC automotive design enablement platform

09/07/2017  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it is delivering a comprehensive automotive IP portfolio for the TSMC 16nm FinFET Compact (16FFC) automotive process technology.

Kulicke & Soffa and Kinik sign collaboration agreement to provide comprehensive dicing blades solutions

09/07/2017  Kulicke & Soffa Industries, Inc. announced today its collaboration agreement with Kinik Company, to provide comprehensive dicing blades solutions.



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Managing hazardous process exhausts in high volume manufacturing

03/30/2016  Integrated sub-fab systems allow HVM fab operators to safely and efficiently implement new processes containing hazardous process chemicals.





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