NEWS ANALYSIS & FEATURES


The peaks and valleys of silicon

06/29/2015  When the new iPhone came out, customers complained that it could be bent -- but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers.

Building a better semiconductor

06/29/2015  Research led by Michigan State University could someday lead to the development of new and improved semiconductors.

Solid State Watch: June 19-25, 2015

06/26/2015  IHS says Moore’s Law led to trillions added in global economy; Cadence and Applied Materials collaborate on CMP process optimization; Power transistors seen stabilizing and setting record sales in 2015; Nanowires could be the LEDs of the future

“What’s next?” ─ Advances in technology at SEMICON West 2015

06/25/2015  The latest manufacturing, materials and production developments in semiconductor and related technologies will be featured at SEMICON West 2015 on July 14-16 at Moscone Center in San Francisco, Calif.

Deca Technologies exceeds half billion units shipped

06/25/2015  Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, announced today that it has shipped more than half a billion units since the company's launch.

Stanford researchers stretch a thin crystal to get better solar cells

06/25/2015  Crystalline semiconductors like silicon can catch photons and convert their energy into electron flows. New research shows a little stretching could give one of silicon's lesser-known cousins its own place in the sun.

Nanowires could be the LEDs of the future

06/25/2015  The latest research from the Niels Bohr Institute shows that LEDs made from nanowires will use less energy and provide better light.

SMIC receives "2014 Foundry Supplier of the Year" award from Qualcomm

06/25/2015  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced its receipt of the "2014 Foundry Supplier of the Year" award from customer Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.

Toward tiny, solar-powered sensors

06/24/2015  Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells.

Ultratech Cambridge NanoTech ships 400th ALD system

06/24/2015  The system was purchased by the University of Michigan.

Freescale takes its next generation QorIQ multicore platform to 16nm FinFET technology

06/24/2015  Freescale Semiconductor has disclosed initial details regarding the next generation of its successful QorIQ multicore processor portfolio, today announcing it will drive innovation for the secure Internet of Tomorrow (IoT) on highly advanced 16nm FinFET process technology.

SMIC, Huawei, imec, and Qualcomm in joint investment on SMIC's new R&D company

06/23/2015  The joint venture company will focus on R&D towards next generation CMOS logic technology and build China's most advanced integrated circuit (IC) development R&D platform.

Exagan raises €5.7M to produce high-efficiency GaN-on-Silicon power-switching devices on 200mm wafers

06/23/2015  Exagan, a start-up innovator of gallium-nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, today announced it has raised €5.7 million in first-round financing that will be used to produce high-speed power switching devices on 200mm wafers.

imec and Holst Centre present a gas sensing platform for intuitive IoT applications

06/23/2015  Imec and Holst Centre have developed a small NO2 sensor featuring a low power consumption in the mW range.

Breaking Down Power Management Verification

06/22/2015  During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.

UMC collaborates with ARM to validate UMC 14nm finFET process

06/22/2015  United Microelectronics Corporation, a global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node.

Technology innovation is driving fan-in wafer level packaging adoption with more and more applications

06/22/2015  Fan-in WLP is experiencing continuous growth and attracting new applications, according to Yole Développement's latest report “Fan-in Wafer Level Packaging: Market & Technology Trends."

MEMS applications take the stage in the first edition of the European MEMS Summit

06/22/2015  The first edition of this Summit will take place on September 17-18, 2015 in Milan, Italy and its theme will be “Sensing the Planet, MEMS for Life.”

Bosch selects Rudolph for semiconductor inspection solutions

06/22/2015  Rudolph Technologies, Inc. announced today that the MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30 Inspection System for various steps in the front- and back-end fabrication processes of micro electrical mechanical systems (MEMS) devices.

Silicon Valley's specialty foundry Noel Technologies promotes Brenda Hill to VP

06/22/2015  Noel Technologies, a specialty foundry in Silicon Valley providing process development and substrate fabrication for a variety of high-technology industries, has promoted Brenda Hill to vice president of business development, marketing and sales.





VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
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Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS

Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Interconnects

July 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

EVENTS

SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015

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