NEWS ANALYSIS & FEATURES


Brighter shine for LEDs with Picosun ALD

02/13/2017  Picosun Oy, a provider of high quality Atomic Layer Deposition (ALD) technology, announced a collaboration with Osram Opto Semiconductors and other partners to create a new generation of advanced LED lighting solutions.

GlobalFoundries 12-inch wafer production line in Chengdu commences operation

02/13/2017  The company will continue investing in its wafer plants in the United States and Germany, expand its capacity in Singapore, and construct a facility to produce 12-inch wafers in Chengdu, China in order to satisfy Chinese and global demands for the company's 22FDX technology.

A new platform to study graphene's electronic properties

02/13/2017  IBS scientists model the electronic structure of graphene.

Applied Materials CTO Dr. Om Nalamasu elected to National Academy of Engineering

02/10/2017  Applied Materials, Inc. announced today that Dr. Om Nalamasu, Senior Vice President and Chief Technology Officer, has been elected to the U.S. National Academy of Engineering (NAE), one of the highest professional honors for engineers.

AMOLED production equipment purchases to reach record high in 2017

02/10/2017  The flat-panel display (FPD) industry is in the midst of a historic wave of building new factories to manufacture active matrix organic light emitting diode (AMOLED) displays.

A new sensitive and stable self-powered photodetector

02/10/2017  Researchers in Singapore and China collaborate to create new photodetector based on GdNiO3/Nb-doped SrTiO3 p-n heterojunction.

Grant Pierce named Chairman of the ESD Alliance Board of Directors

02/09/2017  Grant A. Pierce, chief executive officer (CEO) of Sonics, Inc. was elected by the Board of Directors of the Electronic System Design Alliance (ESD Alliance) to serve as its chairman.

Toshiba starts construction of Fab 6 and memory R&D center at Yokkaichi, Japan

02/09/2017  Toshiba Corporation today announced that it has started construction of a new semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.

Penn researchers are among the first to grow a versatile 2-dimensional material

02/09/2017  University of Pennsylvania researchers are now among the first to produce a single, three-atom-thick layer of a unique two-dimensional material called tungsten ditelluride.

UNIST to engineer dream diodes with a graphene interlayer

02/08/2017  A team of researchers, affiliated with UNIST has created a new technique that greatly enhances the performance of Schottky Diodes (metal-semiconductor junction) used in electronic devices.

UNIST engineers oxide semiconductor just single atom thick

02/08/2017  A new study, affiliated with UNIST has introduced a novel method for fabrication of world's thinnest oxide semiconductor that is just one atom thick. This may open up new possibilities for thin, transparent, and flexible electronic devices, such as ultra-small sensors.

imec, Holst, ROHM debut all digital phase-locked loop for IoT radios

02/08/2017  At the 2017 International Solid-State Circuits Conference in San Francisco (US), imec, Holst Centre and ROHM today presented an all-digital phase-locked loop (ADPLL) for Internet-of-Things (IoT) radio transceivers.

SEMICON Korea huge 30th year anniversary event opens today

02/08/2017  SEMICON Korea 2017, opening today at COEX in Seoul, celebrates its 30th anniversary with its largest-ever exhibition.

NREL research pinpoints promise of polycrystalline perovskites

02/07/2017  A team of scientists from the Energy Department's National Renewable Energy Laboratory (NREL) determined that surface recombination limits the performance of polycrystalline perovskite solar cells.

UniPixel prepares for flexible display market

02/07/2017  UniPixel touch sensors pass 200,000 cycle fold test.

imec debuts plastic NFC tag, compatible to ISO protocols

02/07/2017  Innovative tag is the thinnest and mechanically most robust technology compatible to ISO protocols.

Nexperia emerges as dynamic new force in discretes, logic and MOSFETs

02/07/2017  Former Standard Products Division of NXP combines experience, product and operational excellence with customer focus and ambition.

Entegris announces higher-purity gas purification system platform with expanded manufacturing in Asia

02/07/2017  New media provides yield improvements in systems for advanced semiconductor and LED applications.

New photorelay from Toshiba features industry's smallest package

02/06/2017  Toshiba America Electronic Components, Inc. (TAEC) has added a new photorelay to its extensive lineup of photocouplers.

Kinetics Holding acquires U.S. semiconductor equipment company Wafab International

02/06/2017  Kinetics Holding GmbH announced today the acquisition of Wafab International Inc., a global supplier of wet processing stations and components.



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WIKA Group adopts HERCULES lithography track system from EV Group

02/17/2016  EV Group (EVG) today announced that WIKA Group has placed an EVG HERCULES lithography track system into production for manufacturing pressure sensor devices.





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LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
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http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
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ASMC 2017
Saratoga Springs, NY
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May 15, 2017 - May 18, 2017

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