NEWS ANALYSIS & FEATURES


Microsemi honored as M2M Network Equipment Technology Company of the Year by IoT Breakthrough Awards

01/06/2017  Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it was named M2M Network Equipment Technology Company of the Year by the inaugural IoT Breakthrough Awards.

Versum Materials reaches milestone with installation of 200th CHEMGUARD Gen. III refill system

01/06/2017  The Delivery Systems and Services Group (DS&S) of Versum Materials, Inc. (NYSE: VSM) has realized an important milestone: the sale and commissioning of its 200th CHEMGUARD Gen III high purity, liquid delivery system since the product line launched in early 2016.

imec collaborates with City of Antwerp and Flanders to establish Smart City Living Lab

01/06/2017  How can the Internet of Things change the future of the average citizen? To answer this question, imec joins forces with the City of Antwerp and the Flanders region to turn Antwerp into a Living Lab in which businesses, researchers, local residents and the city itself will experiment with smart technologies that aim to make urban life more pleasant, enjoyable and sustainable.

Telecommunications light amplifier could strengthen integrity of transmitted data

01/05/2017  Imagine a dim light which is insufficiently bright enough to illuminate a room. An amplifier for such a light would increase the brightness by increasing the number of photons emitted. Photonics researchers have created such a high gain optical amplifier that is compact enough to be placed on a chip. The developed amplifier would help to efficiently increase the power of the transmitted light before it is completely depleted through optical losses.

Atomera selects TSI Semiconductors to accelerate semiconductor materials advancements

01/05/2017  Foundry to provide manufacturing, electrical test and characterization services to shorten Atomera's time to market.

Vesper and DSP Group demo near-zero-power voice-activation for battery-powered devices at CES 2017

01/05/2017  Vesper, DSP Group and Sensory will demonstrate their new development platform from January 5-8, 2017 during CES 2017.

2017 Symposia on VLSI Technology & Circuits opens online submission for papers

01/05/2017  Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits, to be held at the Rihga Royal Hotel in Kyoto, Japan from June 5 - 8, 2017.

Intel to acquire 15% ownership of HERE

01/04/2017  Intel has agreed to purchase a 15 percent ownership stake in HERE, a global provider of digital maps and location-based services, from HERE’s current indirect shareholders.

Bosch launches smallest high performance barometric pressure sensor at CES 2017

01/04/2017  Today, Bosch Sensortec launches the BMP380, the company's smallest and best performing barometric pressure sensor, with a compact size of only 2.0 x 2.0 x 0.75 mm3.

Germanium's semiconducting and optical properties probed under pressure

01/04/2017  Germanium may not be a household name like silicon, its group-mate on the periodic table, but it has great potential for use in next-generation electronics and energy technology.

Miniscule amounts of impurities in vacuum greatly affecting OLED lifetime

01/03/2017  Reproducibility is a necessity for science but has often eluded researchers studying the lifetime of organic light-emitting diodes (OLEDs).

Imec and Besi demonstrate long-term reliability of Ni-Cu-Ag plated solar modules

01/03/2017  Today, imec (partner in EnergyVille) and BE Semiconductor Industries N.V. (Besi), a manufacturer of assembly equipment for the semiconductor industry, announced that they have demonstrated long-term reliability in five full size 60-cells Nickel/Copper/Silver (Ni/Cu/Ag) plated solar cell modules, confirming the industrial value of this metallization technology.

ESD Alliance reports EDA industry revenue increase for Q3 2016

12/23/2016  The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 7.0 percent for Q3 2016.

Stability challenge in perovskite solar cell technology

12/23/2016  New research reveals intrinsic instability issues of iodine-containing perovskite solar cells.

Sensor sensation

12/22/2016  OIST researchers create a novel sensor capable of measuring both charge and mass of biomolecules with potential applications in healthcare diagnostics.

Advance in intense pulsed light sintering opens door to improved electronics manufacturing

12/22/2016  Faster production of advanced, flexible electronics is among the potential benefits of a discovery by researchers at Oregon State University's College of Engineering.

Mentor Graphics Joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/22/2016  Mentor Graphics Corp. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

Public tender offer by TDK subsidiary EPCOS to acquire Tronics successful

12/21/2016  TDK Corporation and Tronics Microsystems SA jointly announced today that the all-cash public tender offer launched by TDK’s wholly-owned subsidiary EPCOS AG (“EPCOS”) was successfully closed on December 14, 2016.

Advances in artificial intelligence, IoT highlight IHS Markit's global technology predictions for 2017

12/21/2016  From artificial intelligence to the Internet of Things (IoT), far-reaching innovations are unfolding in virtually every technology sector around the globe, continuing to change the way consumers, businesses and machines interact while also spurring the next revolution in tech market growth.

New material with ferroelectricity and ferromagnetism may lead to better computer memory

12/21/2016  Scientists at Tokyo Institute of Technology (Tokyo Tech) have demonstrated that ferroelectricity and ferromagnetism coexist at room temperature in thin films of bismuth-iron-cobalt oxide. The research could have implications in the next generation of computer memory and sensors.



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WIKA Group adopts HERCULES lithography track system from EV Group

02/17/2016  EV Group (EVG) today announced that WIKA Group has placed an EVG HERCULES lithography track system into production for manufacturing pressure sensor devices.





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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

High Efficiency Wireless: 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

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WEBCASTS

Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

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Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

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EVENTS

European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

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