NEWS ANALYSIS & FEATURES


AI Technology, Inc. introduces temporary bonding adhesive for thin wafer handling

06/23/2016  For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

POET Technologies announces closing of acquisition of BB Photonics

06/23/2016  POET completes the transaction owning 100% of BB Photonics and its assets, including intellectual property and technologies.

Power transistors to see less volatility in second half of this decade

06/22/2016  Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.

Building U.S. manufacturing ecosystems for emerging advanced packaging technologies

06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

Diamond-based resonators might become highly sensitive detectors

06/22/2016  Physicists from the Technological Institute for Superhard and Novel Carbon Materials, the Moscow Institute of Physics and Technology, and the Siberian Federal University have mathematically modelled diamond-based microstructures for producing compact high sensitivity sensors.

Samsung introduces new line-up of LED components for automotive lighting, featuring chip-scale packaging

06/21/2016  Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.

Amkor Technology receives Qualcomm Technologies’ 2015 Supplier of the Year award

06/21/2016  Amkor Technology Inc., a provider of semiconductor packaging and test services, today announced it has received the Supplier of the Year award from Qualcomm Technologies, Inc.

Ultratech receives follow-on order from major Asian foundry for laser spike annealing system

06/21/2016  The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.

EV Group scores fourth consecutive triple crown win in annual VLSIresearch customer satisfaction survey

06/21/2016  EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey.

Solar cells for greener and safer energies

06/21/2016  ICFO researchers report on low-temperature, solution-processed, environmentally friendly inorganic solar cells made with Earth-abundant materials capable of operating with a power conversion of 6.3 percent.

Accelerate and de-risk materials decisions for semiconductor R&D with IMI Labs from Intermolecular

06/21/2016  Intermolecular, Inc. today announced IMI Labs for Semiconductor, a materials innovation service to help semiconductor companies explore, discover and characterize new materials.

Samco boosts shipment capacity with second production center

06/21/2016  Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.

Dialog Semiconductor announces director appointment

06/17/2016  Dialog Semiconductor plc, a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth low energy technology, today announced the appointment of Nick Jeffery to the company's Board of Directors.

Circuit technology that resolves issues with high-frequency piezoelectric resonators

06/17/2016  Realizing compact, low-cost, high-speed radio communication systems for the IoT age.

Let there be light

06/17/2016  Utah engineer discovers light can stamp out defects in semiconductors for better solar panels and LED bulbs.

Leti extends CMOS platforms' lifespan and explores new computing paradigms

06/17/2016  Leti, an institute of CEA Tech, said today its teams have demonstrated how Fully Depleted Silicon on Insulator (FDSOI) technology can be scaled downwards and how the experience in thin-film engineering built on FDSOI development can be harnessed for innovative architectures and computing paradigms.

North American semiconductor equipment industry posts May 2016 book-to-bill ratio of 1.09

06/17/2016  North America-based manufacturers of semiconductor equipment posted $1.75 billion in orders worldwide in May 2016 (three-month average basis) and a book-to-bill ratio of 1.09.

What is driving the advanced packaging market in China?

06/16/2016  Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015.

Imec demonstrates gate-all-around MOSFETs with lateral silicon nanowires at scaled dimensions

06/16/2016  Today, at the 2016 Symposia on VLSI Technology & Circuits, nano-electronics research center imec presented gate-all-around (GAA) n- and p-MOSFET devices made of vertically stacked horizontal silicon (Si) nanowires (NWs) with a diameter of only 8nm.

Ultratech enables world's lowest contact resistivity for finFETs with LXA melt laser annealing technology

06/16/2016  This record achievement, as well as additional results, was presented in a paper at the 2016 Symposia on VLSI Technology and Circuits held June 13-17, at the Hilton Hawaiian Village in Honolulu, Hawaii.



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Entegris announces new post-CMP cleaning solutions

01/26/2016  Entegris, Inc., a developer of yield-enhancing materials and solutions, today announced new post-chemical mechanical planarization (post-CMP) cleaning solutions for semiconductor manufacturing.





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EVENTS

SEMICON West 2016
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http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
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http://www.semiconeuropa.org
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