NEWS ANALYSIS & FEATURES


Magnetic sensor industry is moving into a consolidation phase

11/13/2017  With 7% CAGR between 2016 and 2022, the magnetic sensor market should reach almost US$ 2.5 billion in 2022.

Improving sensor accuracy to prevent electrical grid overload

11/13/2017  Engineers take note -- new current sensors need fine-tuning to accurately inform monitors of the electrical grid about incoming surges.

SunLike series LEDs from Seoul Semiconductor deliver natural spectrum human-centric lighting sources

11/13/2017  Seoul Semiconductor exhibited its new SunLike Series LEDs, the world's first LED to produce light that closely matches the spectrum of natural sunlight, at the recent Professional Lighting Design Conference.

Micron advances persistent memory with 32GB NVDIMM

11/13/2017  Micron Technology, Inc., today announced a new 32GB NVDIMM-N offering twice the capacity of existing NVDIMMs, providing system designers and original equipment manufacturers with new flexibility to work with larger data sets in fast persistent memory.

Leti demonstrates world's first 300mm wafer-to-wafer direct hybrid bonding with 1-micron pitch

11/13/2017  New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications.

U.S. semiconductor chemical suppliers lost market share over past decade

11/10/2017  U.S. semiconductor chemical suppliers lost market share to Japanese and European competitors in every major segment over the past decade, according to a new report from The Information Network.

An interview with Bosch Sensortec CEO: IoT, environmental sensing and value chain

11/10/2017  SEMI interviewed one of the four keynotes presenting on November 14 during the Opening Ceremony, Dr. Stefan Finkbeiner, CEO of Bosch Sensortec, about topics about developments and trends in IoT, Environmental Sensing, and Value Chain as well as the role of Europe.

The next generation of power electronics? Gallium nitride doped with beryllium

11/10/2017  How to cut down energy loss in power electronics? The right kind of doping.

2017 Global Semiconductor Alliance Award nominees announced

11/09/2017  The Global Semiconductor Alliance (GSA) today announced the 2017 award nominees for the GSA Awards Dinner Celebration.

Leti joins DARPA-funded consortium to develop implantable device for restoring vision

11/09/2017  Leti announced today that a team of its researchers is participating in a U.S.-funded project to develop a safe, implantable neural interface system to restore vision by stimulating the visual cortex.

Tech increases microfluidic research data output 100-fold

11/09/2017  Researchers have developed a technique that allows users to collect 100 times more spectrographic information per day from microfluidic devices, as compared to the previous industry standard. The novel technology has already led to a new discovery: the speed of mixing ingredients for quantum dots used in LEDs changes the color of light they emit - even when all other variables are identical.

Alpha and Omega Semiconductor announces shield gate technology generation 2 100V 3.6mOhm MOSFET

11/09/2017  Alpha and Omega Semiconductor Limited today announced the release of AONS66916 production utilizing the latest Alpha Shield Gate Technology Generation 2 (AlphaSGT2).

Advanced wireless-charging chip from STMicroelectronics enables faster charging of smartphones and tablets

11/09/2017  STMicroelectronics is powering up wireless charging for mobile devices by introducing one of the world's first chips to support the latest industry standard for faster charging.

Automotive electronic systems growth strongest through 2021

11/09/2017  IC Market Drivers 2018 report ranks major end-use applications and their impact on IC market growth.

A*STAR IME's new multi-chip FOWLP development line to drive innovation and growth in semiconductor industry

11/08/2017  A*STAR’s Institute of Microelectronics (IME) has established a development line to accelerate the development of fan-out wafer level packaging (FOWLP) capabilities for next-generation Internet of Things (IoT) technologies.

EUV leads the next generation litho race

11/08/2017  As previously reported by Solid State Technology, the eBeam Initiative recently reported the results of its lithography perceptions and mask-makers' surveys. After the survey results were presented at the 2017 Photomask Technology Symposium, Aki Fujimura, CEO of D2S, the managing company sponsor of the eBeam Initiative, spoke with Solid State Technology about the survey results and current challenges in advanced lithography.

DARPA's new initiative

11/08/2017  Earlier this year, DARPA's Microsystems Technology Office (MTO) announced a new Electronics Resurgence Initiative (ERI) "to open pathways for far-reaching improvements in electronics performance well beyond the limits of traditional scaling."

Enabling the A.I. era

11/08/2017  There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

Semiconductor super cycle: Market trends, drivers and forecasts

11/08/2017  2017 will be a record-breaking year. Semiconductor sales will exceed $400 billion for the first time and semiconductor equipment sales will finally shatter the historic high set in 2000. What is driving this growth?

Third quarter 2017 silicon wafer shipments hit another quarterly record

11/08/2017  Worldwide silicon wafer area shipments increased during the third quarter 2017 when compared to second quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.



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Latest Article

Molecular-scale ALD discovery could have industrial-sized impact

03/31/2016  In the world of nano-scale technology, where work is conducted at the atomic level, even the smallest changes can have an enormous impact. And a new discovery by a University of Alberta materials engineering researchers has caught the attention of electronics industry leaders looking for more efficient manufacturing processes.





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VIDEOS

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EVENTS

IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
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http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018

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