Crystal clear imaging: Infrared brings to light nanoscale molecular arrangement

10/14/2016  Berkeley Lab and University of Colorado-Boulder team develop new way to reveal crystal features in functional materials.

Peregrine Semiconductor wins 2016 ECN IMPACT Award

10/14/2016  Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator), announces that the UltraCMOS PE42723 high linearity RF switch has won an ECN IMPACT Award in the market disruptor category.

Sapphire industry: More than just LEDs

10/14/2016  LED remains the dominant sapphire application in 2016. Overall, rates of usage in smartwatches have been disappointing and have decreased below 2015 levels.

The future of electronics at SEMICON Europa 2016

10/13/2016  SEMICON Europa 2016, opening in less than two weeks in Grenoble, will explore the issues facing Europe's semiconductor and electronics industries, including processes, materials, equipment and supply chain.

Samsung introduces LED modules based on chip scale packaging for spotlights and downlights

10/13/2016  Samsung Electronics Co., Ltd. today announced a new line-up of chip scale package (CSP) LED modules for spotlights and downlights that features color tunability and increased design compatibility.

SMIC Shanghai starts construction of a new 12-inch wafer fab

10/13/2016  Semiconductor Manufacturing International Corporation, the largest and most advanced foundry in Mainland China, today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.

Researchers develop DNA-based single-electron electronic devices

10/13/2016  Researchers at the Nanoscience Center (NSC) of the University of Jyväskylä and BioMediTech (BMT) of the University of Tampere have now demonstrated a method to fabricate electronic devices by using DNA.

SEMI announces retirement of president and CEO

10/13/2016  McGuirk will continue to lead SEMI in his current capacity until a successor is appointed.

Cicada wings inspire antireflective surfaces

10/12/2016  A team of Shanghai Jiao Tong University researchers in China has developed antireflective structures capable of suppressing visible light at different angles of incidence -- with potential for solar cells.

Nanoscale confinement leads to new all-inorganic perovskite with exceptional solar cell properties

10/12/2016  Scientists with the Energy Department's National Renewable Energy Laboratory (NREL) for the first time discovered how to make perovskite solar cells out of quantum dots and used the new material to convert sunlight to electricity with 10.77 percent efficiency.

Murata to acquire IPDiA

10/12/2016  Murata Manufacturing Co., Ltd. and IPDiA S.A. today announced that Murata Electronics Europe B.V., a wholly-owned subsidiary of Murata is about to acquire IPDiA, a 3D silicon capacitor technology developer headquartered in France, and IPDiA will become a subsidiary of Murata.

Dr. Raul Camposano joins Silvaco's Technical Advisory Board

10/12/2016  Silvaco, Inc., a provider of electronic design automation software and semiconductor IP, today announced that Dr. Raul Camposano has joined Silvaco's Technical Advisory Board (TAB).

2016 wafer demand grows while semiconductor chip revenue declines, says Semico Research

10/11/2016  Total wafer demand is expected to return to historical growth rates over the next five years. However, what is uncharacteristic of the past is the wide range of decline and growth that will be logged by specific product categories and technologies.

MEMS & Sensors Industry Group reveals Tech Showcase finalists

10/11/2016  MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.

Astronics Corporation expands Board of Directors with three new appointments

10/11/2016  Astronics Corporation announced that it has appointed three new independent directors to its Board: Jeffry D. Frisby, Warren C. Johnson and Neil Kim.

A novel battery design for making dual-ion batteries efficient

10/11/2016  Dual-ion batteries (DIBs) are a new type of battery developed in recent years, typically using graphite as both the cathode and anode material.

Flat panel display capital equipment spending surging

10/10/2016  Flat-panel display (FPD) equipment sales are expected to attain their highest sustained three-year level in the history of the industry.

Peregrine Semiconductor moves UK team to larger facility

10/10/2016  Located in Theale, this new office quadruples the working area and laboratory space to better accommodate the UK team's 90-percent growth since the Murata acquisition in Dec. 2014.

Metamaterial uses light to control its motion

10/10/2016  Researchers have designed a device that uses light to manipulate its mechanical properties. The device, which was fabricated using a plasmomechanical metamaterial, operates through a unique mechanism that couples its optical and mechanical resonances, enabling it to oscillate indefinitely using energy absorbed from light.

Mentor Graphics acquires Galaxy Semiconductor

10/10/2016  Mentor Graphics Corporation today announced that it has acquired Galaxy Semiconductor, a provider of test data analysis and defect reduction software for the semiconductor industry.



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers


Heterogeneous Integration: An Emerging Trend for Next Generation Microelectronic Devices and a Tremendous Opportunity for Advanced Packaging

October 26, 2016 at 1 p.m. ET / Sponsored by Air Products

With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.

Sponsored By:
More Webcasts


SEMICON Europa 2016
Grenoble, France
October 25, 2016 - October 27, 2016
Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017


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