NEWS ANALYSIS & FEATURES


Electro-optical switch transmits data at record-low temperatures

03/16/2017  A silicon optical switch newly developed at Sandia National Laboratories is the first to transmit up to 10 gigabits per second of data at temperatures just a few degrees above absolute zero.

Synopsys and TSMC collaborate to develop interface, analog and foundation IP for 12nm finFET process

03/16/2017  Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with TSMC to develop DesignWare Interface, Analog and Foundation IP for TSMC's 12FFC process.

The repulsion trick: A self-solving puzzle for organic molecules

03/16/2017  Jülich researchers have succeeded in controlling the growth of organic molecules using a special trick.

STMicroelectronics collaborates with iFLYTEK for Chinese voice-recognition cloud services

03/15/2017  STMicroelectronics, a global semiconductor and a top MEMS supplier, and iFLYTEK, a voice-recognition cloud service provider in China, have introduced the market's first IoT development platform that enables voice-recognition cloud services in Chinese.

Quantum movement of electrons in atomic layers shows potential of materials for electronics, photonics

03/15/2017  A University of Kansas research team has observed the counterintuitive motion of electrons during experiments in KU's Ultrafast Laser Lab. Because this sort of 'quantum' transport is very efficient, it could play a key role in a new type of manmade material that could be used someday in solar cells and electronics.

STATS ChipPAC achieves 1.5B unit milestone in fan-out wafer level packaging shipments

03/15/2017  STATS ChipPAC Pte. Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB).

Cadence achieves certification for TSMC's 7nm process technology

03/14/2017  Cadence Design Systems, Inc. today announced several new capabilities resulting from its close collaboration with TSMC to further 7nm FinFET design innovation for mobile and high-performance computing (HPC) platforms.

SEMI reports 2016 global semiconductor equipment sales of $41.2B

03/14/2017  SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $41.24 billion in 2016, representing a year-over-year increase of 13 percent.

Walker discusses emergence of new business models in semiconductor industry

03/14/2017  Jim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.

Cadence expands capabilities of integrated design and analysis flow for TSMC InFO packaging technology

03/13/2017  Cadence Design Systems, Inc. today announced new optimization capabilities within its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

Versum Materials receives TSMC "Excellent Performance Award"

03/13/2017  Versum Materials, Inc. announced today it received the "Excellent Performance Award" by the world's largest dedicated semiconductor foundry, TSMC.

Simultaneous detection of multiple spin states in a single quantum dot

03/13/2017  Osaka University-based researchers simultaneously detect multiple spin states in a quantum dot in real time, holding great promise for quantum computing.

Entegris partners with China's Spectrum Materials to manufacture Entegris specialty chemicals in China

03/13/2017  Entegris Inc. today announced it has signed an agreement with Spectrum Materials Co., Ltd. to expand its presence in China.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

Analog Devices completes acquisition of Linear Technology

03/10/2017  Analog Devices, Inc. today announced the completion of its acquisition of Linear Technology Corporation.

Sandia National Laboratories creates 3-D metasurfaces with optical possibilities

03/10/2017  The new Sandia metamaterials can be fabricated in multiple layers to form complex, three-dimensional meta-atoms that reflect more light than shiny gold surfaces, usually considered the ultimate in infrared reflectivity. The III-V materials also emit photons when excited -- something that silicon, which can reflect, transmit and absorb -- can't do.

Penn engineers' 'photonic doping' makes class of metamaterials easier to fabricate

03/10/2017  Now, University of Pennsylvania engineers have shown a way to make metamaterials with a single inclusion, providing easier fabrication, among other useful features.

Applied Materials names Thomas J. Iannotti chairman of the Board of Directors

03/10/2017  Applied Materials, Inc. today announced Thomas J. Iannotti as chairman of the Board of Directors effective immediately. Mr. Iannotti succeeds Willem P. Roelandts, who has retired from the board.

Soitec begins ramping up production of 200mm SOI wafers in China at SOI manufacturing partner's fab

03/09/2017  Soitec has announced that the ramp up to high-volume production of 200mm silicon-on-insulator (SOI) wafers has begun at the manufacturing facility of its Chinese partner Shanghai Simgui Technology Co., Ltd.

Synopsys advances virtual prototyping to enable system and semiconductor supply chain collaboration for next-gen SoCs

03/09/2017  Synopsys, Inc. today announced the availability of a key technology in virtual prototyping which enables architecture performance requirements to be easily shared through the supply chain.



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Veeco launches new K475i As/P MOCVD system

02/18/2016  Veeco Instruments Inc. announced today the launch of the new TurboDisc K475i Arsenic Phosphide MOCVD System for the production of red, orange, yellow light emitting diodes.





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