NEWS ANALYSIS & FEATURES


Visualizing formation in BEOL

05/07/2015  New tests show in real-time that cracks can run on top of and through metal layers.

Understanding the structural and optical properties of silicon nitride

05/07/2015  Using first-principles calculations, the electronic structures and optical properties that arise on doping-atom-containing silicon nitride systems are reported as a function of dielectric constant, reflectivity, absorption and loss spectra.

Enhanced thermal management solutions for RF power amplifiers

05/06/2015  Synthetic diamond heat spreaders and GaN-on-Diamond wafers have emerged as a leading thermal- management technology for RF Power Amplifiers.

New JEOL e-beam lithography system to enhance Quantum NanoFab capabilities

05/06/2015  A JEOL e-beam lithography system will soon be a new resource for quantum information science researchers that utilize the cutting-edge facilities at the University of Waterloo Quantum NanoFab in Waterloo, Ontario.

ITRS 2.0: Heterogeneous integration

05/06/2015  Interconnecting transistors and other components in the IC, in the package, on the printed circuit board and at the system and global network level, are where the future limitations in performance, power, latency and cost reside.

Co-design of chips, packages and boards

05/06/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools.

Quantum dots are finally ready for prime time

05/05/2015  Quantum dots are finally ready for prime time and will exceed traditional phosphor revenue by 2020 by allowing LCD to compete with OLED in the race for the next display generation.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm flash memory tech

05/05/2015  Microchip Technology Inc., through its Silicon Storage Technology subsidiary, and GLOBALFOUNDRIES today announced the full qualification and availability of SST’s 55nm embedded SuperFlash non-volatile memory on GLOBALFOUNDRIES’ 55nm Low Power Extended (LPx)/ RF enabled platform.

"Microcombing" creates stronger, more conductive carbon nanotube films

05/05/2015  Researchers from North Carolina State University and China's Suzhou Institute of Nano-Science and Nano-Biotics have developed an inexpensive technique called "microcombing" to align carbon nanotubes.

Defects in atomically thin semiconductor emit single photons

05/05/2015  Researchers at the University of Rochester have shown that defects on an atomically thin semiconductor can produce light-emitting quantum dots.

Improving organic transistors that drive flexible and conformable electronics

05/05/2015  A revolution is coming in flexible electronic technologies as cheaper, more flexible, organic transistors come on the scene to replace expensive, rigid, silicone-based semiconductors, but not enough is known about how bending in these new thin-film electronic devices will affect their performance.

MagnaChip announces management changes

05/04/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that Tae Young Hwang has resigned as the Company's Chief Operating Officer and President and from all other officer and director positions.

New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

05/04/2015  A new study coauthored by Wellesley economist, Professor Daniel E. Sichel, reveals that innovation in an important technology sector is happening faster than experts had previously thought, creating a backdrop for better economic times ahead.

SEMATECH and Exogenesis form strategic alliance to commercialize accelerated neutral atom beam tech

05/04/2015  SEMATECH and Exogenesis Corp. have agreed to a strategic alliance to commercialize Exogenesis' Accelerated Neutral Atom Beam (ANAB) technology and their nAcceltm accelerated particle beam equipment platform.

Solid State Watch: April 24-30, 2015

05/04/2015  Applied Materials and Tokyo Electron terminate merger; Sensor competition, actuator recovery impact supplier ranking; Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications; Silicon Motion announces agreement to acquire Shannon Systems

Intel and the Department of Science and Technology launch the "Innovate for Digital India Challenge"

05/01/2015  Intel in India reinforced its commitment to the Government of India's Digital India vision with the announcement of the Intel and DST "Innovate for Digital India Challenge", which will focus on the creation of products to increase technology adoption in India that will eventually result in the creation of a local technology ecosystem.

Dow's SOLDERON tin-silver plating chemistry wins prestigious Bronze Edison Award

05/01/2015  Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced that its SOLDERON BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category.

Entegris elects James P. Lederer to Board of Directors

05/01/2015  Entegris, Inc., a provider of yield-enhancing materials and solutions for advanced manufacturing processes, announced the election of James P. Lederer as an independent director at the Company's Annual Meeting of Shareholders held today.

It’s blue skies for Jabil and its customers

05/01/2015  While making printed circuit boards is still a big business for the St. Petersburg, Fla.-based Jabil, which boasts 90 plants in 24 countries around the world, the Blue Sky Center emphasizes that Jabil has progressed from being a board manufacturer to a full-service supply chain management firm.

Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications

04/30/2015  Researchers from the Georgia Institute of Technology have developed a novel cellular sensing platform that promises to expand the use of semiconductor technology in the development of next-generation bioscience and biotech applications.





Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Sensor Fusion and the Role of MEMS in IoT

Thursday May 28, 2015 at 1:00 p.m. EST

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
More Webcasts

EVENTS

SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...