NEWS ANALYSIS & FEATURES


Technavio: Top two emerging trends impacting the global MEMS microphone market through 2020

01/22/2016  According to the report, the global MEMS microphone market is expected to reach close to USD 2 billion by 2020, posting a CAGR of over 12%.

Gartner says worldwide IT spending is forecast to grow 0.6% in 2016

01/22/2016  Worldwide IT spending is forecast to total $3.54 trillion dollars in 2016, just a 0.6 percent increase over 2015 spending of $3.52 trillion dollars, according to Gartner, Inc.

Cornell-led team creates gallium nitride power diode

01/22/2016  Making tiny switches do enormous jobs in a more efficient way than current technology allows is one of the goals of a research team led by Cornell engineering professor Huili (Grace) Xing.

Fujifilm to build a new plant for advanced semiconductor materials in Taiwan

01/22/2016  Fujifilm Corporation recently announced that its semiconductor business subsidiary, FUJIFILM Electronic Materials Co.,Ltd. will build a new plant for manufacturing advanced semiconductor materials in the city of Tainan, to expand its production in Taiwan.

ON Semiconductor extends tender offer to acquire Fairchild Semiconductor

01/22/2016  ON Semiconductor Corporation announced that it has extended its previously announced tender offer to purchase all of the outstanding shares of common stock of Fairchild Semiconductor International Inc. for $ 20.00 per share in cash the Offer pending the satisfaction of the conditions to the Offer set forth in the merger agreement entered into on November 18, 2015 between ON Semiconductor and Fairchild.

2016 Critical Materials Council (CMC) Seminar – Call for Papers

01/21/2016  The Critical Materials Council (CMC) and TECHCET have issued a call for papers to be presented at the “Critical Materials for Device Driven Scaling” Seminar to be held May 5-6, 2016 in Hillsboro, Oregon, USA.

Microsemi launches PIN diode switch element

01/21/2016  Microsemi Corporation today announced a new high power monolithic microwave surface mount (MMSM) series-shunt SP2T PIN diode reflective switch.

Cypress supports wafer sales on leading F-RAM and nvSRAM Portfolio

01/21/2016  Cypress Semiconductor Corp., today announced the addition of wafer products to its industry-leading nonvolatile random access memory (NVRAM) portfolio.

Molecular-like photochemistry from semiconductor nanocrystals

01/21/2016  Researchers from North Carolina State University have demonstrated the transfer of triplet exciton energy from semiconductor nanocrystals to surface-bound molecular acceptors, extending the lifetime of the originally prepared excited state by six orders of magnitude.

New process enables easier isolation of carbon nanotubes

01/20/2016  A newly developed method has opened up new possibilities in carbon nanotube development.

Switchable material could enable new memory chips

01/20/2016  Two MIT researchers have developed a thin-film material whose phase and electrical properties can be switched between metallic and semiconducting simply by applying a small voltage.

Semiconductor veteran Tom Werthan to lead finance operations as Chief Financial Officer of Phononic

01/20/2016  Tom Werthan, a veteran semiconductor and finance executive experienced in leading financial operations at public and privately-held technology companies, has been appointed Chief Financial Officer at Phononic.

Worldwide device shipments to grow 1.9% in 2016, while end-user spending to decline for the first time

01/20/2016  Worldwide combined shipments of devices (PCs, tablets, ultramobiles and mobile phones) are expected to reach 2.4 billion units in 2016 , a 1.9 percent increase from 2015, according to Gartner, Inc.

Vesper collaborates with GLOBALFOUNDRIES to deliver first piezoelectric MEMS microphones

01/20/2016  Acoustic sensing company works with top foundry to support mass-market consumer products.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

01/20/2016  ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Gartner analysts reveal unexpected implications arising from the Internet of Things

01/19/2016  More than half of major new business processes and systems will incorporate some element of the Internet of Things (IoT) by 2020, according to Gartner, Inc.

Graphene oxide 'paper' changes with strain

01/19/2016  The same slip-and-stick mechanism that leads to earthquakes is at work on the molecular level in nanoscale materials, where it determines the shear plasticity of the materials, according to scientists at Rice University and the State University of Campinas, Brazil.

Physicists develop a cooling system for the processors of the future

01/19/2016  Researchers from MIPT have found a solution to the problem of overheating of active plasmonic components.

Bismuth-based nanoribbons show 'topological' transport, potential for new technologies

01/19/2016  Researchers have created nanoribbons of an emerging class of materials called topological insulators and used a magnetic field to control their semiconductor properties, a step toward harnessing the technology to study exotic physics and building new spintronic devices or quantum computers.



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QuantumClean: Process Improvement Through Consistently Cleaner Parts

QuantumClean is the global leader in high-purity outsourced process tool parts cleaning, performance coatings, refurbishment and analytical & engineering services to the semiconductor, solar and LED industries. QuantumClean operates on the frontier of the sub-20nm high-purity semiconductor parts cleaning market through leading-edge technologies, resources and expertise.
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Latest Article

Etching: A crucial step in semiconductor manufacturing

07/08/2015  Plasma etching is a key step in wafer fabrication, from deposition to the patterning of photolithography to dry or wet etch. As such, it is a crucial and hotly-contested area for vendors of semiconductor manufacturing equipment.

Deposition equipment market witnesses a year of significant changes

07/08/2015  There are four main segments in the thin-layer deposition equipment market – atomic layer deposition, chemical vapor deposition, epitaxy, and physical vapor deposition, also known as sputtering.

The latest in CMP tech will be on offer at SEMICON West

07/08/2015  Chemical mechanical planarization (CMP) technology has been around for a long time. In addition to the semiconductor industry, CMP has applications in data storage, polishing the rigid disks and magnetic heads of hard-disk drives.

EV Group ramps nanoimprint lithography into high-volume manufacturing with HERCULES NIL Track System

07/07/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES NIL—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's SmartNIL large-area nanoimprint lithography (NIL) process in a single platform.

EMC2015 - New Devices, Old Tricks

06/30/2015  The 57th annual Electronic Materials Conference, held June 24-26 in Columbus, Ohio, showcased research and development (R&D) of new device structures, as well as new insights into the process-structure-properties relationships of electronic devices now running in high-volume manufacturing (HVM) lines globally.

Solid State Watch: June 19-25, 2015

06/26/2015  IHS says Moore’s Law led to trillions added in global economy; Cadence and Applied Materials collaborate on CMP process optimization; Power transistors seen stabilizing and setting record sales in 2015; Nanowires could be the LEDs of the future

Breaking Down Power Management Verification

06/22/2015  During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.

3DIC Technology Drivers and Roadmaps

06/22/2015  Circuit performance and silicon area improvements seen in new die stacks.

Tackling Parameter Extraction for 16nm and Below

06/08/2015  There are four reasons why parasitic parameter extraction is getting a lot harder for 16nm and below technology nodes: 1) 3D device geometries, such as the finFET, which result in more complex electrical fields around the device 2) multi-patterning, which causes increased variability; 3) a demand for 10X tighter levels of accuracy, and 4) increased levels of secrecy from foundries and designers.

Intel CEO looks to 3D tech at display conference

06/02/2015  Intel CEO Brian Krzanich touted the capabilities of his company’s RealSense technology in a keynote address at the Society for Information Display conference in San Jose, California.

Silicon Technology Extensions shown at MRS Spring 2015

06/01/2015  New ultra-fast crystallization using lasers or plasma-jets.

Digital Specialty Chemicals receives investment from Intel Capital

05/26/2015  Digital Specialty Chemicals Limited (DSC), a dual bottom line corporation and leading provider of advanced materials to the semiconductor, pharmaceutical, and specialty chemical markets, announced that it has received an equity investment from Intel Capital, Intel Corporation’s global investment organization.

Danaher to buy Pall in $13.8B deal

05/14/2015  Danaher Corporation announced that it will acquire Pall Corporation for $13.8 billion. Once the transaction is completed, the merged company plans to split into two publicly traded corporations.

Solid State Watch: May 1-8, 2015

05/12/2015  First quarter semiconductor sales up 6% compared to last year; New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead; Microchip and GlobalFoundries announce new 55nm embedded NVM; ASE and TDK announce plans for joint venture agreement

Solid State Watch: April 24-30, 2015

05/04/2015  Applied Materials and Tokyo Electron terminate merger; Sensor competition, actuator recovery impact supplier ranking; Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications; Silicon Motion announces agreement to acquire Shannon Systems

It’s blue skies for Jabil and its customers

05/01/2015  While making printed circuit boards is still a big business for the St. Petersburg, Fla.-based Jabil, which boasts 90 plants in 24 countries around the world, the Blue Sky Center emphasizes that Jabil has progressed from being a board manufacturer to a full-service supply chain management firm.

Safe CMP slurries for future IC materials

04/29/2015  New CMP processes for new materials planned to be used in building future IC devices are now in R&D. Early data on process trade-offs as well as on EHS aspects were presented at the CMP Users Group meeting.

ITRS 2.0: Top-Down System Integration

04/22/2015  ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

Applied Materials announces new photomask etch system

04/20/2015  Applied Materials today announced the Applied Centura Tetra Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple patterning scaling to the 10nm node and beyond.

SOI: Revolutionizing RF and expanding in to new frontiers

04/17/2015  SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.





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Metrology and Inspection Challenges and Opportunities

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SEMICON China 2016
Shanghai, China
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March 15, 2016 - March 17, 2016
SID Display Week 2016
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