NEWS ANALYSIS & FEATURES


Global semiconductor sales increase 21% year-to-year in April

06/07/2017  Double-digit annual growth projected for 2017.

Imec demonstrates breakthrough in CMOS-compatible ferroelectric memory

06/07/2017  Imec has proved the validity of ferroelectric memory as a promising technology at various points in the memory hierarchy, and as a new technology for storage class memory -- today, it demonstrated the world's first a vertically stacked ferroelectric Al doped HfO2 device for NAND applications.

SIA welcomes DARPA initiative to advance transformative semiconductor technologies

06/06/2017  New program aims to progress beyond traditional scaling, catalyze next-generation semiconductor technologies.

SEMI reports record quarterly billings of $13.1B

06/06/2017  The quarter ended very strong, with March billings reaching $5.6 billion, an all-time monthly record.

AMOLED TV panel shipments to top 10 million units by 2023

06/06/2017  As panel makers are increasingly targeting the premium TV market, active-matrix organic light-emitting diode TV panel shipments are expected to exceed 10 million units by 2023, growing at a compound annual growth rate (CAGR) of 42 percent from 2017.

New diode features optically controlled capacitance

06/06/2017  Israeli researchers have developed a new optically tunable capacitor with embedded metal nanoparticles, creating a metal-insulator-semiconductor diode that is tunable by illumination.

Air Products invests in six industrial gas plants to support electronics manufacturing industry in China

06/05/2017  Air Products announced it has recently received multiple, long-term supply awards from semiconductor and flat panel display manufacturers in China as the country's electronics manufacturing industry continues to boom.

Mentor OSAT Alliance program streamlines IC high-density advanced packaging design and manufacturing

06/05/2017  Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs.

Engineer unveils new spin on future of transistors with novel design

06/05/2017  All-carbon, spintronic proposal could lead to smaller, better performing structures in electronics.

Seeing the invisible with a graphene-CMOS integrated device

06/05/2017  Flagship researchers integrate graphene and quantum dots with CMOS technology to create an array of photodetectors, producing a high resolution image sensor.

Model for 2-D materials based RRAM found

06/02/2017  The group lead by Prof. Mario Lanza develops a resistive random access memory device using only 2-D materials (graphene electrodes and hexagonal boron nitride insulators), and develop a complete theoretical model to describe its functioning.

Queen's researcher's 'miracle material' discovery could end cracked smart devices

06/02/2017  A Queen's University researcher has led an international team of scientists to the discovery of a new material, which could finally bring an end to the misery of cracked smartphone and tablet screens.

New method of characterizing graphene

06/01/2017  Scientists have developed a new method of characterizing graphene's properties without applying disruptive electrical contacts, allowing them to investigate both the resistance and quantum capacitance of graphene and other two-dimensional materials. Researchers from the Swiss Nanoscience Institute and the University of Basel's Department of Physics reported their findings in the journal Physical Review Applied.

"Billion Dollar Capex Club" forecast to swell to 15 companies in 2017

06/01/2017  Top spenders expected to represent 83% of total semiconductor industry spending this year.

EV Group expands production capacity at corporate headquarters in Austria

05/31/2017  EV Group (EVG) announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria.

Imec and Cascade Microtech develop first automatic probe system for advanced 3D chips

05/31/2017  Imec and Cascade announced the successful development of a fully-automatic system for pre-bond testing of advanced 3D chips.

OEM Group expands P5000 capabilities to compound semiconductor substrates

05/25/2017  OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market.

SEMICON West preview: MEMS

05/23/2017  Autonomous automobiles, smart manufacturing, smart buildings, mobile human health monitoring, and 4G+ communications hardware for connecting all these devices will drive strong 24 percent growth in units and 14 percent in value for the MEMS sector.

IEEE International Electron Devices Meeting announces 2017 Call for Papers

05/23/2017  The 63rd annual IEEE International Electron Devices Meeting (IEDM), to be held at the Hilton San Francisco Union Square hotel December 2-6, 2017, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

North American semiconductor equipment industry posts April 2017 billings

05/23/2017  North America-based manufacturers of semiconductor equipment posted $2.17 billion in billings worldwide in April 2017 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.



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CVD Source Materials

12/17/2015  Reaction materials for chemical vapor deposition are typically delivered into the chamber in a gaseous form. The source materials can be gases or liquids.





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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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WEBCASTS

Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

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Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

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MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

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EVENTS

Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

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