NEWS ANALYSIS & FEATURES


Rice U. discovery may boost memory technology

08/11/2015  Scientists at Rice University have created a solid-state memory technology that allows for high-density storage with a minimum incidence of computer errors.

CMR induced in pure lanthanum manganite

08/11/2015  Colossal magnetoresistance is a property with practical applications in a wide array of electronic tools including magnetic sensors and magnetic RAM. New research successfully used high-pressure conditions to induce colossal magnetoresistance for the first time in a pure sample of a compound called lanthanum manganite, LaMnO3.

Challenges for MEMS, sensors, and semiconductors

08/11/2015  Leading industry experts participated in the joint SEMI-MEMS Industry Group (MIG) workshop during SEMICON West 2015 to discuss industry challenges – and potential solutions and collaborative approaches – in the MEMS, sensors and semiconductor industries.

MagnaChip to host first Foundry Technology Symposium in Shanghai, China

08/10/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today it is hosting its first Foundry Technology Symposium at the Grand Hyatt in Shanghai, China, on September 22, 2015.

Toshiba launches 16MP CMOS image sensors targeting smartphones and tablets

08/10/2015  Designed for use in smartphones and tablets, the backside-illuminated (BSI) chips are among the world's smallest class of CMOS image sensors, and achieve both high-performance image capture and low power consumption.

ON Semiconductor appoints Alan Campbell to Board of Directors

08/07/2015  ON Semiconductor Corporation today announced that Alan Campbell has joined its Board of Directors.

Flexible dielectric polymer can stand the heat

08/07/2015  Easily manufactured, low cost, lightweight, flexible dielectric polymers that can operate at high temperatures may be the solution to energy storage and power conversion in electric vehicles and other high temperature applications, according to a team of Penn State engineers.

Qualcomm to acquire Ikanos

08/06/2015  Qualcomm Incorporated subsidiary, Qualcomm Atheros, Inc., today announced it entered into a definitive merger agreement to acquire Ikanos Communications, Inc., a high performance broadband networking semiconductor and software provider enabling both central office and home gateway solutions.

Apple drives growth in high-resolution smartphone displays

08/06/2015  While overall smartphone market growth continues to slow, global demand for low temperature polysilicon thin-film-transistor liquid-crystal displays (LTPS TFT LCD) for smartphones is on the rise.

SEMI Taiwan PV Committee elects new vice chairs

08/05/2015  SEMI Taiwan PV Committee announced the newly-elected vice chairs: Cafer Huang, general manager at Giga Solar Materials Corp., and Swean Lin, president at Green Energy Technology Inc.

SunEdison Semiconductor announces manufacturing consolidation

08/05/2015  The consolidation will consist of closing its Ipoh, Malaysia wafering plant by the end of 2016, and relocating the associated capacity to other plant sites. The company does not expect its total capacity to change.

STATS ChipPAC appoints co-president and CEO

08/05/2015  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today the promotion and appointment of Dr. Han Byung Joon as Co-President and Chief Executive Officer for the Company, together with Mr. Tan Lay Koon.

Intel to collaborate with Georgia Tech

08/05/2015  Intel Corporation announced it will invest $5 million over the next five years to deepen its engineering pipeline partnership with the Georgia Institute of Technology and deploy research-driven solutions to inspire and retain women and underrepresented minorities to start and complete computer science and engineering degrees.

Toshiba develops world’s first 256Gb, 48-layer BiCS FLASH

08/04/2015  Toshiba America Electronic Components, Inc. (TAEC) today unveiled the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory.

A*STAR's IME Consortium announces development of innovative advanced packaging solutions

08/04/2015  Following the launch of the 12th Electronics Packaging Research Consortium (EPRC12) in 2013, A*STAR’s Institute of Microelectronics (IME) and 11 of its consortium partners across the semiconductor supply chain have developed novel solutions in integrated circuit (IC) packaging.

MEMS Industry Group Conference Asia explores MEMS and sensors opportunities in global IoT

08/04/2015  MEMS Industry Group (MIG) will gather the world’s leading providers of micro-electromechanical systems (MEMS) and sensors technology for its second annual MEMS Industry Group Conference Asia in Shanghai, China on September 8-11, 2015.

Microchip Technology completes acquisition of Micrel

08/04/2015  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has completed its previously announced acquisition of Micrel.

ON Semiconductor introduces new ICs for next generation auto designs

08/03/2015  ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.

OMRON to acquire motion control company, Delta Tau Data Systems, Inc.

08/03/2015  OMRON Corporation announced its entry into a stock purchase agreement to acquire a 100 percent stake in Delta Tau Data Systems, Inc. of California (DT), which will result in DT becoming a member of the OMRON Group.

Lock-in Thermography for Advanced Assembly Qualification

08/03/2015 

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.





VIDEOS

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WEBCASTS

Advanced Packaging

September 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

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Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

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More Webcasts

EVENTS

European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
http://www.semiconjapan.org/en/
December 16, 2015 - December 18, 2015

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