NEWS ANALYSIS & FEATURES


Cavendish Kinetics secures funding to accelerate the growth of the RF MEMS market

11/11/2014  Cavendish Kinetics, the provider of high-performance RF MEMS tuning solutions for mobile and wearable devices, today announced the closing of a $7 million funding round as well as the appointment of Gilles Delfassy to its board of directors.

Qualcomm joins SRC’s Trustworthy and Secure Semiconductors and Systems Initiative

11/11/2014  Semiconductor Research Corporation (SRC) today announced that Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, has joined SRC’s Trustworthy and Secure Semiconductors and Systems (T3S) program.

$1,000,000 "Challenge Grant" goal achieved for SEMI high tech industry workforce development

11/11/2014  With generous “Morgan Challenge Matchmaker” contributions, the SEMI Foundation recently reached its goal of $1 million for workforce development.

On-demand conductivity for graphene nanoribbons

11/10/2014  New research may help to develop graphene-based electronic devices that only become conductors when an external ultra-short pulse is applied, and are otherwise insulators.

Sand 9 granted core patent for piezoelectric MEMS microphones

11/10/2014  Sand 9, Inc., a developer of piezoelectric MEMS timing products for wireless and wired applications, today announced that the United States Patent and Trademark Office has granted the company a core patent based on the use of piezoelectric MEMS for a wafer-level, chip-scale packaged microphone.

Internet of Things: Resolution of key challenges enables mass implementation in the future

11/10/2014  The influx of wireless technologies and intelligent devices has resulted in the rapid evolution of the Internet of Things (IoT), a disruptive cross industry force expected to transform the manufacturing value chain into a state of hyper-connectivity.

Soraa solves compatibility issues by launching new constant current LED lamp

11/10/2014  Soraa announced today that it has introduced a perfectly compatible version of its award-winning MR16 LED lamp.

Applied Materials develops advanced patterning solution for memory devices

11/10/2014  Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

Graphene Frontiers secures patent for commercial-scale material production

11/07/2014  Graphene Frontiers LLC, a developer of graphene materials and device technology, announces the issuance of a key industry patent.

SEMATECH names Ronald Goldblatt permanent CEO

11/07/2014  SEMATECH, the global consortium of semiconductor manufacturers, today announced that Dr. Ronald Goldblatt has been named President and Chief Executive Officer by the company’s Board of Directors, effective immediately. Dr. Goldblatt has served as acting President and Chief Executive Officer since April 2014.

ORNL thermomagnetic processing method provides path to new materials

11/06/2014  For much the same reason LCD televisions offer eye-popping performance, a thermomagnetic processing method developed at the Department of Energy’s Oak Ridge National Laboratory can advance the performance of polymers.

MEMS Industry Group announces first open-source Algorithm Community

11/06/2014  MEMS Executive Congress -- Karen Lightman, executive director of MEMS Industry Group (MIG), today announced the first open-source algorithm cooperative, Accelerated Innovation Community (AIC), during her opening remarks at MEMS Executive Congress US 2014.

Focus on technology challenges at SEMICON Japan 2014

11/06/2014  Presentations by Accenture Japan, Scripps, Toyota and ARM, were announced today for SEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology.

GLOBALFOUNDRIES and INVECAS introduce new dedicated design service partner for leading-edge technologies

11/06/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing, design and technology solutions, today announced a partnership with INVECAS Inc.

TI to open 300mm wafer bumping facility in Chengdu, China

11/06/2014  Chengdu assembly/test facility now in production; site celebrates grand opening

Clearing a path for electrons in polymers: Closing in on the speed limits

11/05/2014  Researchers from the University of Cambridge have identified a class of low-cost, easily-processed semiconducting polymers which, despite their seemingly disorganised internal structure, can transport electrons as efficiently as expensive crystalline inorganic semiconductors.

Crocus MLU sensors aim to put more 'flex' into flexible displays

11/05/2014  Crocus Technology, a provider of magnetically enhanced semiconductor technologies and products, today announces a new Magnetic Logic Unit (MLU) based solution that can detect the position and shape of flexible two dimensional surfaces.

Tetsuro Higashi to receive the SEMI Sales and Marketing Excellence Award

11/05/2014  SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

Trans-Lux introduces TL Vision court side LED displays

11/05/2014  Trans-Lux Corporation has released a new series of modular court side LED displays under its premier TL Vision brand.

Reno Sub-Systems closes first venture round with Intel Capital, Innovacorp and other investors

11/05/2014  Reno Sub-Systems (Reno) today announced that it has closed its first venture funding round with Intel Capital, early stage Canadian venture capital organization Innovacorp and other investors.



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

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WEBCASTS

Extending Moore's Law

January 2014 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2014 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

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FinFETs

February 2014 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

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More Webcasts

EVENTS

2014 IEEE International Electron Device Meeting
San Francisco, CA
http://www.his.com/~iedm/
December 15, 2014 - December 17, 2014
International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015

FINANCIALS

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