NEWS ANALYSIS & FEATURES


SEMICON Taiwan 2014 to capitalize on growing market opportunities in Taiwan

08/06/2014  Taiwan is forecast to have the largest regional semiconductor manufacturing equipment and materials capital expenditures in both 2014 and 2015.

Pfeiffer Vacuum joins the Facilities 450mm Consortium

08/06/2014  The Facilities 450mm Consortium (F450C), a partnership of leading nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced it has again increased in size, naming Pfeiffer Vacuum as the twelfth member company to join the consortium.

Apple saved the sapphire industry in 2013 and could transform it in 2014

08/05/2014  In 2013, Apple completely saved the sapphire industry. This year, in 2014, Apple could transform this industry. Will the revolution happen?

Taking great ideas from the lab to the fab

08/05/2014  NSF and Intel support the development of domain-specific hardware to address health care needs.

National Science Foundation tests out the assembly line of the future

08/05/2014  NSF's Center for Hierarchical Manufacturing proves good test bed for large-scale nanomanufacturing designs .

Sensors, semiconductors, autonomous driving and regulation to drive ADAS revolution

08/05/2014  In its recent market research report, ABI Research forecasts automotive camera sensor shipments to reach 197 million by 2020.

New material allows for ultra-thin solar cells

08/04/2014  Extremely thin, semi-transparent, flexible solar cells could soon become reality.

Atomic Layer Etch now in Fab Evaluations

08/04/2014  Lam’s CTO talks about the future of etch in beta-site tests.

Micron Technology appoints Stephen Pawlowski as Vice President of Advanced Computing Solutions

08/04/2014  Micron Technology, Inc. today announced that Stephen Pawlowski has been named as vice president of Advanced Computing Solutions.

Cavium to acquire switching and SDN specialist Xpliant

08/04/2014  Cavium, Inc., a provider of semiconductor products, announced an agreement to acquire Xpliant, Inc., a privately held company headquartered in San Jose, California.

Smart cities to rise fourfold in number from 2013 to 2025

07/31/2014  The number of smart cities worldwide will quadruple within a 12-year period that started last year, proliferating as local governments work with the private sector to cope with a multitude of challenges confronting urban centers.

Materials matter — Enabling the future of IC fabrication and packaging

07/31/2014  The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

Cambridge Nanotherm appoints Ralph Weir as CEO

07/31/2014  Cambridge Nanotherm, a producer of semiconductor heatsink technology, today announced that it has appointed semiconductor industry veteran Ralph Weir as its CEO.

Silicon Image appoints new Chief Financial Officer

07/30/2014  Silicon Image, a provider of multimedia connectivity solutions and services, today announced the appointment of Raymond Cook as Chief Financial Officer effective July 28, 2014.

TriQuint becomes first manufacturer to achieve MRL 9 for GaN

07/30/2014  TriQuint Semiconductor, Inc., a RF solutions supplier and technology innovator, announced that it is the first gallium nitride (GaN) RF chip manufacturer to achieve Manufacturing Readiness Level (MRL) 9.

A call to provide advanced equipment to growth companies

07/28/2014  Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Harnessing big data

07/28/2014  Addressing the analytics challenges in supply chain management.

Superfast stress inspection for overlay control

07/28/2014  Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

Sustainability through Materials Recovery

07/16/2014  Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site options are reviewed for helium, argon, sulfuric acid and Xenon.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Metrology

August 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014

FINANCIALS

NEW COMMENTS


TriQuint becomes first manufacturer to achieve MRL 9 for GaN
World record solar cell with 44.7% efficiency
ON Semiconductor completes acquisition of Aptina Imaging

NEW PRODUCTS

Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....