NEWS ANALYSIS & FEATURES


KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isn’t slowing down. But its steady acceleration isn’t happening spontaneously, and Tuesday’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.

The Connected Experience: A Manufacturer’s Dream?

07/09/2014  Imagine being able to not only track and address equipment degradation in real time, but also analyze patterns in your factories’ equipment and address potential issues before they even present a problem. It may sound too good to be true, but Microsoft’s Sanjay Ravi explained in Wednesday morning’s keynote that this innovation is becoming available now to manufacturers.

Trends in Next-Generation MEMS Discussed in TechXPOT Forum

07/09/2014  The microelectromechanical system (MEMS) device market is forecast to increase at a compound annual growth rate of 13 percent over the next five years, reaching $24 billion in 2019, according to Jean-Christophe Eloy, president and CEO of Yole Développement.

The End of Scaling?

07/09/2014  Are we reaching the end of scaling? Yes and no. Let me explain.

New Materials Provide Innovation Yet Add Complexity

07/09/2014  If semiconductor materials had a personal Facebook page, its status would be: It’s Complicated.

Standards Industry Leaders Honored at SEMICON West 2014

07/09/2014  SEMI honored eight industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries. The annual SEMI Standards awards were announced at the SEMI Standards reception held during SEMICON West 2014.

The Future Looks Incredible, But Not If We Stay The Same

07/09/2014  Micron President Mark Adams’ keynote on Tuesday morning at SEMICON West 2014 was both optimistic and challenging, perhaps even unsettling for companies unused to evolving with the times.

FinFETs and FDSOI Provide Options

07/08/2014  Everybody loves FinFETs! Well, not everybody, really, is behind double-gate or multiple-gate field-effect transistors.

EUV: Coming but Not Here Yet

07/08/2014  Extreme-ultraviolet lithography is making progress! Well, check that. EUV technology is progressing, yet it remains uncertain when its insertion into volume production of semiconductors will occur.

3DICs Have Finally Arrived

07/08/2014  Intel, Samsung Electronics, and Taiwan Semiconductor Manufacturing have made their moves into three-dimensional semiconductors. Now it remains to be seen how the rest of the semiconductor industry will make the transition to 3DICs.

First 450mm Wafers Patterned with Immersion Lithography Displayed

07/08/2014  A collection of the first fully patterned 450mm wafers are on display at SEMICON West this week at the newly merged SUNY CNSE/SUNYIT exhibit, booth 517, located in the Moscone Center’s South Hall. The wafers will be on display throughout the exhibition and showcased in the 450 mm Technology Development Session on Thursday July 10th.

SEMATECH and CNSE/SUNYIT launch CMP Center

07/08/2014  The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

Lam Research expands its portfolio for atomic-scale processing

07/08/2014  Lam Research Corp., a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced the addition of atomic layer etch (ALE) to its portfolio of atomic layer deposition (ALD) products.

Boston Semi Equipment expands sales and service organization

07/08/2014  Boston Semi Equipment LLC (BSE) today announced it has completed the integration of the sales and service teams of MVTS and Aetrium into the BSE distribution channel.

SEMI and Solid State Technology announce the 2014 “Best of West” Award finalists

07/08/2014  Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

James C. Morgan announces $1,000,000 “Challenge Grant” for high tech industry workforce development

07/08/2014  James C. Morgan, chairman emeritus, Applied Materials, Inc., today announced his commitment to match up to $500,000 in donations to the SEMI Foundation.

Sunny prospects await photovoltaics in 2014

07/08/2014  The long night in solar energy may be coming to an end.



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Wet Processing

July 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
More Webcasts

EVENTS

SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014

FINANCIALS

NEW COMMENTS


Top 10 LED manufacturers in 2011, and shifting regional dominance
Gopal Rao at The ConFab: Scaling isn’t enough anymore
Paradigm shift in semi equipment - Confirmed

NEW PRODUCTS

Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....