NEWS ANALYSIS & FEATURES


NXP awarded Excellence in Quality for 2017 by Cisco

10/06/2017  This prestigious award recognizes NXP for Excellence in Quality for displaying the highest quality standards, practices, and methodologies in their products and processes, and differentiating through their quality management systems and alignment to Cisco’s strategies and values.

Nordson launches Corporate Responsibility and Sustainability Report

10/06/2017  The report enhances transparency in the environmental, social and governance (ESG) areas determined to be most material to the company and its stakeholders.

Columbia engineers invent breakthrough millimeter-wave circulator IC

10/06/2017  Researchers are first to demonstrate a circulator on a silicon chip at mm-wave frequencies that enables nonreciprocal transmission of waves: device could enable two-way radios and transform 5g networks, self-driving cars, and virtual reality.

Tungsten offers nano-interconnects a path of least resistance

10/05/2017  Crystalline tungsten shows insight and promise in addressing the challenges of electrical interconnects that have high resistivity at the nanoscale.

MEMS & sensors companies compete for tech showcase "crown"

10/05/2017  MSIG announces five finalists for Technology Showcase at MEMS & Sensors Executive Congress, November 1-2, in Napa Valley, Calif.

Industry first precision p-channel zero threshold MOSFET array enables sub-threshold circuits for ultra-low power applications

10/04/2017  The MOSFET currently has the industry’s lowest operating voltage of 0.2 Volt (V) and current of less than one nano amp (nA).

Monthly semiconductor sales reach $35B globally for first time in August

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.

Flexible display shipments will increase to 643M units annually by 2022

10/04/2017  In 2017, key flexible display components achieved cost and performance parity with their rigid counterparts for the first time, thus removing a key market barrier and opening the door to rapid adoption in a variety of otherwise-rigid devices such as e-readers and wearables.

Team builds flexible new platform for high-performance electronics

10/04/2017  A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

A sea of spinning electrons

10/03/2017  Rutgers-led discovery could spawn a wave of new electronic devices.

Unprecedented opportunities in automotive electronics

10/03/2017  Workshop will highlight rapid advancements in automotive electronics technologies and applications, and explore technical and business barriers and opportunities that are best addressed collectively across the supply chain.

SEMICON Japan 2017 keynotes announced

10/03/2017  Today, SEMI announced the lineup of keynotes coming to SEMICON Japan's "SuperTHEATER" -- focusing on the future of the electronics manufacturing supply chain.

Comet Group to open Silicon Valley office

10/03/2017  COMET Group today announced the opening of Lab One, its customer-centric technology and application center in San Jose, CA.

Robotics and chip industries in Japan

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

New 3D packaging & integration committee

10/02/2017  The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.

Pressure between layers of stacked graphene oxide nanosheets increases with heat

10/02/2017  Graphene is a sheet of carbon one atom thick, and it has drawn worldwide attention as a new material. A Japanese research group discovered that pressure is generated by simply stacking graphene oxide nanosheets. They also found that the pressure can be increased by reducing the interlayer distance through heat treatment. It is an innovative approach for applying high pressure without using an enormous amount of energy.

Extra sulphur improves electronic structure of quantum dots

10/02/2017  Quantum dots are nanometre-sized semiconductor particles with potential applications in solar cells and electronics. Scientists from the University of Groningen and their colleagues from ETH Zürich have now discovered how to increase the efficiency of charge conductivity in lead-sulphur quantum dots.

3D NAND: Trends in Processes, Circuits, and Systems

10/01/2017  October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

GLOBALFOUNDRIES delivers custom 14nm FinFET technology for IBM Systems

09/29/2017  Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI.

Semiconductor Industry Association announces support of corporate tax reform framework

09/29/2017  The Semiconductor Industry Association (SIA) released the following statement today from SIA president & CEO John Neuffer in support of the corporate tax reform framework released today by leaders in the Trump Administration and Congress.



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

WEBCASTS

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

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