NEWS ANALYSIS & FEATURES


SkyWater significantly expands pure-play technology foundry customer base

11/16/2017  SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation.

Marvell Semiconductor president and CEO Matt Murphy elected chair of SIA

11/16/2017  The Semiconductor Industry Association today announced the SIA Board of Directors has elected Matt Murphy, president and CEO of Marvell Semiconductor, Inc., as its 2018 Chair and Sanjay Mehrotra, president and CEO of Micron Technology, Inc., as its 2018 Vice Chair.

Flexible AMOLED panel supply capacity to exceed demand by 44% in 2018

11/16/2017  With flexible active-matrix organic light-emitting diode (AMOLED) panel fabs building at a quicker pace than global demand, supply capacity of flexible AMOLED panels is forecast to be 44 percent higher than global demand in 2018, according to IHS Markit.

The stacked color sensor

11/16/2017  True colors meet minimization.

Japan issues landmark diamond semiconductor patent to AKHAN

11/15/2017  AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronics-grade diamond, announced today the issuance by the Japan Patent Office of a patent covering a method for the fabrication of diamond semiconductor materials.

Electronics industry conference to debut in Kuala Lumpur

11/15/2017  SEMICON Southeast Asia 2018 to bolster growing semiconductor industry in the region.

Seoul Semiconductor introduces an Acrich-based compact LED lriver with 5X the power density of conventional drivers

11/15/2017  Seoul Semiconductor has developed an ultra-compact LED driver series with a power density 5X higher than conventional LED drivers.

Gigaphoton announces new roadmap for DUV light source

11/14/2017  Gigaphoton Inc., a manufacturer of light sources used in semiconductor lithography, announced its intention to draw up a new roadmap with the aim of improving the availability of the equipment, and also to respond to the needs of the semiconductor chip manufacturers who are being confronted with increasingly high demands.

SUNY Poly, IBM celebrates 20th anniversary of copper interconnects during Albany nanotechnology symposium

11/14/2017  SUNY Polytechnic Institute (SUNY Poly) is hosting the 11th IEEE Nanotechnology Symposium at its world-class Albany NanoTech Complex on Wednesday, November 15, from 9 a.m. to 5:30 p.m.

Leti announces FED4SAE project to accelerate European cyber-physical system solutions to market

11/14/2017  Leti, a research institute of CEA Tech and coordinator of the pan-European consortium FED4SAE, today announced that the 14 project partners have launched a three-year European Commission program to facilitate the acceleration of European cyber-physical-system (CPS) solutions to market.

First SEMICON Europa opens this year in co-location with productronica

11/14/2017  Semiconductor industry back on track for growth in Europe -- major new investments.

GLOBALFOUNDRIES, Fudan team to deliver next generation dual interface smart card

11/14/2017  GF's 55LPx platform with embedded non-volatile memory and integrated RF enables Fudan to create China's most advanced CPU bank card.

Ben-Gurion University researchers achieve breakthrough in camouflaging an optical chip rendering it invisible

11/14/2017  Ben-Gurion University of the Negev (BGU) researchers have achieved a breakthrough in manipulating light to render an object, such as an optical chip, invisible.

Magnetic sensor industry is moving into a consolidation phase

11/13/2017  With 7% CAGR between 2016 and 2022, the magnetic sensor market should reach almost US$ 2.5 billion in 2022.

Improving sensor accuracy to prevent electrical grid overload

11/13/2017  Engineers take note -- new current sensors need fine-tuning to accurately inform monitors of the electrical grid about incoming surges.

SunLike series LEDs from Seoul Semiconductor deliver natural spectrum human-centric lighting sources

11/13/2017  Seoul Semiconductor exhibited its new SunLike Series LEDs, the world's first LED to produce light that closely matches the spectrum of natural sunlight, at the recent Professional Lighting Design Conference.

Micron advances persistent memory with 32GB NVDIMM

11/13/2017  Micron Technology, Inc., today announced a new 32GB NVDIMM-N offering twice the capacity of existing NVDIMMs, providing system designers and original equipment manufacturers with new flexibility to work with larger data sets in fast persistent memory.

Leti demonstrates world's first 300mm wafer-to-wafer direct hybrid bonding with 1-micron pitch

11/13/2017  New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications.

U.S. semiconductor chemical suppliers lost market share over past decade

11/10/2017  U.S. semiconductor chemical suppliers lost market share to Japanese and European competitors in every major segment over the past decade, according to a new report from The Information Network.

An interview with Bosch Sensortec CEO: IoT, environmental sensing and value chain

11/10/2017  SEMI interviewed one of the four keynotes presenting on November 14 during the Opening Ceremony, Dr. Stefan Finkbeiner, CEO of Bosch Sensortec, about topics about developments and trends in IoT, Environmental Sensing, and Value Chain as well as the role of Europe.



VIDEOS

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Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
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Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
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EVENTS

ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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