NEWS ANALYSIS & FEATURES


Measuring the temperature of two-dimensional materials at the atomic level

02/05/2018  Researchers at the University of Illinois at Chicago describe a new technique for precisely measuring the temperature and behavior of new two-dimensional materials that will allow engineers to design smaller and faster microprocessors.

IHS Markit identifies top trends driving the Internet of Things in 2018 and beyond

02/02/2018  Driven by the need for intelligent connected devices in industrial and commercial applications, the number of connected Internet of Things (IoT) devices globally will grow to more than 31 billion in 2018, according to new analysis from business information provider IHS Markit

Nordson MARCH MesoSPHERE Plasma Systems enable very high throughput processing for 3D and wafer-level package assembly

02/02/2018  Nordson MARCH, a Nordson company introduces the MesoSPHERE Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level – handling wafers up to 450mm and panels up to 480mm.

Air Products to supply Samsung Electronics' second 3D V-NAND fab in western China

02/02/2018  Air Products today announced it has been awarded the industrial gases supply for Samsung Electronics' second semiconductor fab in Xi'an, Shaanxi Province, western China.

New, safe zinc oxide quantum dots

02/02/2018  Zinc oxide as a heavy metals-free substituent for commonly investigated cadium-based semiconductors is one of the most versatile systems with far-reaching perspectives. Physicochemical properties and biocompatibility of ZnO nanocrystals are strongly dependent on their interface, which is largely determined by synthetic procedures. Chemists from Warsaw have shown that ZnO nanoparticles produced by a new self-supporting organometallic method are safe for human cells. Now it's only one step towards innovative applications.

UA researchers observe electrons zipping around in crystals

02/02/2018  Scientists have tracked electrons moving through exotic materials that may make up the next generation of computing hardware.

New UC Riverside research advances spintronics technology

02/01/2018  Discoveries will help realize the promise of faster, energy-efficient spintronic computers and ultra-high-capacity data storage.

Mobile system-on-chip designs, embedded processing lift MPU market

02/01/2018  Though accounting for less than half of total MPU sales, data-handling cellphones, tablets, and MPUs for embedded processing applications to keep MPU market active through 2022.

Engineers design artificial synapse for "brain-on-a-chip" hardware

02/01/2018  Design is major stepping stone toward portable artificial-intelligence devices.

MicroLED displays: the patent landscape reflects the dynamism of the sector

01/31/2018  This year again, the Las Vegas Consumer Electronics Show, 2018 edition allowed us to discover the latest innovations in numerous fields including the microLED displays sector.

A crystal method

01/31/2018  UCSB researchers unlock another piece of the puzzle that is crystal growth.

Boston Semi Equipment develops custom automation modules for strip handling equipment

01/31/2018  Boston Semi Equipment (BSE) today announced that it has started shipping units of its new strip load/unload module to a top 10 semiconductor manufacturer.

ST technologies help Neonode add touch interaction to any object, surface, or space

01/31/2018  Silicon chips from STMicroelectronics have enabled new zForce AIR touch-sensing modules from Neonode, the optical sensor technology company.

Largest SEMICON Korea ever highlights smart manufacturing, automotive

01/31/2018  SEMICON Korea 2018 opens at COEX in Seoul today with its largest-ever exhibition and an expected 50,000 attendees at the premier event for the Korean semiconductor and electronics manufacturing supply chain.

Seoul Semiconductor achieves $1.04B record annual revenues for fiscal year 2017

01/30/2018  The 16% rise in consolidated revenues far exceeds the industry average, which grew 2% during the same period.

Custom Silicon veteran joins SiFive executive team

01/30/2018  SiFive, a provider of commercial RISC-V processor IP, today announced Shafy Eltoukhy as vice president of operations. Eltoukhy, a veteran of Microsemi and Intel, will lead SiFive's DesignShare activities and ensure the smooth rollout of new Core IP, SoCs and services.

Kateeva appoints Marc Haugen as Chief Operating Officer

01/30/2018  Kateeva, a developer of inkjet deposition equipment solutions for OLED display manufacturing, today announced that the company has expanded its executive team by appointing Marc Haugen as chief operating officer (COO).

Alpha and Omega Semiconductor announces the newest generation of XSPairFET

01/30/2018  Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package which is ideal for synchronous buck converters.

Leti develops lens-free, point-of-care system for diagnosing spinal meningitis

01/30/2018  Leti, a research institute at CEA Tech, has invented a lens-free microscope technology that provides point-of-care diagnosis for spinal meningitis. Outlined in a paper presented at Photonics West, the new technology provides immediate results and eliminates errors in counting white blood cells (leukocytes) in cerebrospinal fluid, which is required to diagnose the infection.

Mike Noonen joins efabless' Advisory Board

01/30/2018  efabless corporation, the world's first crowd sourcing platform for electronics solutions, today announced Mike Noonen joined its advisory board.



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Facilities

01/06/2016  Semiconductor manufacturing facilities or wafer “fabs” are huge affairs costing billions of dollars.





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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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WEBCASTS

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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EVENTS

IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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