NEWS ANALYSIS & FEATURES


North American semiconductor equipment industry posts May 2016 book-to-bill ratio of 1.09

06/17/2016  North America-based manufacturers of semiconductor equipment posted $1.75 billion in orders worldwide in May 2016 (three-month average basis) and a book-to-bill ratio of 1.09.

What is driving the advanced packaging market in China?

06/16/2016  Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015.

Imec demonstrates gate-all-around MOSFETs with lateral silicon nanowires at scaled dimensions

06/16/2016  Today, at the 2016 Symposia on VLSI Technology & Circuits, nano-electronics research center imec presented gate-all-around (GAA) n- and p-MOSFET devices made of vertically stacked horizontal silicon (Si) nanowires (NWs) with a diameter of only 8nm.

Ultratech enables world's lowest contact resistivity for finFETs with LXA melt laser annealing technology

06/16/2016  This record achievement, as well as additional results, was presented in a paper at the 2016 Symposia on VLSI Technology and Circuits held June 13-17, at the Hilton Hawaiian Village in Honolulu, Hawaii.

ams acquires CCMOSS

06/16/2016  ams, a manufacturer of high performance sensor and analog solutions, has signed an agreement to acquire 100% of the shares in Cambridge CMOS Sensors Ltd (CCMOSS), a developer of micro hotplate structures for gas sensing and infrared applications, in an all-cash transaction.

FEI launches three new tools for next-generation semiconductor manufacturing

06/16/2016  FEI announced today the release of three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing.

Electronic nose using CMOS integrated circuits analyzes breath

06/16/2016  Researchers at the Texas Analog Center of Excellence(TxACE), a Semiconductor Research Corporation(SRC)-funded research effort centered at the University of Texas at Dallas (UT Dallas), are working to develop an affordable electronic nose that can be used in breath analysis for a wide range of health diagnosis.

Imec demonstrates junction-less gate-all-around lateral and vertical nanowire FET devices

06/16/2016  The new GAA-NWFET is a promising candidate for advanced logic & analog/RF applications, and scaled SRAM cells.

WPG Americas Inc. announces distribution agreement with Seoul Semiconductor

06/15/2016  WPG Americas Inc. announced today it has signed a new agreement with Seoul Semiconductor the world's fifth largest LED supplier to distribute their full complete line of products.

Samsung Electro-Mechanics to launch IC packaging business

06/15/2016  Samsung Electro-Mechanics, an electronic parts affiliate of Samsung Group, is preparing to dive into the integrated circuit packaging industry, according to news reports on Monday.

CWRU physicists deploy magnetic vortex to control electron spin

06/15/2016  Researchers at Case Western Reserve University have developed a way to swiftly and precisely control electron spins at room temperature.

Leti Innovation Day in Lyon will explore new security challenges and responses for a safe connected world

06/15/2016  Leti, an institute of CEA Tech, is hosting a one-day conference covering "System Reliability & Security in a Connected World" in Lyon, France, on June 23.

Semiconductor Industry Association applauds passage of chemicals legislation

06/14/2016  The Semiconductor Industry Association (SIA) commended congressional approval of the Frank R. Lautenberg Chemical Safety for the 21st Century Act.

Gartner says worldwide smartphone sales to slow in 2016

06/14/2016  Gartner, Inc. said global smartphone sales will continue to slow and will no longer grow in double digits.

Wide color gamut displays to comprise 17% of display shipment area in 2018

06/14/2016  Shipment area of wide color gamut (WCG) displays is expected to reach 32 million square meters in 2018, which represents 17 percent of total display shipment area.

Novel capping strategy improves stability of perovskite nanocrystals

06/14/2016  Study addresses instability issues with organometal-halide perovskites, a promising class of materials for solar cells, LEDs, and other applications.

Advanced Packaging Forum provides answers at SEMICON West 2016

06/14/2016  Today, SEMI announced that the latest packaging solutions will be the topic of an in-depth session at the SEMICON West 2016 Advanced Packaging Forum - and on display on the exhibition floor.

Efficient hydrogen production made easy

06/13/2016  Sticking electrons to a semiconductor with hydrazine creates an electrocatalyst.

Changing markets drive smarter manufacturing by IC sector

06/13/2016  The changing market for ICs means the end of business as usual for the greater semiconductor supply chain. Smarter use of data analytics looks like a key strategy to get new products more quickly into high yield production at improved margins.

New nanomaterial offers promise in bendable, wearable electronic devices

06/13/2016  Electroplated polymer makes transparent, highly conductive, ultra thin film.



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Materials

12/11/2015  Beyond the wafers themselves, the semiconductor industry employs thousands of different kinds of materials.





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RECOMMENDED TECHNOLOGY PAPERS

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
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Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
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Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

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Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

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EVENTS

SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

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