NEWS ANALYSIS & FEATURES


Kateeva: Enabling OLED success

07/13/2016  Kateeva is out to change the way displays are being made, and during Tuesday’s Silicon Innovation Forum keynote, Kateeva President and COO Conor Madigan, PhD, laid out how their YIELDJet inkjet system is making that happen.

Global Neon Demand Expected to Exceed Increasing Supply

07/13/2016  Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.

Nitrous oxide no laughing matter

07/13/2016  N2O, or Nitrous Oxide, also known as laughing gas, is a weak anesthetic gas that has been in use since the late 18th century.

SEMICON West Day 2: Don't Miss

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

Better networking with open EtherCAT

07/12/2016  Semiconductor manufacturers and their suppliers – both process tool vendors and providers of sub-fab systems – are looking to an open-source industrial networking methodology, EtherCAT, developed by Beckhoff Automation to address the increasingly stringent control requirements of emerging high-precision processes.

Test Protocols for the IoT

07/12/2016  The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.

A new age of smart manufacturing underway

07/12/2016  A major theme at SEMICON West 2016 is Smart Manufacturing, a.k.a. Industry 4.0 and Industrial IoT (IIoT).

SEMI announces results of board elections and leadership appointments

07/12/2016  SEMI today announced that Jon D. Kemp, president of DuPont Electronics & Communications, and Tadahiro Suhara, president of SCREEN Semiconductor Solutions Co., Ltd., were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

Collaboration in MEMS, sensors and ICs

07/12/2016  MEMS & Sensors Industry Group (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at SEMICON West on July 13, 2016.

Leti develops 3D network-on-chip to improve high-performance computing

07/12/2016  Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.​

Chip equipment spending: SEMI forecasts flat 2016, rebound in 2017

07/12/2016  SEMI projects that the worldwide semiconductor equipment market will be flat this year and will rebound in 2017 according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

Imec and Synopsys collaborate on interconnect resistivity model

07/11/2016  Synopsys' Process Explorer and Raphael accurately simulate parasitic resistance of alternative metals and liner-barrier materials at the 7nm node and beyond.

Rudolph Technologies announces new Clearfind technology for advanced packaging inspection

07/11/2016  Clearfind technology sees organic defects that often escape detection with conventional white-light inspection technologies.

AppliedMicro adopting TSMC 7nm finFET process technology

07/11/2016  AppliedMicro's innovative silicon products enabled by TSMC's advanced technology.

EV Group rolls out automated metrology system for advanced packaging, MEMS manufacturing

07/11/2016  EV Group (EVG) today introduced the EVG50 automated metrology system.

Applied Materials' next-generation e-beam inspection system provides industry's highest resolution

07/11/2016  Applied Materials, Inc. today announced its next-generation e-beam inspection system is delivering the highest resolution and image quality at the fastest throughput to leading foundry, logic, DRAM and 3D NAND customers as they move to advanced nodes.

3D-Micromac releases new laser micromachining solution to volume semiconductor wafer and power device processing

07/08/2016  3D-Micromac AG announced that its microDICE laser micromachining system has been adopted by a major industrial manufacturer for volume production of high-power diodes.

TECHCET 2016 forecast: $1.39B in photoresists, $680M in extensions

07/08/2016  Photoresist manufacturers had reason to smile as fiscal 2015 closed, with sales growing nicely to $1.37B, a 6.2% increase over 2014.

Imec announces the opening of imec Florida

07/08/2016  Imec, a nanoelectronics research center, today announced the opening of imec Florida, a new entity focusing on photonics and high-speed electronics IC design based in Osceola, Florida.

IC Insights lowers 2016 semiconductor market forecast to -1%

07/08/2016  Weak global economy and poor DRAM market to drag down growth this year.



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QuantumClean: Process Improvement Through Consistently Cleaner Parts

QuantumClean is the global leader in high-purity outsourced process tool parts cleaning, performance coatings, refurbishment and analytical & engineering services to the semiconductor, solar and LED industries. QuantumClean operates on the frontier of the sub-20nm high-purity semiconductor parts cleaning market through leading-edge technologies, resources and expertise.
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Latest Article

Packaging Materials

12/11/2015  According to a newly released report from SEMI and TechSearch International, the $18 billion semiconductor packaging materials market will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC leadframes, underfill, and copper wire.





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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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WEBCASTS

Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Flawless Execution at Fairchild: How Change to Modern MES Enables Agility, Quality and Productivity

August 9, 2016 at 1 PM ET / Sponsored by Epicor and Siemens

In this high-pressure environment, leading semiconductor companies are swapping out older manufacturing executions systems (MES) for modern MES. Surprised? True, the perceived risk of changing out MES in a semiconductor facility is high. Yet companies have done it with great success and enormous business benefits. Fairchild Semiconductor’s positive experiences as it strives for quality, on-time delivery, new product introduction success, improved productivity and quality are indicative. In just one year, Fairchild switched out aging systems for a new MES at a plant in China – and the following month, they got it up at a second plant. Learn what they did to ensure the change happened quickly and without a hitch. In addition to this case study, you’ll hear from a leading industry analyst who has interviewed dozens of people from semiconductor companies that have succeeded with the move to modern MES.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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EVENTS

SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

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