Leti demos MEMS fabrication on its 300mm line, pointing the way to lower manufacturing costs

09/17/2015  CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.

GE creates GE Digital

09/17/2015  GE announced the creation of GE Digital, a move that brings together all of the digital capabilities from across the company into one organization.

Researchers developed highly accurate method for measuring luminous efficacy of LEDs

09/17/2015  Researchers at Aalto University and VTT Technical Research Centre of Finland have developed a method which helps to improve the relative uncertainty in measuring the luminous efficacy of LEDs from approximately 5 percent of today to 1 percent in the future.

FlexEnable Atmel launches self/mutual capacitance automotive-qualified touchscreen controllers for up to 10" touchscreens

09/17/2015  Atmel Corporation today announced the company has expanded its portfolio of automotive-qualified maXTouch (R) touchscreen controllers with the mXT641T family.

Professors from UT Austin and Carnegie Mellon honored for excellence in semiconductor technology and design research

09/16/2015  The Semiconductor Industry Association, in consultation with Semiconductor Research Corporation, today presented its University Research Award to professors from the University of Texas at Austin and Carnegie Mellon University in recognition of their outstanding contributions to semiconductor research.

Radiant introduces the ProMetric (R) I29 ultra high-resolution imaging colorimeter

09/16/2015  Radiant Vision Systems announced the release of the ProMetric (R) I29, an ultra high-resolution imaging colorimeter developed for high-volume display and consumer electronics manufacturers.

2015 International Conference on Planarization/CMP Technology (ICPT 2015)

09/16/2015  September 30 - October 2, 2015, Wild Horse Pass Hotel & Casino, Chandler, AZ, USA. ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies.

Rising Flexible Display Technology Patents Herald Future Market Growth

09/15/2015  With a recent sharp rise in the number of patent applications for flexible display technologies, the market for various types of flexible displays is expected to broaden.

SEMI Reports Second Quarter 2015 Worldwide Semiconductor Equipment Figures

09/15/2015  SEMI reported that worldwide semiconductor manufacturing equipment billings reached US$9.4 billion in the second quarter of 2015.

System Scaling and Integration Platforms for Mobile Devices and IoT


September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

OEM Group Announces New Cintillio-S (TM) Automated Batch Wet Chemical Processing System

09/14/2015  Global semiconductor capital equipment manufacturer OEM Group announced today that it has launched its new Cintillio-S (TM) automated batch wet chemical processing system.

IBM Launches Internet of Things and Education Business Units

09/14/2015  IBM announced two new business units that will apply the company's considerable knowledge in Big Data, advanced analytics and cognitive computing to the Internet of Things (IOT) and Educations markets.

Qualcomm Acquires Capsule Technologie

09/14/2015  Qualcomm Incorporated today announced that its subsidiary, Qualcomm Life, Inc., has acquired Capsule Technologie.

Realizing carbon nanotube integrated circuits

09/09/2015  Encapsulation layers keep carbon nanotube transistors stable in open air.

ClassOne Technology names Kevin Witt Chief Technology Officer

09/09/2015  Semiconductor equipment manufacturer ClassOne Technology has today announced the appointment of Kevin Witt to the position of Chief Technology Officer.

Intersil acquires Great Wall Semiconductor

09/09/2015  Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the acquisition of Great Wall Semiconductor.

Semiconductor Research Corporation expands benchmarking research program

09/09/2015  Marking an industry first for emerging electronics devices, Semiconductor Research Corporation (SRC) today announced a significant expansion of its benchmarking research.

Patent analysis: GaN power devices

09/08/2015  The GaN devices market for power electronics application will explode in 2016, reaching US$300 million in 2020.

ASE Chairman Jason Chang receives SEMI award for advancements of copper wire bonding technology

09/08/2015  The SEMI award recognizes Jason’s significant achievements in the development and commercialization of copper wire in the IC assembly process.

MACOM announces milestone in the commercialization of GaN on Silicon technology

09/08/2015  M/A-COM Technology Solutions Inc., a supplier of high-performance analog, RF, microwave, millimeterwave and photonic semiconductor products, announced that it has shipped more than one million GaN-on-Silicon (GaN on Si) RF power devices to date to customers for use in communications, military and other RF applications.



Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers



September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:


September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Trends in Flexible and Printed Electronics

October 2015 (Date and time TBD)

Printed electronics are at a pivotal moment. There are not only tremendous opportunities for innovation and growth in new verticals and industries, but a new way of thinking about how electronics are made, combining techniques and materials used by printed electronics with those of 3D printing. Presenters will review printed electronics and discuss future directions, from smart labels and wearables, to trends and technologies that enable the printing of IoT devices with embedded sensors, transistors, displays, batteries and memory.

Sponsored By:

More Webcasts


International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015


Greenpeak and Dusan Launch Smart Parking system
09/14/2015GreenPeak Technologies and Dusun Electron Ltd recently announced a partnership with the launch of their first Smart City assisted parking application tha...
Greenpeak and Dusan Launch Smart Parking system
09/14/2015GreenPeak Technologies and Dusun Electron Ltd recently announced a partnership with the launch of their first Smart City assisted parking application tha...
Entegris expands CMP filtration technology solutions and research, analytical and manufacturing capabilities
09/04/2015The Entegris filter platform using NMB media now includes the Planargard bulk, Solaris point...