NEWS ANALYSIS & FEATURES


Engineers create chameleon-like artificial 'skin' that shifts color on demand

03/12/2015  Borrowing a trick from nature, engineers from the University of California at Berkeley have created an incredibly thin, chameleon-like material that can be made to change color -- on demand -- by simply applying a minute amount of force.

Marktech Optoelectronics adds miniature Point Source LED packages to product lineup

03/11/2015  Marktech Optoelectronics Corp. announces the addition of a PLCC-4 and miniature ceramic package to the 650nm and 850nm Point Source LED series.

Mid-IR frequency combs enable high resolution spectroscopy for sensitive gas sensing

03/10/2015  The results are an important step towards a small-footprint chip scale mid-infrared frequency comb source.

Applied Materials honored as a 2015 World's Most Ethical Company

03/10/2015  Applied Materials, Inc. today announced it has been recognized as a 2015 World's Most Ethical Company by the Ethisphere Institute.

CEA-Leti announces launch of Silicon Impulse IC design competence center

03/10/2015  CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

Squeezing out new science from material interfaces

03/09/2015  With more than five times the thermal conductivity of copper, diamond is the ultimate heat spreader. But the slow rate of heat flow into diamond from other materials limits its use in practice.

SPIE 2015 Awards honor achievements in light-based technologies

03/09/2015  The awards recognize outstanding technical accomplishments and meritorious service to the society.

Dr. Zixue Zhou appointed as Chairman of SMIC

03/09/2015  Semiconductor Manufacturing International Corporation ("SMIC"), the largest pure-play foundry provider in China, has appointed Dr. Zixue Zhou as the new chairman and executive director of SMIC. Dr. Zhou's position as chairman will become effective as of today.

Increasing demand for larger TVs leads to growing large-area TFT LCD shipment revenue

03/06/2015  Large-area TFT LCD display panel suppliers enjoyed moderate growth in shipments, revenue and display area in 2014 as the market demand for key applications grew.

Stronger competition forecast for mobile phone display manufacturers this year

03/06/2015  Global mobile phone display module shipments in 2015 are expected to rise just 4 percent year-over-year to reach two billion units, leading to even stronger competition among mobile phone display manufacturers.

Samsung, LGE and Sony to account for nearly half of all TV display panels shipping in 2015

03/06/2015  Leading global TV brands, Samsung Electronics, LG Electronics and Sony, gained market share and increased their year-over-year shares of LCD TV shipments by an average of 11 percent in 2014, which is higher than the market average.

Graphene meets heat waves

03/06/2015  In the race to miniaturize electronic components, researchers are challenged with a major problem: the smaller or the faster your device, the more challenging it is to cool it down.

Boston Semi Equipment completes relocation of headquarters and Aetrium test handler business

03/05/2015  The new facility houses corporate functions as well as the Aetrium test handler business acquired in 2014 and relocated from Minnesota to Massachusetts.

IRT Nanoelec and CMP team up to offer world’s first service for post-process 3D technologies on multi-project-wafer

03/05/2015  IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW).

MicroWatt Chips shown at ISSCC

03/05/2015  With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just concluded 2015 International Solid State Circuits Conference (ISSCC) in San Francisco to be on ultra-low-power circuits that run on mere microWatts (µW).

UT Dallas technology could make night vision, thermal imaging affordable

03/04/2015  Semiconductors made in CMOS technology reach nearly 10 terahertz.

Mentor Graphics joins the Center for Power Electronics Systems

03/04/2015  Mentor Graphics Corporation today announced that it has joined the Center for Power Electronics Systems (CPES) at Virginia Tech, the industry consortium dedicated to improving electrical power processing and distribution across various systems.

Intel honors 21 companies with Preferred Quality Supplier and Achievement Awards

03/04/2015  Intel Corporation today announced that 19 companies will receive the 2014 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement.

Time to “shift left” in chip design and verification, Synopsys founder says

03/04/2015  Taking “Smart Design from Silicon to Software” as his official theme, Aart de Geus urged attendees to “shift left” – in other words, “squeezing the schedule” to design, verify, debug, and manufacture semiconductors.

TowerJazz begins mass production of advanced IR sensor

03/03/2015  TowerJazz, a specialty foundry, announced today it has begun mass production of an IR sensor used by Intel in one of its new 3D sensing solutions.





Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS

3D Integration

April 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

EVENTS

SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015

NEW PRODUCTS

Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...