NEWS ANALYSIS & FEATURES


SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

Analog Devices completes acquisition of Linear Technology

03/10/2017  Analog Devices, Inc. today announced the completion of its acquisition of Linear Technology Corporation.

Sandia National Laboratories creates 3-D metasurfaces with optical possibilities

03/10/2017  The new Sandia metamaterials can be fabricated in multiple layers to form complex, three-dimensional meta-atoms that reflect more light than shiny gold surfaces, usually considered the ultimate in infrared reflectivity. The III-V materials also emit photons when excited -- something that silicon, which can reflect, transmit and absorb -- can't do.

Penn engineers' 'photonic doping' makes class of metamaterials easier to fabricate

03/10/2017  Now, University of Pennsylvania engineers have shown a way to make metamaterials with a single inclusion, providing easier fabrication, among other useful features.

Applied Materials names Thomas J. Iannotti chairman of the Board of Directors

03/10/2017  Applied Materials, Inc. today announced Thomas J. Iannotti as chairman of the Board of Directors effective immediately. Mr. Iannotti succeeds Willem P. Roelandts, who has retired from the board.

Soitec begins ramping up production of 200mm SOI wafers in China at SOI manufacturing partner's fab

03/09/2017  Soitec has announced that the ramp up to high-volume production of 200mm silicon-on-insulator (SOI) wafers has begun at the manufacturing facility of its Chinese partner Shanghai Simgui Technology Co., Ltd.

Synopsys advances virtual prototyping to enable system and semiconductor supply chain collaboration for next-gen SoCs

03/09/2017  Synopsys, Inc. today announced the availability of a key technology in virtual prototyping which enables architecture performance requirements to be easily shared through the supply chain.

NXP launches single-chip SoC with integrated microcontroller

03/09/2017  NXP Semiconductors today announced the world's smallest single-chip SoC solution -- the MC9S08SUx microcontroller (MCU) family -- with an integrated 18V-to-5V LDO and MOSFET pre-driver that delivers ultra-high-voltage solution for drones, robots, power tools, DC fan, healthcare and other low-end brushless DC electric motor control (BLDC) applications.

Imec, Holst Centre present a digital receiver excelling in energy efficiency and small size for Bluetooth 5

03/09/2017  Imec and Holst Centre (initiated by imec and TNO) have developed a novel phase-tracking receiver bringing further power and cost reduction for the next generations of Bluetooth and IEEE802.15.4 radio chips.

New material helps record data with light

03/09/2017  Russian physicists, with their colleagues from Europe through changing the light parameters, learned to generate quasiparticles - excitons, which were fully controllable and also helped to record information at room temperature.

Kateeva expands Silicon Valley headquarters

03/08/2017  The company has leased an adjacent building at its Newark campus, adding 75,000 sq. ft. that is zoned for manufacturing and business operations.

Polymer-coated silicon nanosheets as an alternative to graphene

03/08/2017  Researchers at the Technical University of Munich (TUM) have, for the first time ever, produced a composite material combining silicon nanosheets and a polymer that is both UV-resistant and easy to process.

EVG breaks speed and accuracy barrier in mask alignment lithography for semiconductor packaging

03/08/2017  New IQ Aligner NT achieves double throughput and alignment accuracy over previous-generation platform; opens up new applications for EVG lithography solutions.

Eutelsat, ST announce low-cost, low-power System-on-Chip for interactive satellite terminals

03/08/2017  ST and Eutelsat complete development of chip for Eutelsat's next-generation SmartLNB.

Leti announces backside shield that protects microchips from physical attacks

03/08/2017  Leti, a research institute of CEA Tech, today announced it has developed a shield that can help protect electronic devices against physical attacks from the chips’ backside.

ClassOne signs Scientech as rep for China, Taiwan and SE Asia

03/08/2017  ClassOne Technology, manufacturer of wet processing equipment for 200mm and smaller wafers, announced that Scientech Corporation of Taipei, Taiwan, will become the company’s new representative for China, Taiwan and Southeast Asia, starting immediately.

Skyworks Solutions, Inc., Western Digital Corporation join Semiconductor Industry Association

03/07/2017  The Semiconductor Industry Association (SIA) today announced the addition of two leading U.S. semiconductor companies, Skyworks Solutions, Inc. and Western Digital Corporation, as SIA members.

Reducing conducting thin film surface roughness for electronics

03/07/2017  In a significant advance, particularly within the microelectronics realm, University of Massachusetts Amherst engineers have established electrical surface treatment of conducting thin films as a physical processing method to reduce surface roughness.

Imec’s 200mm GaN-on-Si e-mode power devices withstand heavy ion and neutron irradiation

03/07/2017  Radiation hardness of e-mode devices confirm maturity of imec’s 200mm GaN-on-Si platform.

Mentor Graphics Launches Unique Xpedition PCB Systems Vibration and Acceleration Simulation Solution

03/06/2017  Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.



RESOURCE GUIDE - Get Listed


Latest Article

Cryogenic Vacuum Pumps

12/16/2015  The cryopump provides fast, clean pumping of all gases in the mid- to high-vacuum range.





Categories


Featured Supplier


Master Bond: www.masterbond.com



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS

Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

EVENTS

CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

NEW PRODUCTS

ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...
Edwards launches new Smart Thermal Management System at SEMICON Europa 2016
10/25/2016Smart TMS helps semiconductor, flat panel display and solar manufacturers improve their process performance and safety by red...