NEWS ANALYSIS & FEATURES


SEMI Standards leaders honored at SEMICON West 2015

07/15/2015  SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries.

Low-Cost Manufacturing of Flexible Functionalities

07/15/2015  FlexTech Alliance updates on substrates, processes, and devices.

New materials require new approaches

07/15/2015  Continued advances in the semiconductor will increasingly be enabled by materials technology, versus the scaling that has been commonplace over the last 50 years as defined by Moore’s Law.

Managing hazardous process exhaust in high volume manufacturing

07/15/2015  “Let no element on the periodic table go un-used!” That may well be the rallying cry of the semiconductor industry moving forward.

Gases: Completely Necessary to Semiconductor Manufacturing

07/15/2015  Silicon wafers. Semiconductor packaging. These are commonly known products in materials for manufacturing and assembling microchips. Process gases? Not as familiar a commodity, yet they are just as critical to semiconductor manufacturing.

TÜV Rheinland showcases services & abilities for semi industry focus is on OSHA and EMC testing certification

07/15/2015  TÜV Rheinland, a full-service testing, inspection and certification company, exhibiting at the annual SEMICON West expo, announced the expansion of services to include Environmental, Health & Safety testing and certification of Group III-V compounds in semiconductor manufacturing environments.

A new sensor from Golden Valley-based CyberOptics will advance digital gadgets

07/15/2015  CyberOptics’ latest product ultimately will make digital gadgets better, cheaper.

Save costs by conserving energy in the sub-fab

07/15/2015  Opportunities for cost savings abound in the “sub-fab” of semiconductor operations where the vacuum pumps and gas abatement systems reside.

Leti and EVG launch INSPIRE

07/15/2015  CEA-Leti and EV Group launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the nano-patterning technology and spread its use for applications beyond semiconductors.

SEMICON West Day 2: Don't Miss

07/14/2015  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

SEMI press conference highlights market forecast, economic conditions

07/14/2015  When Gordon Moore of Fairchild Semiconductor published his famous article on chip scaling and costs in 1965, gasoline in the U.S. was 31 cents per gallon, the Dow Jones Industrial Average was under 1,000, and a house could be purchased for $13,000 or so, noted Denny McGuirk, president and CEO of SEMI, at Tuesday morning’s press conference opening the SEMICON West 2015 conference and exhibition.

Rudolph Technologies and DISCO Corporation partner to improve wafer saw process

07/14/2015  Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy.

Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials

07/14/2015  Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects.

CoorsTek Increases its Business with Covalent Acquisition, Organic Growth

07/14/2015  CoorsTek made one of the biggest acquisitions of its century-long history late last year in purchasing Covalent Materials, formerly known as Toshiba Ceramics.

Mark Durcan, Micron CEO, recognized for outstanding EHS leadership

07/14/2015  Durcan accepted his award for leadership at the Global Care Environmental, Health, and Safety (EHS) Lunch today at SEMICON West 2015 in San Francisco, Calif.

Technologies for Advanced Systems Shown at IMEC Tech Forum USA

07/14/2015  R&D summarized of the nanoscale building blocks for our fab future.

SEMI announces results of board elections and leadership appointments

07/14/2015  SEMI today announced that Stephen S. Schwartz, CEO of Brooks Automation, and Toshikazu Umatate, senior vice president and general manager of the Semiconductor Lithography Business at Nikon Corporation, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

Fan-out wafer level packaging set to expand

07/14/2015  The expansion of fan-out is finally coming, says Rich Rogoff, Vice President and General Manager, Lithography Systems Group at Rudolph Technologies.

Buying used equipment? Be careful; know your seller

07/14/2015  The used and refurbished semiconductor equipment market can be a hazardous business for buyers. The watchword always is: Caveat emptor – let the buyer beware.

Is silicon’s heyday over? New materials challenge the industry workhorse

07/14/2015  The short answer to that headline’s question is “no.” Longer term, in going beyond the 5-nanometer process node, silicon may finally reach the end of its usefulness to the semiconductor industry.





VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS

The Path to Future Interconnects

August 6, 2015 at 1:00 p.m. ET

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
Advanced Packaging

August 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
More Webcasts

EVENTS

SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015

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