Applications

APPLICATIONS ARTICLES



MagnaChip and ELAN Microelectronics announce partnership

07/17/2017  MagnaChip Semiconductor Corporation announced today it was selected as a foundry partner by ELAN Microelectronics to manufacture the world's first fingerprint sensor IC-based smartcard.

Breathable, wearable electronics on skin for long-term health monitoring

07/17/2017  A hypoallergenic electronic sensor can be worn on the skin continuously for a week without discomfort, and is so light and thin that users forget they even have it on, says a Japanese group of scientists.

Hamburg researchers develop new transistor concept

07/17/2017  Transistors, as used in billions on every computer chip, are nowadays based on semiconductor-type materials, usually silicon. As the demands for computer chips in laptops, tablets and smartphones continue to rise, new possibilities are being sought out to fabricate them inexpensively, energy-saving and flexibly.

Researchers develop a novel type of optical fiber that preserves the properties of light

07/17/2017  Scientists from the Moscow Institute of Physics and Technology (MIPT) and the Kotelnikov Institute of Radio Engineering and Electronics (IRE) of the Russian Academy of Sciences (RAS), in collaboration with their colleagues from Finland, have developed a new type of optical fiber that has an extremely large core diameter and preserves the coherent properties of light.

Digital revolution: The path to innovation is opened by disruption

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.

AI and collaboration key to future success

07/12/2017  Keynote speakers Terry Higashi of Tokyo Electron Ltd. and Tom Caulfield of GlobalFoundries took the stage at the Yerba Buena Theater Tuesday morning to predict major changes in the goals and operations of the semiconductor industry.

Exploring smart sensor explosive growth

07/11/2017  MEMS & Sensors Industry Group (MSIG), the industry association advancing MEMS and sensors across global markets, is hosting a TechXPOT program today, titled “What’s Next for MEMS & Sensors: Big Growth of Disruptive Applications for Smart Sensing Changes the Business.”

Presto Engineering announces management expansion

06/29/2017  Presto Engineering, Inc., an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announces a management expansion: Cedric Mayor has been named Chief Operating Officer (COO) and Martin Kingdon has been appointed VP Sales.

Nonstop CMOS image sensor sales records seen through 2021

06/28/2017  Embedded imaging applications in cars, security, machine vision, medical, virtual reality, wearable systems, and other new uses will offset slow growth in camera phones, says O-S-D Report.

It’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

ULVAC Technologies opens California office

06/20/2017  ULVAC Technologies, Inc., a supplier of production systems, instrumentation and vacuum pumps for technology industries, has opened an office in Santa Clara, California.

Exploring smart sensor explosive growth at SEMICON West 2017

06/20/2017  MEMS & Sensors Industry Group announces programs and speakers for SEMICON West 2017 (July 11-13).

What TechInsights analysts are watching in 2017

06/19/2017  TechInsights analysts share their view on where technology is going, how it’s changing, and what new developments are emerging.

To connect biology with electronics, be rigid, yet flexible

06/19/2017  Researchers uncover design principles to make polymers that can transport both ions and electrons.

The automotive electronics market: A view from a material supplier

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

7 of the top 10 smartphone suppliers headquartered in China

06/15/2017  China accounted for 10 of top 14 leading smartphone suppliers in 2016, share grows to 39%.

Breakthrough by Queen's University paves way for smaller electronic devices

06/14/2017  Queen's University Belfast researchers have discovered a new way to create extremely thin electrically conducting sheets, which could revolutionise the tiny electronic devices that control everything from smart phones to banking and medical technology.

Lab on a chip could monitor health, germs and pollutants

06/13/2017  Rutgers researchers invent technology that could lead to wearable biosensors.

SUNY ranks among top 100 worldwide for patents granted in 2016

06/12/2017  The State University of New York ranked 38th in the “Top 100 Worldwide Universities Granted U.S. Utility Patents for 2016,” according to the National Academy of Inventors (NAI) and Intellectual Property Owners Association (IPO).

New computing system takes its cues from the human brain

06/12/2017  The new system employs a network of electronic oscillators to solve graph coloring tasks – a type of problem that tends to choke modern computers.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Wednesday, August 9, 2017 at 1 p.m. ET

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:
Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS