Applications

APPLICATIONS ARTICLES



A breakthrough in imaging gold nanoparticles to atomic resolution by electron microscopy

08/22/2014  Nanometer-scale gold particles are intensively investigated for application as catalysts, sensors, drug delivery devices, biological contrast agents and components in photonics and molecular electronics.

MIPT and RAS scientists made an important step towards creating medical nanorobots

08/19/2014  Researchers from the Institute of General Physics of the Russian Academy of Sciences, the Institute of Bioorganic Chemistry of the Russian Academy of Sciences and MIPT have made an important step towards creating medical nanorobots.

Himax Technologies and Lumus announce collaboration to develop next-generation smart glasses

08/19/2014  Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

08/15/2014  MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

Global pressure sensors market is expected to reach $9.36B in 2020

08/14/2014  The global pressure sensors market was valued at $6.53 billion USD in 2013, growing at a CAGR of 6.2% from 2014 to 2020 to account for $9.36 billion USD in 2020.

Eco-friendly "pre-fab nanoparticles" could revolutionize nano manufacturing

08/13/2014  A team of materials chemists, polymer scientists, device physicists and others at the University of Massachusetts Amherst today report a breakthrough technique for controlling molecular assembly of nanoparticles over multiple length scales that should allow faster, cheaper, more ecologically friendly manufacture of organic photovoltaics and other electronic devices.

NJR and UMC extend collaboration on MEMS microphone manufacturing

08/07/2014  New Japan Radio Co., Ltd. and United Microelectronics Corporation, a global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR's MEMS microphone products.

Sensors, semiconductors, autonomous driving and regulation to drive ADAS revolution

08/05/2014  In its recent market research report, ABI Research forecasts automotive camera sensor shipments to reach 197 million by 2020.

Smart cities to rise fourfold in number from 2013 to 2025

07/31/2014  The number of smart cities worldwide will quadruple within a 12-year period that started last year, proliferating as local governments work with the private sector to cope with a multitude of challenges confronting urban centers.

Wireless connectivity semiconductors maintain strong double-digit growth in health and fitness

07/31/2014  Semiconductors providing wireless connectivity in health and fitness devices are set for solid double-digit growth in 2014 and beyond, especially as a clutch of wireless technologies make their way into a growing number of wearable devices.

Silicon Image appoints new Chief Financial Officer

07/30/2014  Silicon Image, a provider of multimedia connectivity solutions and services, today announced the appointment of Raymond Cook as Chief Financial Officer effective July 28, 2014.

Imaging without limits: Phones lead growth but innovative applications expanding the market

07/18/2014  To address the rising demands of imaging systems in mobile, medical, automotive and other technology applications, the Imaging Without Limits Conference (7-8 October) will be introduced at SEMICON Europa 2014 this year to address this surging market.

IBM announces $3B research initiative

07/15/2014  IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

A nanosensor to identify vapors based on a Graphene/Silicon heterojunction Schottky diode

07/15/2014  Among other carbon-based nanomaterials, graphene represents a great promise for gas sensing applications.

Paradigm shift in semi equipment - Confirmed

07/15/2014  Technology node transitions slowing below 32nm.

Orbotech to acquire SPTS Technologies

07/07/2014  Orbotech Ltd. today announced the acquisition of SPTS Technologies Group Limited, a U.K.-based leading manufacturer of etch, deposition and thermal processing equipment for the microelectronics industry, from European private equity firm Bridgepoint and others.

Making dreams come true : Making graphene from plastic?

07/03/2014  Recently, a domestic research team developed a carbon material without artificial defects commonly found during the production process of graphene while maintaining its original characteristics.

Columbia researchers observe tunable quantum behavior in bilayer graphene

07/03/2014  Columbia researchers have observed the fractional quantum Hall effect in bilayer graphene and shown that this exotic state of matter can be tuned by an electric field.

IoT will transform transportation

07/03/2014  Cars that can get along without drivers are coming, down the road, but they are a small part of the changes that the global transportation industries will undertake as microelectronics and the Internet of Things prompt major changes in infrastructure and logistics, as well as all type of vehicles.

Smart, sustainable manufacturing: new sensors for process monitoring

07/03/2014  Industries ranging from chemicals to agri-food to bio-tech and pharmaceuticals are looking at new sensor technologies to streamline processes and improve quality control.




FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology

August 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014