Applications

APPLICATIONS ARTICLES



The iron stepping stones to better wearable tech without semiconductors

02/05/2016  The road to more versatile wearable technology is dotted with iron. Specifically, quantum dots of iron arranged on boron nitride nanotubes (BNNTs).

Researchers develop hack-proof RFID chips

02/04/2016  New technology could secure credit cards, key cards, and pallets of goods in warehouses.

Cautious expectations amid a slow-growth global economy

02/04/2016  The health of the IC industry is increasingly tied to the health of the worldwide economy. Rarely can there be strong IC market growth without at least a “good” worldwide economy to support it.

Gartner says worldwide wearable devices sales to grow 18.4 percent in 2016

02/03/2016  Gartner, Inc. forecasts that 274.6 million wearable electronic devices will be sold worldwide in 2016, an increase of 18.4 percent from 232.0 million units in 2015.

Apple products are driving market growth for MEMS microphones

02/03/2016  The popularity of Apple’s iPhone 6S and other products is boosting the microelectromechanical-systems (MEMS) microphones market to a compound annual growth rate (CAGR) of 11 percent from 2015 to 2019.

Self-calibrated 10 Mbit/s phase modulator exceeds state-of-the-art performance

02/03/2016  At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a self-calibrated high-speed (10Mbits/s) phase modulator achieving an excellent Error Vector Magnitude (EVM) of -37dB at 10.25 GHz.

Imec and Vrije Universiteit Brussel present small, low-cost, low-power chip for multi-gigabit 60GHz communication

02/03/2016  At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a four-antenna path beamforming transceiver for 60GHz multi Gb/s communication in 28nm CMOS technology.

Two in five wearable devices will be enabled for wireless charging by 2020

01/26/2016  The wearable technology market continues to rapidly expand, driving more than $40 billion in revenue by 2020.

Led by iPhone 6S, sensor hubs market is growing fast

01/25/2016  The demand for sensor hubs, dedicated processing elements used for low-power sensor processing tasks, is booming.

Fingerprint sensor market growth continues upward trajectory

01/25/2016  Led by Apple’s iPhone juggernaut, unit shipments of fingerprint sensors were expected to have grown from 316 million in 2014 to 499 million in 2015 and will continue to increase each year to peak at 1.6 billion in 2020

Technavio: Top two emerging trends impacting the global MEMS microphone market through 2020

01/22/2016  According to the report, the global MEMS microphone market is expected to reach close to USD 2 billion by 2020, posting a CAGR of over 12%.

Gartner says worldwide IT spending is forecast to grow 0.6% in 2016

01/22/2016  Worldwide IT spending is forecast to total $3.54 trillion dollars in 2016, just a 0.6 percent increase over 2015 spending of $3.52 trillion dollars, according to Gartner, Inc.

Worldwide device shipments to grow 1.9% in 2016, while end-user spending to decline for the first time

01/20/2016  Worldwide combined shipments of devices (PCs, tablets, ultramobiles and mobile phones) are expected to reach 2.4 billion units in 2016 , a 1.9 percent increase from 2015, according to Gartner, Inc.

Vesper collaborates with GLOBALFOUNDRIES to deliver first piezoelectric MEMS microphones

01/20/2016  Acoustic sensing company works with top foundry to support mass-market consumer products.

Gartner analysts reveal unexpected implications arising from the Internet of Things

01/19/2016  More than half of major new business processes and systems will incorporate some element of the Internet of Things (IoT) by 2020, according to Gartner, Inc.

Physicists develop a cooling system for the processors of the future

01/19/2016  Researchers from MIPT have found a solution to the problem of overheating of active plasmonic components.

Team develops wireless, dissolvable sensors to monitor brain

01/18/2016  A team of neurosurgeons and engineers has developed wireless brain sensors that monitor intracranial pressure and temperature and then are absorbed by the body, negating the need for surgery to remove the devices.

Sensor technologies are mature for autonomous driving application

01/15/2016  Currently the most advanced commercial car with autonomous features embeds about 17 sensors with two main solutions: ultrasonic sensors and cameras for surround. And by 2030, Yole anticipates more than 29 sensors.

Engineers invent a bubble-pen to write with nanoparticles

01/14/2016  Researchers at the Cockrell School of Engineering at The University of Texas at Austin have developed a device and technique, called bubble-pen lithography, that can gently and effectively handle nanoparticles.

Qualcomm and TDK announce joint venture

01/14/2016  Qualcomm and TDK to expand their collaboration across multiple technologies.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016