Applications

APPLICATIONS ARTICLES



Scientists 'bend' elastic waves with new metamaterials that could have commercial applications

01/23/2015  Engineering researchers at the University of Missouri have developed a material that has the ability to control these waves, creating possible medical, military and commercial applications with the potential to greatly benefit society.

Apple Watch spurs rapid growth of market for wireless charging in wearable technology in 2015

01/20/2015  Propelled by the arrival of the Apple Watch, the global market for wireless power and charging in wearable applications is set to attain a gargantuan 3,000 percent expansion this year compared to 2014.

Carbon nanotube finding could lead to flexible electronics with longer battery life

01/16/2015  University of Wisconsin-Madison materials engineers have made a significant leap toward creating higher-performance electronics with improved battery life -- and the ability to flex and stretch.

Temporary tattoo offers needle-free way to monitor glucose levels

01/16/2015  Nanoengineers at the University of California, San Diego have tested a temporary tattoo that both extracts and measures the level of glucose in the fluid in between skin cells. This first-ever example of the flexible, easy-to-wear device could be a promising step forward in noninvasive glucose testing for patients with diabetes.

JEOL and UC Irvine partner to develop electron microscopy and materials research center

01/14/2015  JEOL USA and the University of California's Irvine Materials Research Institute (IMRI) have entered into a strategic partnership to create a premier electron microscopy and materials science research facility.

SUNY Board appoints Dr. Alain Kaloyeros as founding president of SUNY Polytechnic Institute

01/14/2015  SUNY Polytechnic Institute (SUNY Poly) yesterday announced the SUNY Board of Trustees has appointed Dr. Alain Kaloyeros as the founding President of SUNY Poly.

Zinc oxide materials tapped for tiny energy harvesting devices

01/13/2015  New research helps pave the way toward highly energy-efficient zinc oxide-based micro energy harvesting devices with applications in portable communications, healthcare and environmental monitoring, and more.

GLOBALFOUNDRIES and Linear Dimensions to offer joint analog solution for wearables and MEMs sensors markets

01/09/2015  GLOBALFOUNDRIES and Linear Dimensions Semiconductor Inc. today announced that they are working together to manufacture a 14-channel programmable reference from Linear Dimensions for multiple markets including IoT (Internet of Things) sensor and wearable device applications.

Spotlight on MEMS: SEMI launches new European MEMS Summit

01/07/2015  SEMI today announced the launch of the European MEMS Summit, to be held on 17-18 September 2015 in Milan, Italy.

InvenSense to ship over 1B MEMS sensors worldwide

01/06/2015  InvenSense, Inc., a provider of intelligent sensor solutions, announced that since starting shipment of MEMS-based sensors in late 2006, it will reach 1 billion devices shipped in Q1 of calendar 2015.

HLMC develops specialty technology in pursuit of growing IoT market

01/05/2015  Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference ("ICCAD"), which was recently held at Hong Kong Science Park.

Internet of Things stimulates MEMS market

12/23/2014  The explosive expansion of the Internet of things (IoT) is driving rapid demand growth for microelectromechanical systems (MEMS) devices in areas including asset-tracking systems, smart grids and building automation.

Piezoelectricity in a 2-D semiconductor

12/22/2014  Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS.

IoT's divergent needs will drive different types of technologies

12/19/2014  Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.

Imec presents ultralow power RFID transponder chip in thin-film transistor technology on plastic at IEDM 2014

12/17/2014  At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip.

Daintree Networks named to "50 Most Promising IoT Companies of 2014"

12/17/2014  Daintree Networks has been named by CIO Review Magazine as one of the '50 Most Promising Internet of Things (IoT) Companies 2014.'

Imec demonstrates broadband graphene optical modulator on silicon

12/17/2014  At this week’s IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry’s first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed.

Synopsys and imec expand TCAD collaboration to 5nm and beyond

12/16/2014  Synopsys, Inc. today announced the expansion of its collaboration with imec (nanoelectronics research center imec) to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond.

What’s next for MEMS?

12/16/2014  The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.

Murata completes acquisition of Peregrine Semiconductor

12/12/2014  Murata Electronics North America, Inc. and Peregrine Semiconductor Corporation, founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, today announce that Murata has acquired all outstanding shares of Peregrine.




FINANCIALS



TECHNOLOGY PAPERS



Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015