Applications

APPLICATIONS ARTICLES



SkyWater significantly expands pure-play technology foundry customer base

11/16/2017  SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation.

Electronics industry conference to debut in Kuala Lumpur

11/15/2017  SEMICON Southeast Asia 2018 to bolster growing semiconductor industry in the region.

Leti announces FED4SAE project to accelerate European cyber-physical system solutions to market

11/14/2017  Leti, a research institute of CEA Tech and coordinator of the pan-European consortium FED4SAE, today announced that the 14 project partners have launched a three-year European Commission program to facilitate the acceleration of European cyber-physical-system (CPS) solutions to market.

First SEMICON Europa opens this year in co-location with productronica

11/14/2017  Semiconductor industry back on track for growth in Europe -- major new investments.

Magnetic sensor industry is moving into a consolidation phase

11/13/2017  With 7% CAGR between 2016 and 2022, the magnetic sensor market should reach almost US$ 2.5 billion in 2022.

Improving sensor accuracy to prevent electrical grid overload

11/13/2017  Engineers take note -- new current sensors need fine-tuning to accurately inform monitors of the electrical grid about incoming surges.

An interview with Bosch Sensortec CEO: IoT, environmental sensing and value chain

11/10/2017  SEMI interviewed one of the four keynotes presenting on November 14 during the Opening Ceremony, Dr. Stefan Finkbeiner, CEO of Bosch Sensortec, about topics about developments and trends in IoT, Environmental Sensing, and Value Chain as well as the role of Europe.

Leti joins DARPA-funded consortium to develop implantable device for restoring vision

11/09/2017  Leti announced today that a team of its researchers is participating in a U.S.-funded project to develop a safe, implantable neural interface system to restore vision by stimulating the visual cortex.

Advanced wireless-charging chip from STMicroelectronics enables faster charging of smartphones and tablets

11/09/2017  STMicroelectronics is powering up wireless charging for mobile devices by introducing one of the world's first chips to support the latest industry standard for faster charging.

Automotive electronic systems growth strongest through 2021

11/09/2017  IC Market Drivers 2018 report ranks major end-use applications and their impact on IC market growth.

The intelligence that leads to artificial intelligence

11/08/2017  Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

SEMI announces venue and program for Industry Strategy Symposium 2018

11/07/2017  SEMI announced today that the Industry Strategy Symposium (ISS) 2018, will take place January 15-18 at Half Moon Bay's Ritz-Carlton Hotel, with the theme "Smart, Intuitive & Connected: Semiconductor Devices Transforming the World."

MEMS & sensors safeguard autonomous cars, boost agricultural productivity and anticipate needs

11/03/2017  MEMS & Sensors Executive Congress speakers feature smart sensing components in new industrial, automotive, biomedical, agricultural applications.

NXP and Chongqing establish center for automotive electronics applications development in China

11/03/2017  NXP has partnered with the Chongqing Economic and Information Technology Commission and the Chongqing Laingian New Area Administrative Committee to drive more automotive industry growth with the new applications development center.

SEMI FlexTech selects PARC to build ultrathin, flexible audio speaker

10/30/2017  FlexTech, a SEMI Strategic Association Partner announced a new development project with PARC, a Xerox company, to develop a hybrid, highly bendable, paper-like smart tag, incorporating a thin audio speaker.

The MEMS packaging market is growing faster than the devices market itself

10/30/2017  The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1% for devices, during the period 2016 - 2022.

Optoelectronics, sensors/actuators and discretes climb

10/30/2017  The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

NXP unveils breakthrough tech for payment cards

10/27/2017  NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas.

Microsemi to acquire high performance timing business of Vectron International

10/27/2017  Microsemi Corporation and Knowles Corporation jointly announced today that Microsemi has entered into a definitive agreement to acquire the high performance timing business of Vectron International, a Knowles company, for $130 million.

Number of connected IoT devices will surge to 125 billion by 2030

10/27/2017  The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018

VIDEOS