Applications

APPLICATIONS ARTICLES



New technology using silver may hold key to electronics advances

07/02/2015  Engineers at Oregon State University have invented a way to fabricate silver, a highly conductive metal, for printed electronics that are produced at room temperature.

Smartphone sales remain an important IC market driver in 2015

07/02/2015  Smartphones forecast to represent 80% of total cellphone shipments in 4Q15.

Ambiq Micro appoints Mike Noonen as interim CEO

07/01/2015  Ambiq Micro, a developer of ultra-low power integrated circuits for power-sensitive applications, today announced the appointment Mike Noonen as interim Chief Executive Officer with immediate effect.

Graphene flexes its electronic muscles

07/01/2015  Flexing graphene may be the most basic way to control its electrical properties, according to calculations by theoretical physicists at Rice University and in Russia.

Consumer, healthcare, and industrial to drive wearable industry to potential value of $90B by 2020

07/01/2015  Wearable electronics is one of the consumer market’s hottest topics. Indeed, giants like Apple, Samsung, Xiaomi, and Huawei are now competing for a slice of a very promising pie.

EMC2015 - New Devices, Old Tricks

06/30/2015  The 57th annual Electronic Materials Conference, held June 24-26 in Columbus, Ohio, showcased research and development (R&D) of new device structures, as well as new insights into the process-structure-properties relationships of electronic devices now running in high-volume manufacturing (HVM) lines globally.

Solid State Watch: June 19-25, 2015

06/26/2015  IHS says Moore’s Law led to trillions added in global economy; Cadence and Applied Materials collaborate on CMP process optimization; Power transistors seen stabilizing and setting record sales in 2015; Nanowires could be the LEDs of the future

Toward tiny, solar-powered sensors

06/24/2015  Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells.

imec and Holst Centre present a gas sensing platform for intuitive IoT applications

06/23/2015  Imec and Holst Centre have developed a small NO2 sensor featuring a low power consumption in the mW range.

Breaking Down Power Management Verification

06/22/2015  During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.

MEMS applications take the stage in the first edition of the European MEMS Summit

06/22/2015  The first edition of this Summit will take place on September 17-18, 2015 in Milan, Italy and its theme will be “Sensing the Planet, MEMS for Life.”

Bosch selects Rudolph for semiconductor inspection solutions

06/22/2015  Rudolph Technologies, Inc. announced today that the MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30 Inspection System for various steps in the front- and back-end fabrication processes of micro electrical mechanical systems (MEMS) devices.

3DIC Technology Drivers and Roadmaps

06/22/2015  Circuit performance and silicon area improvements seen in new die stacks.

Organ-on-a-chip technology helps researchers better understand pregnancy

06/18/2015  National Institutes of Health (NIH) researchers and their colleagues have developed a "placenta-on-a-chip" to study the inner workings of the human placenta and its role in pregnancy.

Researchers create transparent, stretchable conductors using nano-accordion structure

06/18/2015  Researchers from North Carolina State University have created stretchable, transparent conductors that work because of the structures' "nano-accordion" design. The conductors could be used in a wide variety of applications, such as flexible electronics, stretchable displays or wearable sensors.

Fairchild launches MEMS product line

06/16/2015  Fairchild, a supplier of high-performance semiconductor solutions, today launched the FIS1100 6-axis MEMS Inertial Measurement Unit (IMU), the company’s first MEMS product stemming from its strategic investments in MEMS and motion tracking.

Renesas Electronics announces Synergy Platform for IoT

06/15/2015  Renesas Electronics, a supplier of advanced semiconductor solutions, today announced the Renesas Synergy Platform.

A KAIST research team develops the first flexible phase-change random access memory

06/15/2015  Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

Researchers grind nanotubes to get nanoribbons

06/15/2015  A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

MEMSIC's SmartSensing tech delivers highest performance in inertial measurement systems

06/11/2015  MEMSIC announced the launch of its latest addition, the INS380, to its portfolio of Inertial Systems enabled with SmartSensing technology targeted to a broad range of precision motion sensing applications.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Interconnects

July 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015