Applications

APPLICATIONS ARTICLES



Global scientific team "visualizes" a new crystallization process

04/17/2014  Sometimes engineers invent something before they fully comprehend why it works. To understand the "why," they must often create new tools and techniques in a virtuous cycle that improves the original invention while also advancing basic scientific knowledge.

Catching the (invisible) wave

04/11/2014  UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications.

The Week in Review: April 11, 2014

04/11/2014  SIA reports sales of semiconductors in February 2014 increased 11.4 percent from February 2013; GSA celebrates 20 years; SEMI expanding Innovation Village at SEMICON Europa

Domain walls in nanowires cleverly set in motion

04/10/2014  Important prerequisite for the development of nano-components for data storage and sensor technology.

New "switch" could power quantum computing

04/10/2014  A light lattice that traps atoms may help scientists build networks of quantum information transmitters.

MEMS microphones broadcast strong growth

04/04/2014  Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

To bridge LEDs' green gap, scientists think small

04/04/2014  Nanostructures half the breadth of a DNA strand could improve the efficiency of light emitting diodes (LEDs), especially in the "green gap," a portion of the spectrum where LED efficiency plunges, simulations at the U.S. Department of Energy's National Energy Research Scientific Computing Center (NERSC) have shown.

MEMS microphone market to grow at 13% CAGR, reaching $1.65B by 2019

04/02/2014  MEMS microphone market has been growing since its first appearance in 2003. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market.

Quantum Polymers announces 8 inch diameter carbon and glass filled PEEK rod products

04/01/2014  These products work well for applications requiring a balance of chemical resistance and mechanical strength in high temperature environments like those frequently found in the oil and gas, chemical processing, and semiconductor industries.

MACOM announces IP licensing program for GaN-on-Si technology

04/01/2014  M/A-COM Technology Solutions Inc. this week announced an IP licensing program for Gallium Nitride (GaN) on Silicon technology.

Fabricating nanostructures with silk could make clean rooms green rooms

04/01/2014  Tufts University engineers have demonstrated that it is possible to generate nanostructures from silk in an environmentally friendly process that uses water as a developing agent and standard fabrication techniques.

InvenSense and Sonion announce MEMS microphone development alliance

03/28/2014  InvenSense, Inc. and Sonion today announced a strategic alliance in which the two parties will cooperate in the development of MEMS microphones and related technologies for use in a broad range of hearing applications.

IP interoperability in SoCs: Mix and match doesn’t always work

03/26/2014  More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified specifications that inevitably raise the bar for performance and power usage, and it will probably contain new IP that must be integrated.

Roll over flat panel displays

03/25/2014  Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes? Semiconductor Manufacturing & Design discussed the issues with Mac McDaniel, Director and Chief Marketing Officer, Display Business Group, Applied Materials, Michael Ciesinski, MD of the Flextech Alliance, and Keri Goodwin, Principal Scientist from the Centre for Process Innovation (CPI), in the UK.

The Week in Review: March 21, 2014

03/21/2014  UC Berkley research in on-chip inductors; Equipment bookings and billings continue along a steady trend; SMIC CEO awarded SEMI Outstanding EHS Achievement Award; EVG opens HQ in China; ChaoLogix offers security for semi chips; Applied Materials named a World's Most Ethical Company

6 and 9-axis DOF sensors are creating a new paradigm in the combos business

03/18/2014  Over the last years, inertial MEMS have been subject to dramatic market & technological evolution. This has been driven by a large increase of the consumer market.

Top ten MEMS startup Qualtré secures $8M strategic round

03/17/2014  Qualtré, Inc., a developer of next generation silicon MEMS inertial sensors, announced today that it has finalized an $8 million Series C strategic round of investment from a new strategic investor and from Matrix Partners and Pilot House Ventures, contributors to Qualtré’s previous rounds.

Surface characteristics influence cellular growth on semiconductor material

03/14/2014  Changing the texture and surface characteristics of a semiconductor material at the nanoscale can influence the way that neural cells grow on the material.

3D EDA brings together proven 2D solutions

03/14/2014  Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Eveon and Leti mark milestone in fabrication of smart bolus-type micro-pump for drug delivery

03/13/2014  Eveon and CEA-Leti today announced the demonstration of liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014