10/21/2016 Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015.
10/21/2016 Stanford, Oxford team creates high-efficiency tandem cells.
10/18/2016 STMicroelectronics today announced that its LSM6DSM 6-axis Inertial Measurement Unit (IMU) has earned certification for use in next-generation mobile devices running Google Daydream, a high-performance virtual-reality platform, and Tango, a platform that maps 3D space and enables it to be overlaid with virtual objects.
10/17/2016 Samsung Electronics Co., Ltd. today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.
10/13/2016 Researchers at the Nanoscience Center (NSC) of the University of Jyväskylä and BioMediTech (BMT) of the University of Tampere have now demonstrated a method to fabricate electronic devices by using DNA.
10/11/2016 MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.
10/07/2016 New research, led by the University of Southampton, has demonstrated that a nanoscale device, called a memristor, could be used to power artificial systems that can mimic the human brain.
10/07/2016 Scientists have created a material that could make reading biological signals, from heartbeats to brainwaves, much more sensitive.
10/06/2016 A research team led by faculty scientist Ali Javey at the Department of Energy's Lawrence Berkeley National Laboratory (Berkeley Lab) has done just that by creating a transistor with a working 1-nanometer gate. For comparison, a strand of human hair is about 50,000 nanometers thick.
10/04/2016 STMicroelectronics and WiTricity, an industry pioneer in wireless power transfer over distance, today announced their design collaboration to develop semiconductor solutions for magnetic-resonance-based wireless power transfer.
10/04/2016 The five-year collaboration will include, but is not limited to, joint development and implementation of IoT and 5G based Smart ICT solutions for the EU and Taiwan, and scientific information exchanges.
10/04/2016 imec and Holst Centre (established by imec and TNO), today announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications.
10/03/2016 Silicon Labs today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT).
10/03/2016 STMicroelectronics (NYSE: STM) today revealed its contributions to an intelligent toothbrush system from Oral-B.
10/03/2016 Leti, an institute of CEA Tech, announced today it has joined the Stanford SystemX Alliance, a network of 100 renowned Stanford University professors and 27 world-class companies, joining forces in a pre-competitive environment to define tomorrow's research strategies.
09/30/2016 Cypress Semiconductor Corp. (Nasdaq: CY) and Hackster today announced a global design competition that gives engineers the opportunity to prototype their innovative ideas that sense the world around us for use in the growing Internet of Things (IoT) market, home appliances, and consumer and industrial applications.
09/27/2016 SiTime Corporation today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators.
09/27/2016 The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.
09/26/2016 MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016.
09/26/2016 EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.
December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology
The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016Sponsored by Master Bond, Inc.,
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,