Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

Integrated circuit technology advances continue to amaze

02/21/2018  Despite increasing costs of development, IC manufacturers are still making great strides.

Researchers invent light-emitting nanoantennas

02/21/2018  Nanoscale light sources and nanoantennas already found a wide range of applications in several areas, such as ultra compact pixels, optical detection or telecommunications.

'Memtransistor' brings world closer to brain-like computing

02/21/2018  Combined memristor and transistor can process information and store memory with one device.

Better together: Silicon qubits plus light add up to new quantum computing capability

02/15/2018  A silicon-based quantum computing device could be closer than ever due to a new experimental device that demonstrates the potential to use light as a messenger to connect quantum bits of information -- known as qubits -- that are not immediately adjacent to each other. The feat is a step toward making quantum computing devices from silicon, the same material used in today's smartphones and computers.

Engineers develop smart material that changes stiffness when twisted or bent

02/15/2018  A new smart and responsive material can stiffen up like a worked-out muscle, say the Iowa State University engineers who developed it.

Rutgers-led innovation could spur faster, cheaper, nano-based manufacturing

02/14/2018  Scalable and cost-effective manufacturing of thin film devices.

2018 FLEXI awards innovation and leadership in flexible hybrid electronics

02/13/2018  The 2018 FLEXI Awards today recognized groundbreaking accomplishments in the Flexible Hybrid Electronics (FHE) sector in 2017.

Close to the edge: Brain-inspired technologies will bring data processing and analytics to Internet of Things devices

02/13/2018  CEA-Leti's chief scientist today issued a forward-looking call to action for the microelectronics industry to create a radically new, digital-communication architecture for the Internet of Things in which "a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud".

Frank Shemansky to lead SEMI's MEMS & Sensors Industry Group

02/13/2018  SEMI today announced the appointment of Frank A. Shemansky, Jr., Ph.D., as executive director and chief technology officer (CTO) of the MEMS & Sensors Industry Group (SEMI-MSIG).

Imec introduces CMOS chip with 16,384 micro-electrodes and 1,024 channels for multimodal cell interfacing

02/12/2018  Breakthrough for high-throughput cell assays and characterization of complex cell behavior and interaction.

Today's highest quality composite-piezoelectric developed at NUST MISIS

02/12/2018  NUST MISIS scientists jointly with an international group of scientists have managed to develop a composite material that has the best piezoelectric properties today. The research results were published in Scientific Reports journal.

Leti Chief Scientist Barbara De Salvo to deliver opening day talk on brain-inspired technologies at ISSCC 2018

02/08/2018  Delivering a keynote talk during the Feb. 12 plenary session that formally opens the conference, De Salvo will note that the architecture will include human-brain inspired hardware coupled to new computing paradigms and algorithms that "will allow for distributed intelligence over the whole IoT network, all-the-way down to ultralow-power end-devices."

A billion devices from SiTime empower self-driving cars, mobile phones, and everything in between

02/07/2018  SiTime Corporation, a developer of MEMS timing devices, announced today that it has shipped cumulatively over 1 billion timing devices.

Biosensors will be inexpensive, do more, go everywhere

02/07/2018  University of Cincinnati engineering professor Jason Heikenfeld maps the progress and untapped potential of wearable sensors in a critical review of the research field.

MACOM and STMicroelectronics to bring GaN on silicon to mainstream RF markets and applications

02/07/2018  MACOM Technology Solutions Holdings, Inc. and STMicroelectronics announced an agreement to develop GaN (Gallium Nitride) on Silicon wafers to be manufactured by ST for MACOM's use across an array of RF applications.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.

Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs

02/06/2018  Texas Instruments (TI) today introduced the industry's smallest operational amplifier (op amp) and low-power comparators at 0.64 mm2.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

IHS Markit identifies top trends driving the Internet of Things in 2018 and beyond

02/02/2018  Driven by the need for intelligent connected devices in industrial and commercial applications, the number of connected Internet of Things (IoT) devices globally will grow to more than 31 billion in 2018, according to new analysis from business information provider IHS Markit



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
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Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

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Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
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