Applications

APPLICATIONS ARTICLES



The intelligence that leads to artificial intelligence

11/08/2017  Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

SEMI announces venue and program for Industry Strategy Symposium 2018

11/07/2017  SEMI announced today that the Industry Strategy Symposium (ISS) 2018, will take place January 15-18 at Half Moon Bay's Ritz-Carlton Hotel, with the theme "Smart, Intuitive & Connected: Semiconductor Devices Transforming the World."

MEMS & sensors safeguard autonomous cars, boost agricultural productivity and anticipate needs

11/03/2017  MEMS & Sensors Executive Congress speakers feature smart sensing components in new industrial, automotive, biomedical, agricultural applications.

NXP and Chongqing establish center for automotive electronics applications development in China

11/03/2017  NXP has partnered with the Chongqing Economic and Information Technology Commission and the Chongqing Laingian New Area Administrative Committee to drive more automotive industry growth with the new applications development center.

SEMI FlexTech selects PARC to build ultrathin, flexible audio speaker

10/30/2017  FlexTech, a SEMI Strategic Association Partner announced a new development project with PARC, a Xerox company, to develop a hybrid, highly bendable, paper-like smart tag, incorporating a thin audio speaker.

The MEMS packaging market is growing faster than the devices market itself

10/30/2017  The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1% for devices, during the period 2016 - 2022.

Optoelectronics, sensors/actuators and discretes climb

10/30/2017  The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

NXP unveils breakthrough tech for payment cards

10/27/2017  NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas.

Microsemi to acquire high performance timing business of Vectron International

10/27/2017  Microsemi Corporation and Knowles Corporation jointly announced today that Microsemi has entered into a definitive agreement to acquire the high performance timing business of Vectron International, a Knowles company, for $130 million.

Number of connected IoT devices will surge to 125 billion by 2030

10/27/2017  The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.

Tiny chip-based methane spectrometer could help reduce greenhouse gas emissions

10/26/2017  New technology from IBM Research could be used to create an inexpensive sensor network that autonomously monitors for natural gas leaks.

Piezoelectrics stretch their potential with a method for flexible sticking

10/25/2017  Researchers see performance boost in novel method for connecting thin-film piezoelectric materials to flexible substrates, with potential applications for medical devices.

SEMICON Japan brings smart applications and IoT

10/25/2017  Over 30,000 attendees are expected to convene at SEMICON Japan at Tokyo Big Sight in Tokyo on December 13-15.

STMicroelectronics announces class-leading water-resistant pressure sensor

10/24/2017  STMicroelectronics has taken underwater accuracy to new heights with its latest miniature pressure sensor, which is featured in the new Samsung Gear Fit 2 Pro.

SEMICON Europa 2017: Keynotes announced

10/17/2017  Showcasing critical issues shaping the entire electronics manufacturing supply chain.

New MIPI Alliance Group collaborates with automotive industry experts to address interface specifications for automotive applications

10/16/2017  The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the formation of an Automotive Birds of a Feather (BoF) Group to solicit industry input from original equipment manufacturers (OEMs) and their suppliers to enhance existing or develop new interface specifications for automotive applications.

ArterisIP joins GLOBALFOUNDRIES FDXcelerator Partner Program

10/13/2017  ArterisIP, the supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the FDXcelerator Partner Program.

GLOBALFOUNDRIES introduces new automotive platform to fuel tomorrow's connected car

10/12/2017  GLOBALFOUNDRIES today unveiled AutoPro, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.

Gartner identifies the top 10 strategic technology trends for 2018

10/06/2017  Gartner, Inc. this week highlighted the top strategic technology trends that will impact most organizations in 2018.

MEMS & sensors companies compete for tech showcase "crown"

10/05/2017  MSIG announces five finalists for Technology Showcase at MEMS & Sensors Executive Congress, November 1-2, in Napa Valley, Calif.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


More Events

VIDEOS