Applications

APPLICATIONS ARTICLES



Sensor technologies' convergence and connectivity made possible medical IoT

09/07/2017  Healthcare is facing one of its major turning points in decades. After penetrating the consumer market, the digital revolution and its related IoT concept is rapidly changing health models.

MEMS & Sensors Executive Congress answers "What's driving $66B industry?"

09/06/2017  Speakers to explore biomedical, automotive, agriculture and smart home, November 1-2 in Napa Valley, Calif.

Flexible hybrid electronics & sensors impacting the automotive industry

09/05/2017  FlexTech, a SEMI strategic association partner, will host a one-day Flexible Hybrid Electronics and Sensors Automotive Industry workshop in Detroit, Michigan on September 13, 2017 to explore how FHE adds functionality, decreases weight and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by flexible hybrid electronics (FHE) and sensors.

Leti and partners in PiezoMAT Project develop new fingerprint technology

09/05/2017  Leti today announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI).

Insect eyes inspire new solar cell design from Stanford

09/01/2017  Packing tiny solar cells together, like micro-lenses in the compound eye of an insect, could pave the way to a new generation of advanced photovoltaics, say Stanford University scientists.

STMicroelectronics boosts its ecosystem with partner program that connects customers with qualified third parties

08/31/2017  STMicroelectronics has strengthened its ecosystem through a Partner Program that connects customers with qualified technical specialists capable of strategically supporting their projects.

Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution

08/30/2017  Qualcomm Incorporated and Himax Technologies, Inc. today jointly announced a collaboration to accelerate the development and commercialization of a high resolution, low power active 3D depth sensing camera system to enable computer vision capabilities for use cases such as biometric face authentication, 3D reconstruction, and scene perception for mobile, IoT, surveillance, automotive and AR/VR.

Acting like a muscle, nano-sized device lifts 165 times its own weight

08/30/2017  Rutgers materials scientists discover powerful effect that could benefit robotics, aviation, medicine and other fields.

Technology Showcase finalists revealed for European MEMS & Sensors Summit

08/29/2017  Five companies compete for attendee votes at SEMI European MEMS & Sensors Summit, September 20-22, 2017, Grenoble, France.

Automotive sensing: A mature yet highly dynamic market

08/29/2017  Despite its age and maturity, the automotive market has witnessed many unexpected developments over the past two years. And as has always been the case, safety drives the market.

Next-generation drug testing on chips

08/25/2017  Improvements to tiny body-on-a-chip devices could lead to next-generation pre-clinical testing of drug toxicity.

Worldwide wearable device sales to grow 17% in 2017

08/24/2017  Sales of smartwatches to total 41.5 million units in 2017.

Analog Devices’ monitoring initiative aims to improve crop quality, yields, and boost profitability of local farmers

08/23/2017  The initiative instructs student farmers how to use Internet of Things and blockchain technologies to track the conditions and movement of produce from “Farm to Fork” to make decisions that improve quality, yields, and profitability.

Stretchable biofuel cells extract energy from sweat to power wearable devices

08/22/2017  A team of engineers has developed stretchable fuel cells that extract energy from sweat and are capable of powering electronics, such as LEDs and Bluetooth radios.

MRSI Systems launches high speed die bonder for photonics high volume manufacturing

08/22/2017  MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements.

'Electronic skin' takes wearable health monitors to the next level

08/21/2017  A soft, stick-on patch collects, analyzes and wirelessly transmits a variety of health metrics from the body to a smartphone.

Brain-mimicking nanomaterials for A.I. retina receive $7M research grant

08/09/2017  A future android brain like that of Star Trek’s Commander Data might contain neuristors, multi-circuit components that emulate the firings of human neurons.

NanoString and Lam Research announce strategic development collaboration

08/09/2017  NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.

Intel completes tender offer for Mobileye

08/08/2017  The combination of Intel and Mobileye will allow Mobileye's computer vision expertise (the "eyes") to complement Intel's high-performance computing and connectivity expertise (the "brains") to create automated driving solutions from cloud to car.

Opto-mechanical technique circumvents mechanical losses using the action of light

08/08/2017  A research collaboration between the University of Illinois at Urbana-Champaign, the National Institute of Standards and Technology, and the University of Maryland has revealed a new technique by which scattering of sound waves from disorder in a material can be suppressed on demand. All of this, can be simply achieved by illuminating with the appropriate color of laser light. The result, which is published in Nature Communications, could have a wide-ranging impact on sensors and communication systems.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS