Applications

APPLICATIONS ARTICLES



Qualcomm and TDK announce joint venture

01/14/2016  Qualcomm and TDK to expand their collaboration across multiple technologies.

Gartner reports worldwide PC shipments declined 8.3% in fourth quarter of 2015

01/13/2016  Worldwide PC shipments totaled 75.7 million units in the fourth quarter of 2015, a 8.3 percent decline from the fourth quarter of 2014, according to preliminary results by Gartner, Inc

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

Flexible hybrid electronics market heating up in 2016

01/07/2016  Flexible and printed electronics applications are becoming real. Forecasters are predicting a nearly $30 billion market for internet-connected devices in a combined industry and consumer sector.

Imec and Cloudtag collaborate on frictionless wearables

01/07/2016  Cloudtag and imec, the nanoelectronics research center, today presented the first results of their collaboration on accurate frictionless wearable health solutions.

New bimetallic alloy nanoparticles for printed electronic circuits

01/05/2016  "Printed electronics" has the potential to enable low-cost fabrication of electronics on flexible or curved surfaces, which will lead to the use of electronics in more varied applications.

Strong semiconductor growth forecast for electric vehicle DC fast-charging stations

12/23/2015  The global market for semiconductors used in electric vehicle (EV) charging stations for plug-in hybrid (PH) and battery electric vehicles (BEV) will continue to expand in the coming years, providing significant growth opportunities to semiconductor manufacturers.

A microfluidic biochip for blood cell counts at the point-of-care

12/22/2015  Teams of researchers from the University of Illinois at Urbana-Champaign (UIUC) have demonstrated a biosensor capable of counting the blood cells electrically using only a drop of blood.

New device uses carbon nanotubes to snag molecules

12/22/2015  Engineers at MIT have devised a new technique for trapping hard-to-detect molecules, using forests of carbon nanotubes.

Startup Works on Ultralow-k Materials for Chips, Displays

12/21/2015  The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.

3D ASIP Conference Hears from EDA, IC Gear Companies

12/18/2015  John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.

Packaging Conference Addresses Challenges, Opportunities in New Technologies

12/18/2015  On the second day of the 12th annual 3D ASIP conference, the heavy hitters came out to talk. Attendees heard presentations from executives of Amkor Technology, the Defense Advanced Research Projects Agency (DARPA), Northrop Grumman, Taiwan Semiconductor Manufacturing, Teledyne Scientific & Imaging, and Xilinx, among other companies.

Internet of Things market to nearly double by 2019

12/17/2015  Between 2015 and 2019, worldwide systems revenues for applications connecting to the Internet of Things will nearly double, reaching $124.5 billion in the final year of this decade, according to IC Insights’ new 2016 edition of its IC Market Drivers report. During that same timeframe, new connections to the Internet of Things (IoT) will grow from about 1.7 billion in 2015 to nearly 3.1 billion in 2019 (Figure 1), based on the forecast in the new 450-page report, which examines emerging and major end-use applications fueling demand for ICs.

Imec, KU Leuven and NERF combine electronics and photonics in neural probes

12/17/2015  At last week’s IEEE International Electron Devices Meeting 2015, nanoelectronics research center imec, KU Leuven, and Neuro-Electronics Research Flanders (NERF, set up by VIB/KU Leuven and imec) presented a set of silicon neural probes that combine 12 monolithically integrated optrodes using a CMOS compatible process.

Conference Features "The Year of Stacked Memory" in 2015

12/17/2015  The theme of this year's 3D Architectures for Semiconductor Integration and Packading (3D ASIP) conference is "The Year of Stacked Memory," noting how memory die stacked in one package are becoming more commonplace in 2015.

Cellphones remain the largest driver of IC sales, but growth stalls

12/11/2015  The total production value of electronic systems is forecast to decrease 2% in 2015 to an estimated $1,423 billion, marking only the fourth time in history that the systems market registers a decline.

New approaches for hybrid solar cells

12/10/2015  Using a new procedure researchers at the Technical University of Munich (TUM) and the Ludwig Maximillians University of Munich (LMU) can now produce extremely thin and robust, yet highly porous semiconductor layers. A very promising material - for small, light-weight, flexible solar cells, for example, or electrodes improving the performance of rechargeable batteries.

Innovative sensors make wearables truly unique

12/10/2015  There will be a $5.5 billion market for sensors used in wearable technology applications by 2025, according to IDTechEx’s best-selling research report on the topic.

China Bolsters its IC Gear Business with Mattson Acquisition

12/10/2015  Mattson Technology agreed this month to be acquired by Beijing E-Town Dragon Semiconductor Industry Investment Center, a limited partnership in China, for about $300 million in cash.

Smart Rock Bolt Wins Prize at Designers of Things Conference

12/07/2015  When it comes to Internet of Things products, most people would think of the Apple Watch or Fitbit fitness-tracking devices. A device aimed at the mining industry has proved to be a popular entry at the Designers of Things conference in San Jose, Calif.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016