Applications

APPLICATIONS ARTICLES



Microchip Technology completes acquisition of Micrel

08/04/2015  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has completed its previously announced acquisition of Micrel.

ON Semiconductor introduces new ICs for next generation auto designs

08/03/2015  ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.

OMRON to acquire motion control company, Delta Tau Data Systems, Inc.

08/03/2015  OMRON Corporation announced its entry into a stock purchase agreement to acquire a 100 percent stake in Delta Tau Data Systems, Inc. of California (DT), which will result in DT becoming a member of the OMRON Group.

IBM launches new Internet of Things community for developers

07/29/2015  IBM today announced the launch of a new community, IBM developerWorks Recipes, designed to help developers – from novice to experienced – quickly and easily learn how to connect Internet of Things (IoT) devices to the cloud and how to use data coming from those connected devices.

Penn researchers discover new chiral property of silicon, with photonic applications

07/24/2015  By encoding information in photons via their spin, "photonic" computers could be orders of magnitude faster and efficient than their current-day counterparts. Likewise, encoding information in the spin of electrons, rather than just their quantity, could make "spintronic" computers with similar advantages.

Wearable systems give major boost to total IoT sales in 2015

07/16/2015  Market revenues associated with network communications, sensing, and control functions in subsystems and objects attached to the Internet of Things (IoT) are forecast to grow 29% in 2015 to $62.4 billion after increasing 21% in 2014 to about $48.4 billion.

Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials

07/14/2015  Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects.

Blood and tears at DAC

07/14/2015  At this year’s Design Automation Conference (DAC) in San Francisco, Brian Otis, a Director at Google, talked about how hundreds of millions of people are at risk of diabetes – and how a smart contact lens that continuously monitors blood glucose levels and transmits the data to a smartphone might just be the ideal solution.

IoT platform, Silicon Impulse, energy efficiency and consumer applications focus of LetiDays discussion

07/09/2015  Smart devices for the Internet of Things are among the top three growth drivers for the semiconductor industry, but the IoT is a highly fragmented market where multiple applications have varying energy requirements.

Surging phablets to shoot past stalled tablet market in 2015

07/08/2015  Updated forecast shows large-screen smartphone shipments climbing 66% this year to 252 million units while the lack of replacement purchases stymies tablets.

New technology using silver may hold key to electronics advances

07/02/2015  Engineers at Oregon State University have invented a way to fabricate silver, a highly conductive metal, for printed electronics that are produced at room temperature.

Smartphone sales remain an important IC market driver in 2015

07/02/2015  Smartphones forecast to represent 80% of total cellphone shipments in 4Q15.

Ambiq Micro appoints Mike Noonen as interim CEO

07/01/2015  Ambiq Micro, a developer of ultra-low power integrated circuits for power-sensitive applications, today announced the appointment Mike Noonen as interim Chief Executive Officer with immediate effect.

Graphene flexes its electronic muscles

07/01/2015  Flexing graphene may be the most basic way to control its electrical properties, according to calculations by theoretical physicists at Rice University and in Russia.

Consumer, healthcare, and industrial to drive wearable industry to potential value of $90B by 2020

07/01/2015  Wearable electronics is one of the consumer market’s hottest topics. Indeed, giants like Apple, Samsung, Xiaomi, and Huawei are now competing for a slice of a very promising pie.

Toward tiny, solar-powered sensors

06/24/2015  Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells.

imec and Holst Centre present a gas sensing platform for intuitive IoT applications

06/23/2015  Imec and Holst Centre have developed a small NO2 sensor featuring a low power consumption in the mW range.

MEMS applications take the stage in the first edition of the European MEMS Summit

06/22/2015  The first edition of this Summit will take place on September 17-18, 2015 in Milan, Italy and its theme will be “Sensing the Planet, MEMS for Life.”

Bosch selects Rudolph for semiconductor inspection solutions

06/22/2015  Rudolph Technologies, Inc. announced today that the MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30 Inspection System for various steps in the front- and back-end fabrication processes of micro electrical mechanical systems (MEMS) devices.

Organ-on-a-chip technology helps researchers better understand pregnancy

06/18/2015  National Institutes of Health (NIH) researchers and their colleagues have developed a "placenta-on-a-chip" to study the inner workings of the human placenta and its role in pregnancy.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015