Applications

APPLICATIONS ARTICLES



Imec celebrates 30 years

01/14/2014  Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

Nano-capsules show potential for more potent chemoprevention

01/13/2014  Researchers at the Winship Cancer Institute of Emory University have discovered a more effective drug delivery system using nanotechnology that could one day significantly affect cancer prevention.

The cyborgs era has started

01/13/2014  They are known from science fiction novels and films – technically modified organisms with extraordinary skills, so-called cyborgs.

Yole Développement addresses MEMS sensor challenges at January technology seminar

01/09/2014  Yole Développement will host a MEMS & Imaging Technology Seminar in Korea on January 16, 2014.

New optical image stabilization gyroscope from STMicroelectronics targets tiny smartphones and cameras

01/08/2014  STMicroelectronics has introduced a new 2-axis gyroscope specifically optimized for optical image stabilization in smartphones and digital still cameras.

Toshiba announces "Bright Mode" for CMOS image sensors

01/07/2014  Toshiba Corporation today announced the development of “Bright Mode,” a CMOS image sensor technology that allows smartphones and tablets to record full HD video at 240 frames per second (fps), the industry’s highest frame rate. “Bright Mode” realizes high quality slow motion playback.

Oxford Instruments shares expertise with nanotechnology researchers in India

01/07/2014  Oxford Instruments has just completed its second series of successful and well attended seminars in India following its first in Bangalore in 2012.

STMicroelectronics reveals 9-axis movement/position sensor

01/07/2014  STMicroelectronics has revealed its most advanced module for 9-axis movement and position sensing in next-generation mobiles and tiny wearable devices.

Safety critical devices drive fast adoption of advanced DFT

01/06/2014  Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important as well as method to perform a built-in self-test.

Penn researchers grow liquid "flowers" that can be used as lenses

12/23/2013  A team of material scientists, chemical engineers and physicists from the University of Pennsylvania has made another advance in their effort to use liquid crystals as a medium for assembling structures.

Why SOI is the Future Technology of Semiconductors

12/23/2013  Zvi Or-Bach, President and CEO of MonolithIC 3D, blogs that this is the "one learning" we can take away from IEDM 2013.

The Week in Review: Dec. 20, 2013

12/20/2013  AMD and Hynix close to commercialization of HBM; Intel's 22nm mobile processor; SEMI's book-to-bill report; Soitec and CEA renew partnership; Micron collaborates with Broadcom on DRAM timing issue

Experts At The Table: Exploring the relationship between board-level design and 3D, and stacked, dies

12/17/2013  SemiMD discussed what board level design can tell us about chip-level (three-dimensional) 3D and stacked dies with Sesh Ramaswami, Applied Materials’ Managing Director, TSV and Advanced Packaging, Advanced Product Technology Development, and Kevin Rinebold, Cadence’s Senior Product Marketing Manager.

SPTS named Supplier of the Year at the Annual MEMS Executive Congress

12/16/2013  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, was named MEMS Supplier of the Year at the MEMS Executive Congress U.S. 2013 held in Napa last month

Low-power tunneling transistor for high-performance devices at low voltage

12/12/2013  A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers.

Graphene-based nano-antennas may enable networks of tiny machines

12/12/2013  Networks of nanometer-scale machines offer exciting potential applications in medicine, industry, environmental protection and defense, but until now there's been one very small problem: the limited capability of nanoscale antennas fabricated from traditional metallic components.

STMicroelectronics launches new advanced energy-harvesting IC

12/10/2013  STMicroelectronics is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).

Research Alert: Dec. 10, 2013

12/10/2013  Thin, flexible solar cells; Polymers can be semimetals; MOF materials

The Week in Review: Dec. 6, 2013

12/06/2013  Worldwide semiconductor sales; Soitec announces high-volume manufacturing of eSI substrates; SEMI releases World Fab Forecast; Micron announces new VP of Quality; Industry on track for highest-ever annual sales in 2013

RF-SOI Wafers for Wireless Applications

12/05/2013  The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014