Applications

APPLICATIONS ARTICLES



The CEA announces expanded collaboration with Intel

05/18/2016  The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R&D agreement signed in Paris on Thursday 12 May.

IBM keynoter outlines disruptive "Economy of Things" at SEMI’s ASMC 2016

05/18/2016  The 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016), opened today (May 17) in Saratoga Springs, New York.

TowerJazz begins mass producing new integrated SiGe-based "front-end module on a chip" RF platform for IoT applications

05/17/2016  TowerJazz today announced volume production of a new RF technology capable of integrating a wireless front-end module (FEM) on a single chip, tailored to meet the challenges of Internet of Things (IoT) applications.

Ultratech Cambridge Nanotech forms research collaboration with Northeastern University

05/17/2016  Ultratech, Inc. announced the formation of a research collaboration with Professor Thomas J. Webster, Ph.D. at Northeastern University, to study the use of nano-materials produced via ALD for medical applications.

Worldwide wearables market increases 67.2% amid seasonal retrenchment, reports IDC

05/16/2016  A combination of device releases, price reductions, and company rationalizations marked the first quarter of 2016 (1Q16) in the worldwide wearables market.

Si2 launches project to develop new integrated circuit power modeling technology

05/12/2016  Silicon Integration Initiative (Si2), an Austin-based integrated circuit research and development joint venture, has launched a project to help designers reduce power consumption, a growing challenge for most system-on-chip designs.

Samsung PhD Fellowship program recognizes best and brightest student innovators

05/12/2016  Each student will receive a Fellowship award of $50,000 as well as mentorship to support their ground-breaking research.

Automotive electronics system demand fails to boost automotive IC market in 2015

05/10/2016  Falling ASPs offset strong unit growth in automotive IC market, resulting in 3% decline.

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor's SLIM and SWIFT Packaging Technologies

05/05/2016  Amkor Technology, Inc., a outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor's SLIM and SWIFT advanced fan-out package technologies.

Maturing smartphone market signals falling growth for wireless semiconductors

05/04/2016  Revenue associated with the wireless competitive landscape continued to serve as a bright spot in the larger semiconductor market in 2015, growing almost 4 percent to over $56 billion, year over year, while total semiconductor revenue fell 2 percent to $347 billion during the same period.

Imec honors Dr. Gordon Moore with "Lifetime of Innovation Award"

05/03/2016  Nanoelectronics research center imec has announced that Dr. Gordon E. Moore, creator of the famous Moore’s law theory and co-founder of Intel, is the recipient of its lifetime of innovation award.

How to Boost Verification Productivity with SystemVerilog/UVM and Emulation

05/03/2016  Use of emulation for hardware-assisted testbench acceleration is growing as design verification teams find that simulation alone cannot deliver the coverage or performance needed to get large, complex designs to market on time. If your design requires millions of clock cycles to fully verify, you need both simulation and emulation.

Cypress to acquire Broadcom's Wireless of Internet of Things business

04/28/2016  Cypress Semiconductor Corp. (Nasdaq: CY) and Broadcom Limited (Nasdaq: AVGO) today announced the signing of a definitive agreement under which Cypress will acquire Broadcom's Wireless Internet of Things (IoT) business and related assets in an all-cash transaction valued at $550 million.

Cartamundi, imec and Holst Centre win "Best Product" award at Printed Electronics Europe

04/27/2016  Cartamundi, imec and Holst Centre (set up by imec and TNO) are proud to announce to have just won the "Best Product" - Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi's playing cards.

NREL finds nanotube semiconductors well-suited for PV systems

04/27/2016  Researchers at the Energy Department's National Renewable Energy Laboratory (NREL) discovered single-walled carbon nanotube semiconductors could be favorable for photovoltaic systems because they can potentially convert sunlight to electricity or fuels without losing much energy.

Leti's CoolCube 3D Transistor Stacking Improves with Qualcomm Help

04/27/2016  Collaborating to build out design to fabrication ecosystem.

Latest advancements in sensor technology examined at SEMI European MEMS Summit

04/25/2016  SEMI today announced the second annual edition of the SEMI European MEMS Summit, dedicated to MEMS and sensors, to be held on September 15-16.

MagnaChip begins delivery of e-Compass sensors in China

04/25/2016  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it is now shipping its e-Compass sensor (MXG2320) in China to a major smartphone manufacturer that is targeting mobile markets in China and India.

IoT: Powering small devices

04/22/2016  Are the power solutions the IoT needs arriving quickly enough?

ams breaks ground on NY wafer fab

04/20/2016  ams AG (SIX: AMS) today took a step forward in its long-term strategy of increasing manufacturing capacity for its high-performance sensors and sensor solution integrated circuits (ICs), holding a groundbreaking event at the site of its new wafer fabrication plant in Utica, New York.




TWITTER


WEBCASTS



Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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