Applications

APPLICATIONS ARTICLES



IEEE unveils next lifecycle phase of the IRDS to drive computing industry beyond Moore’s Law

03/31/2017  Series of nine white papers mark milestone effort for strategic initiative that identifies challenges and solutions to help guide future roadmaps.

Leti marks 50th anniversary with events and workshops in France, Japan, Taiwan, and the U.S.

03/30/2017  Leti, a research institute of CEA Tech, is marking its 50th anniversary this year during industry events and workshops in Grenoble, Tokyo, and Taipei and at both SEMICON West and IEDM 2017 in San Francisco.

ams launches AS7225 tunable-white lighting smart system sensor

03/28/2017  ams today announced the AS7225 tunable-white lighting smart system sensor, further broadening the solution set for sensor-integrated tunable-white lighting solutions.

Imec to honor Samsung's Dr. Kinam Kim with "Lifetime of Innovation Award"

03/27/2017  The selection recognizes Dr. Kim's leadership and strategic vision, as well as his undeniable impact in the semiconductor industries.

Researchers make flexible glass for tiny medical devices

03/24/2017  Glass can bend over and over again on a nanoscale.

Mentor Graphics Team Receives the Harvey Rosten Award for Thermal Heatsink Optimization Methodology

03/23/2017  Mentor Graphics Corporation today announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics.

Linde Invests Over EUR 110M in China to Strengthen Position as Supplier of Choice for Electronics Manufacturers

03/22/2017  Gases and engineering company The Linde Group, through its electronics gases joint venture in China, Linde LienHwa, is expanding its commitment to China and the Asia Pacific region through investments of over EUR 110 million.

SiPs simplify wireless IoT design

03/20/2017  It takes a range of skills to create a successful business in the Internet of Things space, where chips sell for a few dollars and competition is intense. Circuit design and software support for multiple wireless standards must combine with manufacturing capabilities.

STMicroelectronics collaborates with iFLYTEK for Chinese voice-recognition cloud services

03/15/2017  STMicroelectronics, a global semiconductor and a top MEMS supplier, and iFLYTEK, a voice-recognition cloud service provider in China, have introduced the market's first IoT development platform that enables voice-recognition cloud services in Chinese.

Imec, Holst Centre present a digital receiver excelling in energy efficiency and small size for Bluetooth 5

03/09/2017  Imec and Holst Centre (initiated by imec and TNO) have developed a novel phase-tracking receiver bringing further power and cost reduction for the next generations of Bluetooth and IEEE802.15.4 radio chips.

Polymer-coated silicon nanosheets as an alternative to graphene

03/08/2017  Researchers at the Technical University of Munich (TUM) have, for the first time ever, produced a composite material combining silicon nanosheets and a polymer that is both UV-resistant and easy to process.

Eutelsat, ST announce low-cost, low-power System-on-Chip for interactive satellite terminals

03/08/2017  ST and Eutelsat complete development of chip for Eutelsat's next-generation SmartLNB.

Reducing conducting thin film surface roughness for electronics

03/07/2017  In a significant advance, particularly within the microelectronics realm, University of Massachusetts Amherst engineers have established electrical surface treatment of conducting thin films as a physical processing method to reduce surface roughness.

Mentor Graphics Launches Unique Xpedition PCB Systems Vibration and Acceleration Simulation Solution

03/06/2017  Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.

Sweat patch mops up real-time performance monitor

03/06/2017  In 2016, the Nano-Bio Manufacturing Consortium (NBMC), a FlexTech-managed consortium focused on human performance monitoring technology, and funded in part by the Air Force Research Laboratories (AFRL), contracted with a broad-based team of industry and academia researchers, to develop a wearable monitor based on sweat analysis.

New optical nanosensor improves brain mapping accuracy, opens way for more applications

03/03/2017  Potassium-sensitive fluorescence-imaging method shines light on chemical activity within the brain.

Semiconductor manufacturing's next big thing at ASMC 2017

03/02/2017  Manufacturers, suppliers and academia gather to understand the road ahead.

Global MEMS manufacturer selects ULVAC Technologies' plasma ashing system

03/01/2017  ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

Nano 'sandwich' offers unique properties

02/27/2017  Rice University researchers simulate two-dimensional hybrids for optoelectronics.

STMicroelectronics, DSP Group, and Sensory create keyword-smart microphone for voice-controlled devices

02/27/2017  Ultra-low power voice processing and MEMS microphone circuitry enables sound detection and keyword recognition in a miniaturized single package.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS