Applications

APPLICATIONS ARTICLES



A KAIST research team develops the first flexible phase-change random access memory

06/15/2015  Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

Researchers grind nanotubes to get nanoribbons

06/15/2015  A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

MEMSIC's SmartSensing tech delivers highest performance in inertial measurement systems

06/11/2015  MEMSIC announced the launch of its latest addition, the INS380, to its portfolio of Inertial Systems enabled with SmartSensing technology targeted to a broad range of precision motion sensing applications.

ASCENT project offers unparalleled access to European nanoelectronics infrastructure

06/11/2015  Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).

Leti Workshop on June 26 to cover latest R&D successes in innovative memory technologies

06/10/2015  CEA-Leti is hosting its seventh workshop on innovative memory technologies following the 17th annual LetiDays Grenoble, June 24-25, on the Minatec campus.

MIPT physicists develop ultrasensitive nanomechanical biosensor

06/10/2015  t can analyze the chemical composition of substances and detect biological objects, such as viral disease markers, which appear when the immune system responds to incurable or hard-to-cure diseases, including HIV, hepatitis, herpes, and many others.

Slip sliding away: Graphene and diamonds prove a slippery combination

06/10/2015  Scientists at the U.S. Department of Energy's Argonne National Laboratory have found a way to use tiny diamonds and graphene to give friction the slip, creating a new material combination that demonstrates the rare phenomenon of "superlubricity."

MEMS suppliers ride automotive safety wave

06/09/2015  Suppliers of MEMS-based devices rode a safety sensing wave in 2014 to reach record turnover in automotive applications, according to analysis from IHS.

Imagination and TSMC collaborate on advanced IoT IP platforms

06/08/2015  Imagination Technologies (IMG.L) and TSMC announce a collaboration to develop a series of advanced IP subsystems for the Internet of Things (IoT) to accelerate time to market and simplify the design process.

Technology for tomorrow’s market opportunities and challenges at LetiDays Grenoble

05/29/2015  The 17th annual LetiDays Grenoble on June 24-25 will expand the conversation with presentations about Internet of Things-augmented mobility, which is revolutionizing the way we interact with appliances, infrastructure and countless common objects that are part of our daily lives.

Tablet shipments lose momentum; Total PC unit forecast downgraded

05/29/2015  IC Insights has downgraded its forecast for the overall personal computing market, including much lower growth in tablets and continued weakness in standard PCs.

Growing in maturity, the MEMS industry is getting its second wind

05/19/2015  In 2014, the MEMS sector represented an $11.1B business for Si-based devices. According to Yole Développement (Yole) latest MEMS report “Status of the MEMS Industry”, the MEMS industry is preparing to exceed $20B by 2020.

SEMICON West 2015 focuses on the most critical issues in semiconductor manufacturing

05/15/2015  SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing.

Janusz Bryzek joins MEMS Industry Group to lead new TSensors division

05/14/2015  MEMS Industry Group (MIG), the trade association advancing micro-electromechanical systems (MEMS) and sensors across global markets, today announced the creation of a new TSensors division headed by TSensors Summit, Inc.

Freescale speeds the creation of sensor applications for a secure IoT

05/14/2015  Freescale Semiconductor today introduced its Intelligent Sensing Framework (ISF) 2.1, which now includes integration with Freescale’s Processor Expert tool to help create, configure, and generate embedded sensor-based applications for Freescale microcontrollers (MCUs).

Moore's Law to keep on 28nm

05/13/2015  Scaling is now bifurcating - some scaling on with 28/22nm, while other push below 14nm.

Intel, eASIC collaborate on customized Intel-based solutions for the cloud

05/12/2015  Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the "cloud."

Samsung announces ARTIK platform to accelerate Internet of Things development

05/12/2015  Samsung Electronics Co., Ltd. today announced the Samsung ARTIK platform to allow faster, simpler development of new enterprise, industrial and consumer applications for the Internet of Things (IoT).

IBM's silicon photonics technology ready to speed up cloud and Big Data applications

05/12/2015  IBM today announced a significant milestone in the development of silicon photonics technology, which enables silicon chips to use pulses of light instead of electrical signals over wires to move data at rapid speeds and longer distances in future computing systems.

New device could greatly improve speech and image recognition

05/12/2015  Researchers have demonstrated pattern recognition using a magnonic holographic memory device.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Advanced Packaging

September 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
http://www.semiconjapan.org/en/
December 16, 2015 - December 18, 2015