Applications

APPLICATIONS ARTICLES



A universally profitable renewable energy business model

03/08/2018  The solar energy sector shined in a global renewable energy market that maintained steady growth last year despite the United States’ shocking withdrawal from the Paris Agreement. Solar panel costs dropped to an all-time low, driving global demand that surpassed the 100GW mark for the first time on the strength of standout annual 26 percent growth.

New approach to measuring stickiness could aid micro-device design

03/08/2018  Brown University engineers have devised a new method of measuring the stickiness of micro-scale surfaces. The technique, described in Proceedings of the Royal Society A, could be useful in designing and building micro-electro-mechanical systems (MEMS), devices with microscopic moving parts.

Palma Ceia closes Series B funding

03/07/2018  Palma Ceia SemiDesign (PCS), a fabless semiconductor company offering wireless chips, modules, systems and IP supporting emerging Machine-to-Machine (M2M) WiFi and cellular standards for the Internet of Things (IoT), today announced it has completed a Series B round of financing.

Materials 'sandwich' breaks barrier for solar cell efficiency

03/05/2018  NYU Tandon Professor André D. Taylor's research team combines materials and borrows lessons from nature to build a better organic solar cell.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

TDK to acquire Chirp Microsystems

03/02/2018  TDK Corporation announced that it has reached an agreement with Chirp Microsystems, Inc., a developer of high-performance ultrasonic sensing, in which Chirp becomes a wholly owned subsidiary of TDK.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Semiconductor Manufacturing Electronics Corporation formally signed a joint venture agreement

03/01/2018  SMIC, Shaoxing Government, and Shengyang Group together announced today the founding of the Semiconductor Manufacturing Electronics (Shaoxing) Corporation (planned) with joint capital contributions. T

A marriage of light-manipulation technologies

03/01/2018  Researchers have, for the first time, integrated two technologies widely used in applications such as optical communications, bio-imaging and Light Detection and Ranging (LIDAR) systems that scan the surroundings of self-driving cars and trucks.

Testing: The key to AI-enabled autonomous driving

02/28/2018  Since 2010, 474 companies have poured $51 billion into developing products enabled by artificial intelligence (AI), with the bulk of these investments targeting autonomous driving and in-vehicle experiences, according to the McKinsey reports.

STMicroelectronics and Sigfox cooperate to connect billions of devices

02/26/2018  STMicroelectronics and Sigfox have announced a collaboration agreement to support and accelerate the growing demand for connected devices for a broad range of applications, including supply-chain management, building and equipment maintenance, water and gas metering, security, transportation, agriculture, mining and home automation.

Microsemi's new RF modules speed time to market for implantable medical device designers

02/23/2018  Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the ZL70123, a new radio frequency (RF) base station module for implantable devices utilizing the Medical Implant Communication Service (MICS) RF band.

UBC engineers advance the capability of wearable tech

02/23/2018  A new low-cost ultra-stretchable sensor can do more with less.

Worldwide sales of smartphones recorded first ever decline during the fourth quarter of 2017

02/22/2018  Global sales of smartphones to end users totaled nearly 408 million units in the fourth quarter of 2017, a 5.6 percent decline over the fourth quarter of 2016, according to Gartner, Inc.

SEMI showcases achievements in flexible hybrid electronics, MEMS and sensors at 2018FLEX and MSTC conferences

02/22/2018  Technology trail-blazers explore business insights, new technologies, integration strategies at co-located events, held February 12-15, 2018 in Monterey, CA.

Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

Integrated circuit technology advances continue to amaze

02/21/2018  Despite increasing costs of development, IC manufacturers are still making great strides.

Researchers invent light-emitting nanoantennas

02/21/2018  Nanoscale light sources and nanoantennas already found a wide range of applications in several areas, such as ultra compact pixels, optical detection or telecommunications.

'Memtransistor' brings world closer to brain-like computing

02/21/2018  Combined memristor and transistor can process information and store memory with one device.

Better together: Silicon qubits plus light add up to new quantum computing capability

02/15/2018  A silicon-based quantum computing device could be closer than ever due to a new experimental device that demonstrates the potential to use light as a messenger to connect quantum bits of information -- known as qubits -- that are not immediately adjacent to each other. The feat is a step toward making quantum computing devices from silicon, the same material used in today's smartphones and computers.




TWITTER


WEBCASTS



Enabling EUV and the patterning roadmap

Tuesday, June 5, 2018 at 1:00 p.m. ET

EUV lithography has steadily been gaining momentum in recent years and edges closer and closer to insertion in manufacturing. While considerable progress has been made and the first uses of EUV appear imminent, there remain some difficulties that will challenge the rate and degree to which EUV can be employed. This talk will aim to explore the patterning-related challenges that remain, summarize some of the ongoing efforts to tackle these challenges, and give an outlook towards the future.

Sponsored By:

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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VIDEOS