Applications

APPLICATIONS ARTICLES



Picture this: Graphene brings 3-D holograms clearer and closer

04/28/2015  From mobile phones and computers to television, cinema and wearable devices, the display of full color, wide-angle, 3D holographic images is moving ever closer to fruition, thanks to international research featuring Griffith University.

Surface matters: Huge reduction of heat conduction observed in flat silicon channels

04/23/2015  A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.

From metal to insulator and back again

04/23/2015  New work from Carnegie's Russell Hemley and Ivan Naumov hones in on the physics underlying the recently discovered fact that some metals stop being metallic under pressure.

Communications, computer systems drive IC sales across all regions

04/23/2015  Automotive systems forecast to remain a major application in Europe.

How emerging IoT impacts the semiconductor sector

04/23/2015  In this 50th year anniversary of Moore’s Law, the steady scaling of silicon chips’ cost and performance that has so changed our world over the last half century is now poised to change it even further through the Internet of Things.

ITRS 2.0: Top-Down System Integration

04/22/2015  ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

MagnaChip to offer diversified products for Internet of Things applications

04/20/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market.

SOI: Revolutionizing RF and expanding in to new frontiers

04/17/2015  SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

Engineer improves rechargeable batteries with MoS2 nano 'sandwich'

04/17/2015  The key to better cellphones and other rechargeable electronics may be in tiny "sandwiches" made of nanosheets, according to mechanical engineering research from Kansas State University.

Solid State Watch: April 10-16, 2015

04/17/2015  SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne enters ECD lab partnership with Shanghai Sinyang

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

Solution-grown nanowires make the best lasers

04/14/2015  Take a material that is a focus of interest in the quest for advanced solar cells. Discover a "freshman chemistry level" technique for growing that material into high-efficiency, ultra-small lasers. The result, disclosed Monday, April 13 in Nature Materials, is a shortcut to lasers that are extremely efficient and able to create many colors of light.

New understanding of electromagnetism could enable 'antennas on a chip'

04/10/2015  A team of researchers from the University of Cambridge have unravelled one of the mysteries of electromagnetism, which could enable the design of antennas small enough to be integrated into an electronic chip. These ultra-small antennas - the so-called 'last frontier' of semiconductor design - would be a massive leap forward for wireless communications.

Sensor shipments strengthen but falling prices cut sales growth

04/10/2015  Sensor shipments are getting a big boost from the spread of embedded measurement functions for automated intelligent controls in systems and new high-volume applications, but sales growth is being pulled down significantly by price erosion in this once high-flying semiconductor marketplace.

Solid State Watch: April 3-9, 2015

04/10/2015  SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC certifies Synopsys design tools for 16nm finFET plus production

MEMS shipments to reach 43.3B units by 2018, says Semico Research

04/09/2015  The market for MEMS has been growing at a fast rate. But growth will come as a result of a wide variety of emerging MEMS and will be driven by the growth of the Internet of Things (IoT), where MEMS devices will replace conventional sensors, and by the introduction of new sensor technologies.

Standing Egg chooses MIPS CPUs for sensor hubs targeting mobile, IoT, wearables and automotive

04/07/2015  Imagination Technologies announces that South Korea based MEMS sensor development company Standing Egg has licensed Imagination's MIPS Warrior M-class CPU for use in its next-generation sensor hubs targeting an expanding range of products including mobile devices, IoT, wearables, and automotive.

Better sensors for medical imaging, contraband detection

04/07/2015  MIT researchers have developed a new, ultrasensitive magnetic-field detector that is 1,000 times more energy-efficient than its predecessors.

Supplier Hub answers the needs of a changing semiconductor industry

04/02/2015  Supplier Hub answers the needs of a changing semiconductor industry.

Light-powered gyroscope is world's smallest

04/01/2015  A pair of light waves - one zipping clockwise the other counterclockwise around a microscopic track - may hold the key to creating the world's smallest gyroscope: one a fraction of the width of a human hair.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Interconnects

July 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015