Biosensors will be inexpensive, do more, go everywhere

02/07/2018  University of Cincinnati engineering professor Jason Heikenfeld maps the progress and untapped potential of wearable sensors in a critical review of the research field.

MACOM and STMicroelectronics to bring GaN on silicon to mainstream RF markets and applications

02/07/2018  MACOM Technology Solutions Holdings, Inc. and STMicroelectronics announced an agreement to develop GaN (Gallium Nitride) on Silicon wafers to be manufactured by ST for MACOM's use across an array of RF applications.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.

Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs

02/06/2018  Texas Instruments (TI) today introduced the industry's smallest operational amplifier (op amp) and low-power comparators at 0.64 mm2.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

IHS Markit identifies top trends driving the Internet of Things in 2018 and beyond

02/02/2018  Driven by the need for intelligent connected devices in industrial and commercial applications, the number of connected Internet of Things (IoT) devices globally will grow to more than 31 billion in 2018, according to new analysis from business information provider IHS Markit

Mobile system-on-chip designs, embedded processing lift MPU market

02/01/2018  Though accounting for less than half of total MPU sales, data-handling cellphones, tablets, and MPUs for embedded processing applications to keep MPU market active through 2022.

Smart manufacturing fuels digital transformation: Takeaways from SEMI Member Forum

02/01/2018  Driven by emerging technologies like Artificial Intelligence (AI), Internet of Things (IoT), machine learning and big data, the digital transformation has become an irreversible trend for the electronics manufacturing industry. The global market for smart manufacturing and smart factory technologies is expected to reach US$250 billion in 2018.

Engineers design artificial synapse for "brain-on-a-chip" hardware

02/01/2018  Design is major stepping stone toward portable artificial-intelligence devices.

ST technologies help Neonode add touch interaction to any object, surface, or space

01/31/2018  Silicon chips from STMicroelectronics have enabled new zForce AIR touch-sensing modules from Neonode, the optical sensor technology company.

Leti develops lens-free, point-of-care system for diagnosing spinal meningitis

01/30/2018  Leti, a research institute at CEA Tech, has invented a lens-free microscope technology that provides point-of-care diagnosis for spinal meningitis. Outlined in a paper presented at Photonics West, the new technology provides immediate results and eliminates errors in counting white blood cells (leukocytes) in cerebrospinal fluid, which is required to diagnose the infection.

Researchers boost efficiency and stability of optical rectennas

01/29/2018  The research team that announced the first optical rectenna in 2015 is now reporting a two-fold efficiency improvement in the devices — and a switch to air-stable diode materials. The improvements could allow the rectennas – which convert electromagnetic fields at optical frequencies directly to electrical current – to operate low-power devices such as temperature sensor

Quantum race accelerates development of silicon quantum chip

01/26/2018  The worldwide race to create more, better and reliable quantum processors is progressing fast, as a team of TU Delft scientists led by Professor Vandersypen has realised yet again. In a neck-and-neck race with their competitors, they showed that quantum information of an electron spin can be transported to a photon, in a silicon quantum chip.

New sensor for measuring electric field strength

01/26/2018  TU Wien has developed a sensor for measuring the strength of electric fields, which is much smaller, simpler and less prone to distortion than comparable devices.

Imec demonstrates shortwave infrared range hyperspectral imaging camera

01/25/2018  Imec today announced that it will demonstrate its very first shortwave infrared (SWIR) range hyperspectral imaging camera at next week’s SPIE Photonics West in San Francisco.

Growth of IoT to drive the global reset IC market

01/23/2018  Technavio market research analysts forecast the global reset IC market to grow at a CAGR of close to 12% during the forecast period, according to their latest report.

Researchers use sound waves to advance optical communication

01/23/2018  Illinois researchers have demonstrated that sound waves can be used to produce ultraminiature optical diodes that are tiny enough to fit onto a computer chip.

Ultra-thin memory storage device paves way for more powerful computing

01/18/2018  A team of electrical engineers at The University of Texas at Austin, in collaboration with Peking University scientists, has developed the thinnest memory storage device with dense memory capacity, paving the way for faster, smaller and smarter computer chips for everything from consumer electronics to big data to brain-inspired computing.

2018FLEX highlights opportunities, advances in flexible hybrid electronics

01/18/2018  2018FLEX, the Flexible Hybrid Electronics (FHE) Conference and Exhibition, will bring together more than 600 experts from around the world for business-critical insights and the latest technology in both flexible electronics and MEMS and sensors.

Worldwide PC shipments declined 2% in 4Q17 and 2.8% for the year

01/12/2018  Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Learn the Basics of Power Amplifier and Front End Module Measurements

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