Applications

APPLICATIONS ARTICLES



NXP announces production of security chips in its US manufacturing facilities

08/04/2017  NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

Knowles appoints Dr. Cheryl Shavers to Board of Directors

08/04/2017  Knowles Corporation (NYSE: KN) today announced the appointment of Dr. Cheryl Shavers to the Board of Directors. Her appointment is effective August 1, 2017 and expands the Board to 9 directors, 8 of whom are independent.

Alkaline soil, sensible sensor

08/02/2017  Field sensor quickly, accurately identifies soil issues.

Analog Devices joins University of Michigan’s Mcity Initiative for advancing connected and autonomous vehicles

07/31/2017  Analog Devices, Inc. (ADI) today announced that it has become an affiliate member of Mcity at the University of Michigan.

Universities obtain new funding from nano-bio manufacturing consortium

07/28/2017  Three leading U.S. universities are the latest recipients of funding from the Nano-Bio Manufacturing Consortium (NBMC), operated by SEMI.

Ultrathin device harvests electricity from human motion

07/24/2017  A new electrochemical energy harvesting device developed at Vanderbilt University can generate electrical current from the full range of human motions and is thin enough to embed in clothing.

Gartner reports worldwide PC shipments declined 4.3% in second quarter of 2017

07/21/2017  Worldwide PC shipments totaled 61.1 million units in the second quarter of 2017, a 4.3 percent decline from the second quarter of 2016, according to preliminary results by Gartner, Inc.

MagnaChip and ELAN Microelectronics announce partnership

07/17/2017  MagnaChip Semiconductor Corporation announced today it was selected as a foundry partner by ELAN Microelectronics to manufacture the world's first fingerprint sensor IC-based smartcard.

Breathable, wearable electronics on skin for long-term health monitoring

07/17/2017  A hypoallergenic electronic sensor can be worn on the skin continuously for a week without discomfort, and is so light and thin that users forget they even have it on, says a Japanese group of scientists.

Hamburg researchers develop new transistor concept

07/17/2017  Transistors, as used in billions on every computer chip, are nowadays based on semiconductor-type materials, usually silicon. As the demands for computer chips in laptops, tablets and smartphones continue to rise, new possibilities are being sought out to fabricate them inexpensively, energy-saving and flexibly.

Researchers develop a novel type of optical fiber that preserves the properties of light

07/17/2017  Scientists from the Moscow Institute of Physics and Technology (MIPT) and the Kotelnikov Institute of Radio Engineering and Electronics (IRE) of the Russian Academy of Sciences (RAS), in collaboration with their colleagues from Finland, have developed a new type of optical fiber that has an extremely large core diameter and preserves the coherent properties of light.

Digital revolution: The path to innovation is opened by disruption

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.

AI and collaboration key to future success

07/12/2017  Keynote speakers Terry Higashi of Tokyo Electron Ltd. and Tom Caulfield of GlobalFoundries took the stage at the Yerba Buena Theater Tuesday morning to predict major changes in the goals and operations of the semiconductor industry.

Exploring smart sensor explosive growth

07/11/2017  MEMS & Sensors Industry Group (MSIG), the industry association advancing MEMS and sensors across global markets, is hosting a TechXPOT program today, titled “What’s Next for MEMS & Sensors: Big Growth of Disruptive Applications for Smart Sensing Changes the Business.”

Presto Engineering announces management expansion

06/29/2017  Presto Engineering, Inc., an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announces a management expansion: Cedric Mayor has been named Chief Operating Officer (COO) and Martin Kingdon has been appointed VP Sales.

Nonstop CMOS image sensor sales records seen through 2021

06/28/2017  Embedded imaging applications in cars, security, machine vision, medical, virtual reality, wearable systems, and other new uses will offset slow growth in camera phones, says O-S-D Report.

It’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

ULVAC Technologies opens California office

06/20/2017  ULVAC Technologies, Inc., a supplier of production systems, instrumentation and vacuum pumps for technology industries, has opened an office in Santa Clara, California.

Exploring smart sensor explosive growth at SEMICON West 2017

06/20/2017  MEMS & Sensors Industry Group announces programs and speakers for SEMICON West 2017 (July 11-13).

What TechInsights analysts are watching in 2017

06/19/2017  TechInsights analysts share their view on where technology is going, how it’s changing, and what new developments are emerging.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS