Toward tiny, solar-powered sensors

06/24/2015  Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells.

imec and Holst Centre present a gas sensing platform for intuitive IoT applications

06/23/2015  Imec and Holst Centre have developed a small NO2 sensor featuring a low power consumption in the mW range.

Breaking Down Power Management Verification

06/22/2015  During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.

MEMS applications take the stage in the first edition of the European MEMS Summit

06/22/2015  The first edition of this Summit will take place on September 17-18, 2015 in Milan, Italy and its theme will be “Sensing the Planet, MEMS for Life.”

Bosch selects Rudolph for semiconductor inspection solutions

06/22/2015  Rudolph Technologies, Inc. announced today that the MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30 Inspection System for various steps in the front- and back-end fabrication processes of micro electrical mechanical systems (MEMS) devices.

3DIC Technology Drivers and Roadmaps

06/22/2015  Circuit performance and silicon area improvements seen in new die stacks.

Organ-on-a-chip technology helps researchers better understand pregnancy

06/18/2015  National Institutes of Health (NIH) researchers and their colleagues have developed a "placenta-on-a-chip" to study the inner workings of the human placenta and its role in pregnancy.

Researchers create transparent, stretchable conductors using nano-accordion structure

06/18/2015  Researchers from North Carolina State University have created stretchable, transparent conductors that work because of the structures' "nano-accordion" design. The conductors could be used in a wide variety of applications, such as flexible electronics, stretchable displays or wearable sensors.

Fairchild launches MEMS product line

06/16/2015  Fairchild, a supplier of high-performance semiconductor solutions, today launched the FIS1100 6-axis MEMS Inertial Measurement Unit (IMU), the company’s first MEMS product stemming from its strategic investments in MEMS and motion tracking.

Renesas Electronics announces Synergy Platform for IoT

06/15/2015  Renesas Electronics, a supplier of advanced semiconductor solutions, today announced the Renesas Synergy Platform.

A KAIST research team develops the first flexible phase-change random access memory

06/15/2015  Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

Researchers grind nanotubes to get nanoribbons

06/15/2015  A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

MEMSIC's SmartSensing tech delivers highest performance in inertial measurement systems

06/11/2015  MEMSIC announced the launch of its latest addition, the INS380, to its portfolio of Inertial Systems enabled with SmartSensing technology targeted to a broad range of precision motion sensing applications.

ASCENT project offers unparalleled access to European nanoelectronics infrastructure

06/11/2015  Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).

Leti Workshop on June 26 to cover latest R&D successes in innovative memory technologies

06/10/2015  CEA-Leti is hosting its seventh workshop on innovative memory technologies following the 17th annual LetiDays Grenoble, June 24-25, on the Minatec campus.

MIPT physicists develop ultrasensitive nanomechanical biosensor

06/10/2015  t can analyze the chemical composition of substances and detect biological objects, such as viral disease markers, which appear when the immune system responds to incurable or hard-to-cure diseases, including HIV, hepatitis, herpes, and many others.

Slip sliding away: Graphene and diamonds prove a slippery combination

06/10/2015  Scientists at the U.S. Department of Energy's Argonne National Laboratory have found a way to use tiny diamonds and graphene to give friction the slip, creating a new material combination that demonstrates the rare phenomenon of "superlubricity."

MEMS suppliers ride automotive safety wave

06/09/2015  Suppliers of MEMS-based devices rode a safety sensing wave in 2014 to reach record turnover in automotive applications, according to analysis from IHS.

Imagination and TSMC collaborate on advanced IoT IP platforms

06/08/2015  Imagination Technologies (IMG.L) and TSMC announce a collaboration to develop a series of advanced IP subsystems for the Internet of Things (IoT) to accelerate time to market and simplify the design process.

Tackling Parameter Extraction for 16nm and Below

06/08/2015  There are four reasons why parasitic parameter extraction is getting a lot harder for 16nm and below technology nodes: 1) 3D device geometries, such as the finFET, which result in more complex electrical fields around the device 2) multi-patterning, which causes increased variability; 3) a demand for 10X tighter levels of accuracy, and 4) increased levels of secrecy from foundries and designers.




Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers



September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:


September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Trends in Flexible and Printed Electronics

October 2015 (Date and time TBD)

Printed electronics are at a pivotal moment. There are not only tremendous opportunities for innovation and growth in new verticals and industries, but a new way of thinking about how electronics are made, combining techniques and materials used by printed electronics with those of 3D printing. Presenters will review printed electronics and discuss future directions, from smart labels and wearables, to trends and technologies that enable the printing of IoT devices with embedded sensors, transistors, displays, batteries and memory.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015