Applications

APPLICATIONS ARTICLES



System Plus analyzes the world's smallest microbolometer-based thermal imaging camera core released by FLIR

12/11/2014  Initially focused on the military, uncooled thermal camera sales have grown significantly due to substantial cost reduction of micro bolometers and growing adoption in commercial markets, including thermography, automotive and surveillance applications.

OCEASOFT harnesses SIGFOX IoT network in Cobalt S3 sensor family for cloud connectivity

12/09/2014  Industrial Internet of Things sensor-monitoring solution opens new vistas in pollution and environmental applications, other remote-sensing sectors.

Mentor Graphics Announces New Verification IP for PCIe 4.0

12/08/2014  Mentor Graphics Corp. announced the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP, which reduces testbench assembly time for ASIC and FPGA design verification by a factor of up to 10X.

Silicon Image launches new subsidiary to focus on Internet of Everything services

12/04/2014  Silicon Image, a provider of multimedia connectivity solutions and services, announced that Qualcomm Technologies, Inc. has made a $7 million strategic investment in Silicon Image’s new subsidiary, Qterics, for a 7% ownership interest.

Imec and Holst Centre announce IC and open hardware development kit for personal health monitoring

12/04/2014  At next week’s mHealth Summit 2014, held Dec. 7-11 in Washington, D.C., nanoelectronics research center imec and Holst Centre will showcase at their booth a development kit based on an open hardware platform using a highly integrated multi-sensor data acquisition chip.

What to expect from the 3rd Edition of the European 3D TSV Summit

12/04/2014  Interview with SEMI Europe’s Yann Guillou gives attendees a preview of the event.

Wireless nanorod-nanotube film enables light stimulation of blind retina

12/03/2014  Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.

AXSEM and SIGFOX announce ‘ultra-low-power’ System-on-Chip solution

12/03/2014  AXSEM, a developer of lowest-power radio microcontrollers, and SIGFOX, a developer of cost-effective, energy-efficient Internet of Things connectivity, today announced that AXSEM’s system-on-chip (SoC) with an AX8052 microcontroller has been certified SIGFOX Ready for two-way connectivity.

Imec partners with Huawei on high-bandwidth optical data link technology

12/03/2014  Nanoelectronics research center imec and global ICT leader Huawei announced today that they have taken a further step in their strategic partnership focusing on optical data link technology.

Soitec announces new world record for solar cell efficiency at 46%

12/03/2014  The record multi-junction solar cell converts 46 % of the solar light into electrical energy.

Applied Materials Introduces New Hardmask Process, Saphira

11/24/2014  A new hardmask material, called Saphira, and accompanying processes was introduced Applied Materials. The material, which is transparent and offers high selectivity and good mechanical strength, could reduce manufacturing costs by 35% per module.

Physicists and chemists work to improve digital memory technology

11/24/2014  The improvements in random access memory that have driven many advances of the digital age owe much to the innovative application of physics and chemistry at the atomic scale.

UO-industry collaboration points to improved nanomaterials

11/21/2014  A potential path to identify imperfections and improve the quality of nanomaterials for use in next-generation solar cells has emerged from a collaboration of University of Oregon and industry researchers.

X-FAB MEMS Foundry wins “Foundry of the Year” Award at MEMS Executive Congress

11/20/2014  X-FAB MEMS Foundry today announced it received the “MEMS Foundry of the Year” award at the Best in MEMS & Sensors Innovation Awards ceremony, as part of the MEMS Industry Group’s 10th annual MEMS Executive Congress held in Scottsdale, Arizona last week.

NFC IGZO TFT for Game Cards

11/20/2014  Holst Centre, imec, and Cartamundi work on flexible Near Field Communication tags embedded in paper cards.

SCHOTT advances MEMS technology by using HermeS glass wafers with through glass vias

11/19/2014  The international technology group SCHOTT is expanding its HermeS wafers with hermetically sealed, solid through glass vias (TGV) into MEMS applications.

Holst Centre, imec and CARTAMUNDI join forces to create the near field communication chip of the future

11/19/2014  Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags.

STMicroelectronics, AKM, InvenSense and Bosch share 75% of the consume inertial combo market

11/19/2014  Combo sensors continue their growth in a market expected to reach US$ 1.4 billion in 2019 overcoming discrete sensors.

Carbonics aims for improved power consumption and performance with new carbon nanomaterials

11/19/2014  Startup is backed by $5.5M investment, leveraging carbon research conducted at UCLA and USC.

Notebook PC shipments rise year over year as tablet PCs decline

11/18/2014  Notebook PC growth was primarily driven by the developed regions of North America and Western Europe, which increased year-over-year shipments by more than 20 percent in the third quarter.




FINANCIALS



TECHNOLOGY PAPERS



How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON China 2015
Shanghai
http://www.semiconchina.org
March 17, 2015 - March 19, 2015
LED Taiwan 2015
Taipei, Taiwan
http://www.ledtaiwan.org/en/
March 25, 2015 - March 28, 2015
SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015