Applications

APPLICATIONS ARTICLES



Supplier Hub answers the needs of a changing semiconductor industry

04/02/2015  Supplier Hub answers the needs of a changing semiconductor industry.

Light-powered gyroscope is world's smallest

04/01/2015  A pair of light waves - one zipping clockwise the other counterclockwise around a microscopic track - may hold the key to creating the world's smallest gyroscope: one a fraction of the width of a human hair.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

Imec demonstrates 50GHz Ge waveguide electro-absorption modulator

03/25/2015  At this week’s OFC 2015, the largest global conference and exposition for optical communications, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz.

Optoelectronics, sensors/actuators, and discretes growth accelerates

03/25/2015  After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.

Apple dictates the ranking of top 10 MEMS manufacturers in 2014

03/25/2015  Apple boosted Bosch’s MEMS revenue in 2014 again as Bosch is the sole supplier of the pressure sensors added to the iPhone 6 and 6+.

2014 top MEMS players ranking: Rising of the first MEMS titan

03/24/2015  With an impressive 20 percent growth in MEMS revenue compared to 2013, and sales revenues of more than $1.2B, Robert Bosch GmbH is the clear #1.

Silicon Labs and Digi-Key challenge developer innovation with "Your IoT" design competition

03/24/2015  Silicon Labs and Digi-Key today announced an IoT design contest for pioneering developers who want to create connected "things" that will help make the world a smarter, more connected and energy-friendly place.

NC State researchers create 'nanofiber gusher'

03/19/2015  Engineers and researchers at North Carolina State University and one of its start-up companies have now reported a method that can produce unprecedented amounts of polymer nanofibers, which have potential applications in filtration, batteries and cell scaffolding.

Small powerful systems give rise to medical semiconductor sales

03/19/2015  Market for medical semiconductors seen rising to $8.2 billion in 2018.

Rice fine-tunes quantum dots from coal

03/18/2015  Rice University scientists gain control of electronic, fluorescent properties of coal-based graphene.

High tech start-ups to connect with investors at SEMICON Europa 2015

03/17/2015  SEMICON Europa 2015 (October 6-8) will prominently feature second edition of this very successful program connecting early-stage companies with strategic investors, venture capitalists and other relevant stakeholders.

Light sensors market to grow 16 percent between 2013 and 2016

03/13/2015  Samsung, Apple and Chinese OEMs will drive revenue in the light sensor market to grow 16 percent between 2013 and 2016, according to a new report released today from IHS Inc.

New technology may double radio frequency data capacity

03/13/2015  Columbia engineers invent nanoscale IC that enables simultaneous transmission and reception at the same frequency in a wireless radio.

Engineers create chameleon-like artificial 'skin' that shifts color on demand

03/12/2015  Borrowing a trick from nature, engineers from the University of California at Berkeley have created an incredibly thin, chameleon-like material that can be made to change color -- on demand -- by simply applying a minute amount of force.

11 IC product categories to exceed total IC market growth in 2015

03/12/2015  IC Insights’ March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.

MicroWatt Chips shown at ISSCC

03/05/2015  With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just concluded 2015 International Solid State Circuits Conference (ISSCC) in San Francisco to be on ultra-low-power circuits that run on mere microWatts (µW).

Time to “shift left” in chip design and verification, Synopsys founder says

03/04/2015  Taking “Smart Design from Silicon to Software” as his official theme, Aart de Geus urged attendees to “shift left” – in other words, “squeezing the schedule” to design, verify, debug, and manufacture semiconductors.

Cypress debuts reliable, secure fingerprint sensing solution for mobile devices

03/02/2015  The flexible solution enables designers to create custom home buttons with specialized shapes and sizes or to integrate the sensor into any mobile device’s industrial design or home button.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



The Path to Future Interconnects

August 6, 2015 at 1:00 p.m. ET

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
Advanced Packaging

August 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015