Applications

APPLICATIONS ARTICLES



IEEE International Electron Devices Meeting announces 2016 Call for Papers

04/15/2016  The 62nd annual IEEE International Electron Devices Meeting (IEDM), to be held at the San Francisco Union Square Hilton hotel December 3 - 7, 2016, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

IoT Demands Part 2: Test and Packaging

04/15/2016  To understand the state of technology preparedness to meet the anticipated needs of the different application spaces, experts from GLOBALFOUNDRIES, Cadence, Mentor Graphics and Presto Engineering gave detailed answers to questions about IoT chip needs in EDA and fab nodes.

MU, STMicroelectronics improve medical care with miniature ultrasound diagnostic device

04/14/2016  MU, a medical-device manufacturer, and STMicroelectronics today announced that MU's US-304 portable ultrasound imager, powered by ST's STHV800 pulser, is aiming to increase the quality of point-of-care medical diagnostics in remote rural areas of Africa.

IoT Demands Part 1: EDA and Fab Nodes

04/14/2016  To meet the anticipated needs of the different IoT application spaces, SemiMD asked leading companies within critical industry segments about the state of technology preparedness.

imec and Crystal Solar demonstrate 22.5% nPERT Si solar cells on kerfless epitaxial wafers

04/14/2016  Crystal Solar’s kerfless wafers are a disruptive solution for the solar cell industry, substantially reducing the cost of Si solar cells.

Imec Technology Forum Brussels puts nanotechnology in the hot seat

04/13/2016  Imec, the nanoelectronics research center, today announced that its annual Imec Technology Forum (ITF) in Brussels will take place May 24-25, 2016 in Brussels, Belgium at SQUARE, Brussels Meeting Centre

Tech companies creating strategic platforms to support the Internet of Things

04/12/2016  IHS forecasts that the IoT market will grow from an installed base of 15.4 billion devices in 2015 to 30.7 billion devices in 2020 and 75.4 billion in 2025.

Sensors driving next-generation wearable devices

04/12/2016  Last week, IDTechEx gave the opening presentation at the 2016 Korea Summit for Smart Wearable Devices, excellently hosted by KDIA and KSA in Seoul, Korea.

Presto Engineering and Peraso Technologies Develop Innovative Test Solution for 60 GHz Transceiver

04/12/2016  Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, and Peraso Technologies, a leading wireless chipset manufacturer, today jointly announced their successful collaboration in developing a comprehensive test solution for Peraso’s recently-launched 60 GHz semiconductor products.

Technavio updates on the global piezoelectric smart materials market

04/11/2016  According to their latest report, Technavio analysts expect the global piezoelectric smart materials market for 2016-2020 to exceed USD 42 billion by 2020 growing at a CAGR of almost 13 percent.

Cadence to Acquire Rocketick

04/11/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has entered into a definitive agreement to acquire Rocketick Technologies Ltd.

Mentor Graphics U2U Meeting April 26 in Santa Clara

04/11/2016  Mentor Graphics’ User2User meeting will be held in Santa Clara on April 26, 2016. The meeting is a highly interactive, in-depth technical conference focused on real world experiences using Mentor tools to design leading-edge products.

Leti and ARaymondlife launch project to speed use of microfluidic devices for biological sample analysis

04/07/2016  Leti, an Institute of CEA Tech, and ARaymondlife, a manufacturer of customized devices and consumables for the IVD industry today announced a joint initiative to accelerate the development and manufacturing of innovative medical devices, especially in the field of microfluidic cartridge analysis.

Cadence and University of Oxford Foster the Advancement of Formal Verification Innovation

04/07/2016  Cadence Design Systems, Inc. and the University of Oxford today announced a move to foster the advancement of formal verification innovation with the appointment of Dr. Ziyad Hanna, Cadence vice president of R&D, as a visiting professor in Oxford's Department of Computer Science for the next three years.

Heat and light get larger at the nanoscale

04/01/2016  In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close--at nanoscale distances--without touching.

For rechargeable batteries that crush the competition, crush this material

04/01/2016  By chemically modifying and pulverizing a promising group of compounds, scientists at the National Institute of Standards and Technology (NIST) have potentially brought safer, solid-state rechargeable batteries two steps closer to reality.

Optoelectronics, sensors/actuators and discretes will stabilize after spotty growth in 2015

03/31/2016  Modest economic improvements and new applications such as wearable systems and Internet of Things are expected to result in more normal growth rates of O-S-D over the next five years.

Synopsys Debuts Tools at Users Group Meeting

03/30/2016  Aart de Geus, the chairman and co-chief executive officer of Synopsys, used his keynote address at the 2016 Synopsys Users Group conference in Silicon Valley to tout a pair of new products.

Mixed signal and IoT driving ASIC design starts growth, says Semico Research

03/29/2016  Steady demand in existing end markets and growth from new end applications are pushing ASIC design activity to new levels.

A new virtuous cycle for the MEMS industry

03/24/2016  Since 2000, we have entered the age of sensing and interacting with the wide diffusion of MEMS and sensors that give us a better, safer perception of our environment. MEMS have grown in volume to be almost a 15 billion units market today.




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Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Flawless Execution at Fairchild: How Change to Modern MES Enables Agility, Quality and Productivity

August 9, 2016 at 1 PM ET / Sponsored by Epicor and Siemens

In this high-pressure environment, leading semiconductor companies are swapping out older manufacturing executions systems (MES) for modern MES. Surprised? True, the perceived risk of changing out MES in a semiconductor facility is high. Yet companies have done it with great success and enormous business benefits. Fairchild Semiconductor’s positive experiences as it strives for quality, on-time delivery, new product introduction success, improved productivity and quality are indicative. In just one year, Fairchild switched out aging systems for a new MES at a plant in China – and the following month, they got it up at a second plant. Learn what they did to ensure the change happened quickly and without a hitch. In addition to this case study, you’ll hear from a leading industry analyst who has interviewed dozens of people from semiconductor companies that have succeeded with the move to modern MES.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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