Applications

APPLICATIONS ARTICLES



Sensor technologies are mature for autonomous driving application

01/15/2016  Currently the most advanced commercial car with autonomous features embeds about 17 sensors with two main solutions: ultrasonic sensors and cameras for surround. And by 2030, Yole anticipates more than 29 sensors.

Engineers invent a bubble-pen to write with nanoparticles

01/14/2016  Researchers at the Cockrell School of Engineering at The University of Texas at Austin have developed a device and technique, called bubble-pen lithography, that can gently and effectively handle nanoparticles.

Qualcomm and TDK announce joint venture

01/14/2016  Qualcomm and TDK to expand their collaboration across multiple technologies.

Gartner reports worldwide PC shipments declined 8.3% in fourth quarter of 2015

01/13/2016  Worldwide PC shipments totaled 75.7 million units in the fourth quarter of 2015, a 8.3 percent decline from the fourth quarter of 2014, according to preliminary results by Gartner, Inc

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

Flexible hybrid electronics market heating up in 2016

01/07/2016  Flexible and printed electronics applications are becoming real. Forecasters are predicting a nearly $30 billion market for internet-connected devices in a combined industry and consumer sector.

Imec and Cloudtag collaborate on frictionless wearables

01/07/2016  Cloudtag and imec, the nanoelectronics research center, today presented the first results of their collaboration on accurate frictionless wearable health solutions.

New bimetallic alloy nanoparticles for printed electronic circuits

01/05/2016  "Printed electronics" has the potential to enable low-cost fabrication of electronics on flexible or curved surfaces, which will lead to the use of electronics in more varied applications.

Strong semiconductor growth forecast for electric vehicle DC fast-charging stations

12/23/2015  The global market for semiconductors used in electric vehicle (EV) charging stations for plug-in hybrid (PH) and battery electric vehicles (BEV) will continue to expand in the coming years, providing significant growth opportunities to semiconductor manufacturers.

A microfluidic biochip for blood cell counts at the point-of-care

12/22/2015  Teams of researchers from the University of Illinois at Urbana-Champaign (UIUC) have demonstrated a biosensor capable of counting the blood cells electrically using only a drop of blood.

New device uses carbon nanotubes to snag molecules

12/22/2015  Engineers at MIT have devised a new technique for trapping hard-to-detect molecules, using forests of carbon nanotubes.

Startup Works on Ultralow-k Materials for Chips, Displays

12/21/2015  The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.

3D ASIP Conference Hears from EDA, IC Gear Companies

12/18/2015  John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.

Packaging Conference Addresses Challenges, Opportunities in New Technologies

12/18/2015  On the second day of the 12th annual 3D ASIP conference, the heavy hitters came out to talk. Attendees heard presentations from executives of Amkor Technology, the Defense Advanced Research Projects Agency (DARPA), Northrop Grumman, Taiwan Semiconductor Manufacturing, Teledyne Scientific & Imaging, and Xilinx, among other companies.

Internet of Things market to nearly double by 2019

12/17/2015  Between 2015 and 2019, worldwide systems revenues for applications connecting to the Internet of Things will nearly double, reaching $124.5 billion in the final year of this decade, according to IC Insights’ new 2016 edition of its IC Market Drivers report. During that same timeframe, new connections to the Internet of Things (IoT) will grow from about 1.7 billion in 2015 to nearly 3.1 billion in 2019 (Figure 1), based on the forecast in the new 450-page report, which examines emerging and major end-use applications fueling demand for ICs.

Imec, KU Leuven and NERF combine electronics and photonics in neural probes

12/17/2015  At last week’s IEEE International Electron Devices Meeting 2015, nanoelectronics research center imec, KU Leuven, and Neuro-Electronics Research Flanders (NERF, set up by VIB/KU Leuven and imec) presented a set of silicon neural probes that combine 12 monolithically integrated optrodes using a CMOS compatible process.

Conference Features "The Year of Stacked Memory" in 2015

12/17/2015  The theme of this year's 3D Architectures for Semiconductor Integration and Packading (3D ASIP) conference is "The Year of Stacked Memory," noting how memory die stacked in one package are becoming more commonplace in 2015.

Cellphones remain the largest driver of IC sales, but growth stalls

12/11/2015  The total production value of electronic systems is forecast to decrease 2% in 2015 to an estimated $1,423 billion, marking only the fourth time in history that the systems market registers a decline.

New approaches for hybrid solar cells

12/10/2015  Using a new procedure researchers at the Technical University of Munich (TUM) and the Ludwig Maximillians University of Munich (LMU) can now produce extremely thin and robust, yet highly porous semiconductor layers. A very promising material - for small, light-weight, flexible solar cells, for example, or electrodes improving the performance of rechargeable batteries.

Innovative sensors make wearables truly unique

12/10/2015  There will be a $5.5 billion market for sensors used in wearable technology applications by 2025, according to IDTechEx’s best-selling research report on the topic.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS