Applications

APPLICATIONS ARTICLES



NC State researchers create 'nanofiber gusher'

03/19/2015  Engineers and researchers at North Carolina State University and one of its start-up companies have now reported a method that can produce unprecedented amounts of polymer nanofibers, which have potential applications in filtration, batteries and cell scaffolding.

Small powerful systems give rise to medical semiconductor sales

03/19/2015  Market for medical semiconductors seen rising to $8.2 billion in 2018.

Rice fine-tunes quantum dots from coal

03/18/2015  Rice University scientists gain control of electronic, fluorescent properties of coal-based graphene.

High tech start-ups to connect with investors at SEMICON Europa 2015

03/17/2015  SEMICON Europa 2015 (October 6-8) will prominently feature second edition of this very successful program connecting early-stage companies with strategic investors, venture capitalists and other relevant stakeholders.

Light sensors market to grow 16 percent between 2013 and 2016

03/13/2015  Samsung, Apple and Chinese OEMs will drive revenue in the light sensor market to grow 16 percent between 2013 and 2016, according to a new report released today from IHS Inc.

New technology may double radio frequency data capacity

03/13/2015  Columbia engineers invent nanoscale IC that enables simultaneous transmission and reception at the same frequency in a wireless radio.

Engineers create chameleon-like artificial 'skin' that shifts color on demand

03/12/2015  Borrowing a trick from nature, engineers from the University of California at Berkeley have created an incredibly thin, chameleon-like material that can be made to change color -- on demand -- by simply applying a minute amount of force.

11 IC product categories to exceed total IC market growth in 2015

03/12/2015  IC Insights’ March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.

MicroWatt Chips shown at ISSCC

03/05/2015  With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just concluded 2015 International Solid State Circuits Conference (ISSCC) in San Francisco to be on ultra-low-power circuits that run on mere microWatts (µW).

Time to “shift left” in chip design and verification, Synopsys founder says

03/04/2015  Taking “Smart Design from Silicon to Software” as his official theme, Aart de Geus urged attendees to “shift left” – in other words, “squeezing the schedule” to design, verify, debug, and manufacture semiconductors.

Cypress debuts reliable, secure fingerprint sensing solution for mobile devices

03/02/2015  The flexible solution enables designers to create custom home buttons with specialized shapes and sizes or to integrate the sensor into any mobile device’s industrial design or home button.

SPIE Advanced Lithography conference concludes

02/27/2015  Exposures, and reducing their cost, were a theme running through the 2015 SPIE Advanced Lithography Symposium this week in San Jose, Calif., the center of Silicon Valley.

Learning to live with negative tone

02/27/2015  In lithography for manufacturing semiconductors, a negative tone can be a positive attribute.

Directed Self Assembly Hot Topic at SPIE

02/25/2015  At this week’s SPIE Advanced Lithography Symposium in San Jose, Calif., the hottest three-letter acronym is less EUV and more DSA, as in directed self-assembly.

Imec and Panasonic present breakthrough in CMOS-based transceivers for mm-wave radar systems

02/25/2015  Today, at the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79GHz.

Proponents of EUV, immersion lithography face off at SPIE

02/25/2015  The two main camps in optical lithography are arrayed for battle at the SPIE Advanced Lithography Symposium. EUVt lithography, on one side, is represented by ASML Holding, its Cymer subsidiary, and ASML’s EUV customers, notably Intel, Samsung Electronics, and TSMC. On the other side is 193i immersion lithography, represented by Nikon and its customers, which also include Intel and other leading chipmakers.

Freescale pushes for a secure Internet of Things

02/24/2015  As the Internet of Things (IoT) continues to gain momentum, Freescale Semiconductor and its partners are tackling the most dire challenge the young movement has faced to date – the alarming lack of unified guidelines for ensuring the security of IoT applications.

Radio chip for the 'Internet of things'

02/24/2015  At this year's Consumer Electronics Show in Las Vegas, the big theme was the "Internet of things" -- the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.

Optical nanoantennas set the stage for a NEMS lab-on-a-chip revolution

02/24/2015  Newly developed tiny antennas, likened to spotlights on the nanoscale, offer the potential to measure food safety, identify pollutants in the air and even quickly diagnose and treat cancer, according to the Australian scientists who created them.

SPIE plenary takes in photonics, 3DICs, connected devices

02/23/2015  Speakers at the plenary session of the SPIE Advanced Lithography conference covered a wide variety of topics, from photonics to 3D chips to the Internet of Things, on Monday morning, February 23, in San Jose, Calif.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Interconnects

July 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015