Applications

APPLICATIONS ARTICLES



Samsung announces ARTIK platform to accelerate Internet of Things development

05/12/2015  Samsung Electronics Co., Ltd. today announced the Samsung ARTIK platform to allow faster, simpler development of new enterprise, industrial and consumer applications for the Internet of Things (IoT).

IBM's silicon photonics technology ready to speed up cloud and Big Data applications

05/12/2015  IBM today announced a significant milestone in the development of silicon photonics technology, which enables silicon chips to use pulses of light instead of electrical signals over wires to move data at rapid speeds and longer distances in future computing systems.

New device could greatly improve speech and image recognition

05/12/2015  Researchers have demonstrated pattern recognition using a magnonic holographic memory device.

High-performance 3-D microbattery suitable for large-scale on-chip integration

05/12/2015  By combining 3D holographic lithography and 2D photolithography, researchers from the University of Illinois at Urbana-Champaign have demonstrated a high-performance 3D microbattery suitable for large-scale on-chip integration with microelectronic devices.

New approaches to vision with microchips holds out prospects for the blind

05/11/2015  To date, chip-based retinal implants have only permitted a rudimentary restoration of vision. However, modifying the electrical signals emitted by the implants could change that.

MEMS industry influencers to present at SEMI European MEMS Summit

05/07/2015  SEMI has announced that executives from MEMS giants Bosch and STMicroelectronics, MEMS largest fabless Invensense and dominating IC foundry TSMC will be delivering the keynote talks at the European MEMS Summit.

Sensor competition, actuator recovery impact supplier ranking

04/30/2015  Sensor leader Bosch grabs 20 percent of worldwide sales in 2014 while ST falls from second to fourth place with a 19 percent drop in dollar volume last year, says new O-S-D Report.

Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications

04/30/2015  Researchers from the Georgia Institute of Technology have developed a novel cellular sensing platform that promises to expand the use of semiconductor technology in the development of next-generation bioscience and biotech applications.

Imec reports 9% growth in 2014

04/29/2015  Nanoelectronics research center imec, today reported the financial results for fiscal year ended December 31, 2014.

SIGFOX and TI collaborate to deliver cost-effective, long-range, low-power Internet of Things connectivity

04/28/2015  SIGFOX and Texas Instruments (TI) announced the two companies are working together to increase IoT deployments using the Sub-1 GHz spectrum.

Picture this: Graphene brings 3-D holograms clearer and closer

04/28/2015  From mobile phones and computers to television, cinema and wearable devices, the display of full color, wide-angle, 3D holographic images is moving ever closer to fruition, thanks to international research featuring Griffith University.

Surface matters: Huge reduction of heat conduction observed in flat silicon channels

04/23/2015  A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.

From metal to insulator and back again

04/23/2015  New work from Carnegie's Russell Hemley and Ivan Naumov hones in on the physics underlying the recently discovered fact that some metals stop being metallic under pressure.

Communications, computer systems drive IC sales across all regions

04/23/2015  Automotive systems forecast to remain a major application in Europe.

How emerging IoT impacts the semiconductor sector

04/23/2015  In this 50th year anniversary of Moore’s Law, the steady scaling of silicon chips’ cost and performance that has so changed our world over the last half century is now poised to change it even further through the Internet of Things.

MagnaChip to offer diversified products for Internet of Things applications

04/20/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market.

Engineer improves rechargeable batteries with MoS2 nano 'sandwich'

04/17/2015  The key to better cellphones and other rechargeable electronics may be in tiny "sandwiches" made of nanosheets, according to mechanical engineering research from Kansas State University.

Solution-grown nanowires make the best lasers

04/14/2015  Take a material that is a focus of interest in the quest for advanced solar cells. Discover a "freshman chemistry level" technique for growing that material into high-efficiency, ultra-small lasers. The result, disclosed Monday, April 13 in Nature Materials, is a shortcut to lasers that are extremely efficient and able to create many colors of light.

New understanding of electromagnetism could enable 'antennas on a chip'

04/10/2015  A team of researchers from the University of Cambridge have unravelled one of the mysteries of electromagnetism, which could enable the design of antennas small enough to be integrated into an electronic chip. These ultra-small antennas - the so-called 'last frontier' of semiconductor design - would be a massive leap forward for wireless communications.

Sensor shipments strengthen but falling prices cut sales growth

04/10/2015  Sensor shipments are getting a big boost from the spread of embedded measurement functions for automated intelligent controls in systems and new high-volume applications, but sales growth is being pulled down significantly by price erosion in this once high-flying semiconductor marketplace.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015