Applications

APPLICATIONS ARTICLES



Will conductive inks help wearables go truly wearable?

06/02/2016  The first generation of wearable devices are constructed using mature, rigid technologies put inside a new box that can be worn. These are often bulky devices that are not truly wearable in the sense that our clothes are. This is, however, beginning to change, albeit slowly.

Solid State Watch: May 20-26, 2016

05/31/2016  SEMI releases new book-to-bill ratio report; Infineon and imec share details of their CMOS-based 79 GHz sensor chip; Synopsys introduces pre-wafer simulation solution; Researchers find new method for doping single crystals of diamond

Advanced power technology from STMicroelectronics enables unique portable e-car charger from Zaptec

05/31/2016  Silicon-carbide (SiC) power electronics from STMicroelectronics has enabled the creation of ZapCharger Portable, the world's smallest, smartest, and safest electric-car charging station from Zaptec, an innovative start-up company that has revolutionized the transformer industry.

An increasing number of healthcare applications is using bioMEMS components

05/27/2016  According to Yole Développement (Yole) analysts, this market will triple from US$2.7 billion in 2015 to US$7.6 billion in 2021.

The next generation of carbon monoxide nanosensors

05/26/2016  Scientists have been investigating sensors that can determine CO concentration, and a team from the Okinawa Institute of Science and Technology Graduate University (OIST), in tandem with the University of Toulouse, has found an innovative method to build such sensors.

MEMS technology is contributing to the inkjet printing industry revolution

05/25/2016  With a market reaching US$ 1 billion in 2021, the MEMS printhead is one of the most mature MEMS devices.

Imec, Holst Centre and Barco Silex collaborate on data security for wearables and IoT networks

05/25/2016  Nanoelectronics research center imec, Holst Centre (set up by imec and TNO) and micro-electronic design house Barco Silex, belonging to the Barco group, today announced that they will collaborate to implement data security into sensors for wearable devices and Internet of Things (IoT) sensor networks.

Smart city devices to top 1 billion units in 2025

05/25/2016  Global unit shipments of smart city devices, which are internet-connected devices used in smart city projects, will increase from 115.4 million in 2015 to 1.2 billion in 2025.

Optics breakthrough to revamp night vision

05/25/2016  A breakthrough by an Australian collaboration of researchers could make infra-red technology easy-to-use and cheap, potentially saving millions of dollars in defence and other areas using sensing devices, and boosting applications of technology to a host of new areas, such as agriculture.

Imec and Holst Centre present multi-standard low-power wide-area radio chip

05/24/2016  The nanoelectronics research centers imec and Holst Centre (set up by imec and TNO), presented a low-power wide-area (LPWA) multi-standard radio chip today at imec's annual technology forum in Brussels (ITF Brussels 2016).

Solid State Watch: May 13-19, 2016

05/23/2016  IBM scientists achieve storage memory breakthrough; Kateeva closes its Series E funding round with $88 million in new financing; Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments; New type of graphene-based transistor will increase the clock speed of processors

Fujitsu boosts efficiency of manufacturing processes at Shimane Fujitsu through IoT collaboration with Intel

05/19/2016  Fujitsu Limited today announced that it has with Intel Corporation carried out a field trial to visualize manufacturing processes at Shimane Fujitsu Limited.

STMicroelectronics, Arduino launch cooperation to expand maker-community access to STM32 MCUs and sensors

05/19/2016  Moving to enable makers to make even more than before, STMicroelectronics and Arduino today announced an agreement that brings the STM32 family of microcontrollers (MCU), along with ST's full portfolio of sensing, power, and connectivity technology, even closer to the Arduino maker community.

The CEA announces expanded collaboration with Intel

05/18/2016  The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R&D agreement signed in Paris on Thursday 12 May.

IBM keynoter outlines disruptive "Economy of Things" at SEMI’s ASMC 2016

05/18/2016  The 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016), opened today (May 17) in Saratoga Springs, New York.

TowerJazz begins mass producing new integrated SiGe-based "front-end module on a chip" RF platform for IoT applications

05/17/2016  TowerJazz today announced volume production of a new RF technology capable of integrating a wireless front-end module (FEM) on a single chip, tailored to meet the challenges of Internet of Things (IoT) applications.

Ultratech Cambridge Nanotech forms research collaboration with Northeastern University

05/17/2016  Ultratech, Inc. announced the formation of a research collaboration with Professor Thomas J. Webster, Ph.D. at Northeastern University, to study the use of nano-materials produced via ALD for medical applications.

Worldwide wearables market increases 67.2% amid seasonal retrenchment, reports IDC

05/16/2016  A combination of device releases, price reductions, and company rationalizations marked the first quarter of 2016 (1Q16) in the worldwide wearables market.

Si2 launches project to develop new integrated circuit power modeling technology

05/12/2016  Silicon Integration Initiative (Si2), an Austin-based integrated circuit research and development joint venture, has launched a project to help designers reduce power consumption, a growing challenge for most system-on-chip designs.

Samsung PhD Fellowship program recognizes best and brightest student innovators

05/12/2016  Each student will receive a Fellowship award of $50,000 as well as mentorship to support their ground-breaking research.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

VIDEOS