Empak Agrees to Share 300-mm Technology

Empak Agrees to Share 300-mm Technology

Colorado Springs, CO–Empak, Inc. has agreed to share its leading-edge, 300-mm technology to the extent that its use is required by provisional SEMI standards 2470, 2471, 2472 and 2502. “In the spirit of cooperation and industry standardization,” Empak is conforming to SEMI regulation 14.3.3.1. In a statement issued in August, Empak said it “believes that it is increasingly in the interest of material suppliers, tool suppliers, and IC manufacturers to share technology to minimize overall IC manufacturing costs.” One of Empak`s goals is to work with the international community to ensure the successful implementation of provisional SEMI standards, listed above, and facilitate industry implementation of the most effective 300-mm wafer handling solution.

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