Underfill Technology

The “No Flow-Fluxing” underfill is designed to help manufacturers and assemblers of area-array devices, such as flip chip, CSP and BGA, reduce the overall cost of device assembly. This technology reportedly eliminates separate fluxing, flux cleaning, underfill capillary flow and post-cure operations using underfill in area-array device assembly because the underfill performs the dual role of fluxing the interconnects and curing to become the underfill layer.

Emerson & Cuming

a National Starch and Chemical Co.

Billerica, Mass.

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