Underfill Technology

The “No Flow-Fluxing” underfill is designed to help manufacturers and assemblers of area-array devices, such as flip chip, CSP and BGA, reduce the overall cost of device assembly. This technology reportedly eliminates separate fluxing, flux cleaning, underfill capillary flow and post-cure operations using underfill in area-array device assembly because the underfill performs the dual role of fluxing the interconnects and curing to become the underfill layer.

Emerson & Cuming

a National Starch and Chemical Co.

Billerica, Mass.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
02/18/2016Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of th...
Versatile high throughput SEM from JEOL
11/04/2015JEOL's new JSM-IT100 is the latest addition to its InTouchScope Series of Scanning Electron Microscopes....