Flip-chip Underfill

ME-526 is a one-component, high-purity, fast-cure, semiconductor-grade epoxy system developed for the underfill encapsulation of flip-chip devices. It can cure in 15 minutes at 165°C and does not require two-step curing to minimize stress. This material was designed to reduce stress between the substrate and the solder bumps by keeping the solder bumps in a constant state of compression. The product reportedly has a low viscosity and rapidly flows under devices with standoffs down to 0.001 in.

Thermoset

Lord Chemical Products

Indianapolis, Ind.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

ClassOne introduces new mid-sized electroplater
07/06/2015Semiconductor equipment manufacturer ClassOne Technology has announced a new addition to its popular Solstice family of ≤200mm wafer electroplaters....
New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...