Flip-chip Underfill

ME-526 is a one-component, high-purity, fast-cure, semiconductor-grade epoxy system developed for the underfill encapsulation of flip-chip devices. It can cure in 15 minutes at 165°C and does not require two-step curing to minimize stress. This material was designed to reduce stress between the substrate and the solder bumps by keeping the solder bumps in a constant state of compression. The product reportedly has a low viscosity and rapidly flows under devices with standoffs down to 0.001 in.

Thermoset

Lord Chemical Products

Indianapolis, Ind.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....