Flip-chip Underfill ME-526 is a one-component, high-purity, fast-cure, semiconductor-grade epoxy system developed for the underfill encapsulation of flip-chip devices. It can cure in 15 minutes at 165°C and does not require two-step curing to minimize stress. This material was designed to reduce stress between the substrate and the solder bumps by keeping the solder bumps in a constant state of compression. The product reportedly has a low viscosity and rapidly flows under devices with standoffs down to 0.001 in. Thermoset Lord Chemical Products Indianapolis, Ind.