New Products Suspension Profile System Click here to enlarge image The View Voyager Model V12 x 12 suspension profile system makes non-contact, 3-D surface and shape profiles, angle and radius profiles, and material flatness evaluations for automated production process control applications. 3-D measurements of height and depth, plus XZ and YZ plane angles of suspension component features, suspension assemblies and head gimbal assemblies are performed at sub-micron levels. A dual-sensor design enables high-speed dimensional measurements of characteristics, such as gimbal flatness, tongue pitch and roll static attitude, dimple height, formed rail height, welded base plate flatness, and true formed load beam profile. The system can also perform traditional 2-D measurements. Other configurations of the system are available to meet the requirements of non-production applications, such as research and development, product and process development, GR&R studies, and part qualifications. GSI Lumonics Inc., Ann Arbor, Mich. SMT Printer Click here to enlarge image The PrinTEK Model 5000-APS SMT printer for batch-style fine pitch production is well-suited for large PCBs, such as those used for backplane and mother board production. The PCB registration is maintained with r-theta tooling disks that allow users to quickly set pins in position to locate the PCB. The stencil loading area facilitates fast setups by its open, clear face-down loading surface. The stencil floats so an operator can move it into alignment with the board. The printer accepts PCB sizes up to 24-in. x 36-in. and industry-standard 29-in. frames or a custom frame up to 35-in. x 46-in. The overall footprint is 78-in. x 59-in., and the system includes a steel bench and dual Permalex edge metal squeegees. Transition Automation Inc., North Billerica, Mass. Fiber Optic Sensor The BOS 20K fiber optic sensor with teach-in capability eliminates manual adjustments for quick and accurate sensor setup. The sensor has a 60 x 30 x 13-mm. housing and is ideal for small parts detection, part feature checks, counting and part positioning for handling, assembly, and robotic applications. Sensitivity can be manually adjusted, and four display elements indicate sensor output, time delay, stability and key lockout condition. Features include light-on/dark-on capability, external teach inputs, visible red emission and settable switching delay to 5 seconds. Balluff Inc., Florence, Ky. Inspection Software Click here to enlarge image The Device Toolbox software package helps process engineers visualize and quantify changes in wafer shape, thickness and flatness. Using both measured and differential data, the software allows engineers to develop, diagnose and maintain thermal, photolithography, backgrind and backside etch processes. The thickness and shape data created by any ADE ASC or ASC-2000 measurement system is transformed by the software into one-, two- or three-dimensional maps of measured or differential information for one wafer or an entire lot. ADE Corp., Westwood, Mass. Pick and Place Package Click here to enlarge image The SDG-2000 combines two S-2000 vision placers with a connecting conveyor for a total of four heads, 200 tape/stick capacity, and 19,400 pph throughput. Placers can be connected with the included conveyor for dual-gantry performance or used individually. Placers include laser alignment, 40-mm. vision system and multiple fields of recognition. Component range is 0401 to 50mm2 down to 0.5-mm. pitch. Lower pitch is possible with optional 35-mm. or 20-mm. vision systems. Manncorp, Huntingdon Valley, Pa. Collet Sockets Click here to enlarge image The Eject-a-DIP is a rugged, solderable socket with an ejector/latch that locks in surface mount devices, making it ideal for high-vibration environments. The latch removes DIP packages without pin damage and allows for fast in-field board maintenance. The body of the socket and the latch are constructed from temperature-resistant UL 94V-0 glass-filled nylon that will stand up to surface mount soldering applications. The contact current rating is 3 amps, its insulation resistance is 10,000 MOhms at 500 VDC, and it can withstand voltage to 1000 V RMS. Operating temperature is -55°C to 105°C for tin plating, and -55°C to 125°C for gold plating. Insertion force is 67g/pin and withdrawal force is 30g/pin. Aries Electronics Inc., Frenchtown, N.J. Film Capacitors Click here to enlarge image Series GMW and SMW surface mount film capacitors use a “naked” construction and offer sizes down to 1812 for applications where stability or self-healing is required. The capacitors are less susceptible to moisture and do not delaminate. The capacitance range is 1,000 pF to 1 µF in voltages up to 630 VDC. Evox Rifa, Lincolnshire, Ill.