About the Site

Advanced Packaging serves those in operations that integrate electronic component packages into circuitry of their end products. Advanced Packaging magazine debuted in 1992 to the IC packaging engineering community.

Nashua, NH – PennWell Publishing has announced that Advanced Packaging magazine, the premier business-to-business technology source for advanced semiconductor packaging, will move to a monthly (12-time) schedule in 2001. The magazine has followed a 10-time schedule since its introduction in 1992; the November/December 2000 issue will be the magazine's last combined issue.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



Tektronix introduces Keithley S540 power semiconductor test system
10/19/2016Tektronix, Inc., a worldwide provider of measurement solutions, today introduced the Keithley S540 Power Semiconductor Test System, a ...
Novel Wafer Analyzer for up to 300mm wafer using high speed Raman Imaging Technology
08/08/2016Nanophoton introduces RAMANdrive - a new Wafer Analyzer - for a wide range of applications at semiconductor market a...
Pfeiffer Vacuum introduces HiPace 2800 turbopump for ion implantation applications
07/06/2016Pfeiffer Vacuum has introduced the HiPace 2800 IT turbopump that is designed for ion implantation applications....