About the Site

Advanced Packaging serves those in operations that integrate electronic component packages into circuitry of their end products. Advanced Packaging magazine debuted in 1992 to the IC packaging engineering community.

Nashua, NH – PennWell Publishing has announced that Advanced Packaging magazine, the premier business-to-business technology source for advanced semiconductor packaging, will move to a monthly (12-time) schedule in 2001. The magazine has followed a 10-time schedule since its introduction in 1992; the November/December 2000 issue will be the magazine's last combined issue.

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