GHZ Technology modernizes, expands wafer fab capability for wireless infrastructure FEB. 13 Santa Clara, California–GHz Technology Inc., a supplier of power transistors for radio frequency (RF) and microwave applications, today announced it has modernized its wafer fab and added state-of-the-art assembly and test capabilities to its Santa Clara facility. With this leading-edge manufacturing capability, GHz is poised to deliver RF power transistors that enable wireless system makers to meet the challenges posed by third-generation cellular services in linear wireless base station applications. “These state-of-the-art manufacturing capabilities, along with our foundry agreement with Agere, assure our OEM customers of ample production and product availability,” says Frank Schneider, GHz Technology president and CEO. As part of its expansion, GHz Technology added a new stepper that will improve wafer yield and performance, a pattern recognition wafer inspection system, an automatic die bonder, a wire bonder, and additional RF test equipment. To accommodate the production line at the manufacturing site, the company relocated its corporate offices to Santa Clara.