Varian Semiconductor Equipment receives ion implanter orders from UMC

February 26, 2001–Glouchester, Massachusetts–Varian Semiconductor Equipment Associates, Inc., a supplier of ion implantation systems, today announced that it has received an order for a VIISta 810 ion implanter from UMC, a world-leading foundry services provider headquartered in Hsinchu, Taiwan.

The VIISta 810 system will be installed in UMC’s new 12A 300mm foundry fab in Tainan, which has an expected capacity of 30,000 wafers per month.

“The VIISta 810 ion implanter provides UMC with significant single wafer production advantages, and contributes to our efforts to establish UMC as a leader in foundry technology,” says UMC’s president of business group, Dr. Frank Wen. “The proven track record of our existing VIISta 810 systems at UMC 200mm fabs, coupled with Varian Semiconductor Equipment’s strong service and support, combine to provide us with the performance we need to meet the demands of the expanding 300mm marketplace.”

The VIISta 810 medium current system is designed to provide cost of ownership advantages for 300mm production by achieving wafer throughput at a rate in excess of 230 wafers per hour. In addition, VIISta provides the performance attributes necessary for next- generation ICs. The highly parallel beam, in combination with total incident angle control, allows VIISta to provide optimal threshold voltage (Vt) control and the angular placement accuracy required for halo and pocket implants. Both implant types are considered critical to optimizing sub-130nm IC performance.

“We are very pleased that UMC continues to select the VIISta 810 ion implanter to support their 300mm efforts at their new fab in Tainan,” says Richard A. Aurelio, Varian Semiconductor Equipment’s chairman and chief executive officer . The strong acceptance of our VIISta products in semiconductor markets like Taiwan is critical to our growth and greatly contributes to our position as the industry’s technology leader in ion implantation products.”

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...