Amkor develops automated package/test system for multi-media cards

August 16, 2001 – Chandler, AZ – Amkor Technology has developed a fully automated system for packaging and testing multi-media cards.

The keys to Amkor’s proprietary process include its ability to automatically implant the multi-media die assembly into the MMC housing, and its use of multiple test points designed into the package substrate for easy test access and assurance of maximum fault detection. Prior to development of an automated process, the operation was performed manually.

Conducting tests for assembly defects, functionality, programming and compatibility prior to final assembly reduces test and handling time, and gives greater assurance of reliability.

The over-molded die assembly, which also is packaged by Amkor, typically consists of multiple components, including memory, passives and a micro-controller. Amkor’s automated process deposits adhesive material on the MMC housing and then attaches it to the die assembly with placement accuracy of .5 mil. The bottom of the die assembly incorporates a seven-pin connector that corresponds with the connector in the end-use application.

MMCs are assembled to a standard 24mm x 32mm x 1.4mm form factor. Memory capacity depends on the design of the silicon die inserted into the MMC, but typically hold 16 or 32 megabytes of information – music, text, photographs or other data. By stacking multiple memory chips into the MMC, Amkor is able to double the memory capacity to 64 MB without increasing the dimensions of the card.

Amkor established its MMC manufacturing capability early last year through close collaboration with SanDisk, its initial MMC customer. Over the past year Amkor has produced more than one million multi-media cards for a variety of customers.

Industry analyst firm IDC estimates the market for multi-media cards to grow from 3.1 million in 2000 to more than 22.7 million in 2004.

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