ON to expand MOS power wafer fab in Slovakia Feb. 27, 2002 – Phoenix, AZ – ON Semiconductor, a provider of power- and data-management semiconductors, plans to expand its manufacturing facility in Piestany, Slovakia with a second front-end wafer fab that will produce low-voltage MOS power devices. ON will introduce an advanced 6-inch wafer line into its 915,000-square-foot facility in Piestany and expects the first phase of the project to be staffed and operational in early 2003. There currently are 250 people employed at the site and the company plans to add 90 jobs by the end of the first phase of the project. The new fab will use the company’s HD3e technology platform to manufacture MOS power devices critical for the management of power in today’s wireless, computing, and automotive applications. The front-end factory is ISO 14001 and QS-9000 certified. “ON selected Piestany for this expansion project based on the facility’s track record for quality and on-time delivery,” said Walt Guy, ON Semiconductor GM of the Piestany facility. Prior to 2001, ON used the Piestany site for wafer manufacturing only, but that year decided to expand the number of business organizations that support the company’s European business objectives. The European customer service center features European-wide customer service, quality support, and Central-European sales operations.