April 16, 2002 – San Jose, CA – Canon Inc. has signed an agreement with Applied Materials Inc. to collaborate in the development of semiconductor device patterning technology to support Applied Materials’ process module strategy for 300mm wafer manufacturing.
Development activity will take place in Applied Materials’ new Dan Maydan Process Module Technology Center (PMTC) in Sunnyvale, CA.
“Establishing a core lithography capability was a high priority for our 300mm process module development program,” said David Bergeron, VP, advanced module development, Applied Materials.
In the early phases of the joint development work, Applied Materials will use Canon 300mm scanners for imaging gate and interconnect features at the 0.13-micron and 0.10-micron nodes. Subsequent efforts will then shift to 70nm development.
Canon will provide its 248nm and 193nm lithography systems to the PMTC, as well as technical support and exposure expertise. Applied Materials will provide the overall program management and direction for equipment integration and process development.