SUSS MicroTec Introduces Mask Aligner for 300 mm Packaging Applications at SEMICON West

SAN JOSE, Calif.- July 15, 2002-SUSS MicroTec today announced the MA300Plus, a full field proximity Mask Aligner addressing the growing demand for advanced packaging tools capable of processing wafers with diameters of up to 300 mm. The MA300Plus represents a new generation of Mask Aligners optimized for modern high-volume, high-end fabs, offering a throughput of more than 100 wafers per hour and high reliability, which translates into increased productivity and yield for back-end processing. The layout of the tool allows a very easy and fast switch between 200 mm and 300 mm wafer processing, making it the ideal bridge tool during the transition phase to the 300 mm wafer generation.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....