SUSS MicroTec Introduces Mask Aligner for 300 mm Packaging Applications at SEMICON West

SAN JOSE, Calif.- July 15, 2002-SUSS MicroTec today announced the MA300Plus, a full field proximity Mask Aligner addressing the growing demand for advanced packaging tools capable of processing wafers with diameters of up to 300 mm. The MA300Plus represents a new generation of Mask Aligners optimized for modern high-volume, high-end fabs, offering a throughput of more than 100 wafers per hour and high reliability, which translates into increased productivity and yield for back-end processing. The layout of the tool allows a very easy and fast switch between 200 mm and 300 mm wafer processing, making it the ideal bridge tool during the transition phase to the 300 mm wafer generation.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...