Feb. 5, 2003 – Marlborough, MA – Shipley Company LLC, has opened its Advanced Technology Center (ATC), a facility dedicated to the development of lithography, interconnect, low-k dielectric and other critical materials.
Shipley, a subsidiary of Rohm and Haas Co., has invested $30 million in the center.
The new 65,000 square-foot ATC building represents the first phase of Shipley’s multi-phase plans for the center. Leo Linehan, director of R&D for Shipley Microelectronics, will manage the ATC’s day-to-day operations and research staff.
Initial ATC programs are focused on the fast-cycle development of new 193nm photoresists and anti-reflectant coatings used in photolithographic processes. Additional programs are expected to focus on the continued development and integration of low-k dielectrics, copper interconnect and later generation lithography materials supporting 157nm, EUV and e-beam technologies.
The ATC’s Class I cleanroom is home to a 193nm exposure systems and the latest in track technology. The new building also includes a comprehensive metrology and modeling facility. Designed for modular cleanroom expansion, the ATC includes an additional 65,000 square feet that would enable Shipley to double the size of the facility in the future.