TSMC rebrands offerings

April 13, 2004 – TSMC has realigned its process technologies into two classes of “technology platforms” in order to add other features and services, and claims to have produced the industry’s first fully-functional 65nm SRAM module.

At its Technology Symposium this week, the company revealed an “advanced” platform targeting 130nm, 90nm, and 65nm nodes, including CMOS logic and mixed-signal RF processes, with design for manufacturability collaboration and design support, backend services, and access to TSMC’s mask production shop.

The “mainstream” technology platform covers process technologies ranging from 0.5-0.15 microns for embedded and nonvolatile memories, SiGe BiCMOS and CMOS image sensor technologies, mixed-signal and RF options, and high-voltage devices.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

NEW PRODUCTS

SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...