TSMC rebrands offerings

April 13, 2004 – TSMC has realigned its process technologies into two classes of “technology platforms” in order to add other features and services, and claims to have produced the industry’s first fully-functional 65nm SRAM module.

At its Technology Symposium this week, the company revealed an “advanced” platform targeting 130nm, 90nm, and 65nm nodes, including CMOS logic and mixed-signal RF processes, with design for manufacturability collaboration and design support, backend services, and access to TSMC’s mask production shop.

The “mainstream” technology platform covers process technologies ranging from 0.5-0.15 microns for embedded and nonvolatile memories, SiGe BiCMOS and CMOS image sensor technologies, mixed-signal and RF options, and high-voltage devices.


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