ICOS acquires 2D wafer inspection business from Siemens AG

June 11, 2004 –ICOS Vision Systems Corp. NV, Heverlee, Belgium, has acquired the 2D wafer inspection business of Siemens AG for a cash consideration of 6.25 million Euro.

ICOS purchased the rights to all of Siemens’ two dimensional (2D) wafer inspection technology, as well as the assets related to the wafer inspection business. The acquisition was closed on June 8.

Siemens’ wafer inspection systems contain advanced wafer handling and image acquisition features and are capable of detecting defects down to 0.2 microns, making them suitable for back-end and front-end wafer level inspection up to 300mm wafer sizes.

Anton DeProft, ICOS president and CEO, said, “We plan to integrate our own developed 3D inspection capability into the acquired systems in order to address the segment of the market that demands a combination of 2D and 3D wafer inspection systems.”

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