ICOS acquires 2D wafer inspection business from Siemens AG

June 11, 2004 –ICOS Vision Systems Corp. NV, Heverlee, Belgium, has acquired the 2D wafer inspection business of Siemens AG for a cash consideration of 6.25 million Euro.

ICOS purchased the rights to all of Siemens’ two dimensional (2D) wafer inspection technology, as well as the assets related to the wafer inspection business. The acquisition was closed on June 8.

Siemens’ wafer inspection systems contain advanced wafer handling and image acquisition features and are capable of detecting defects down to 0.2 microns, making them suitable for back-end and front-end wafer level inspection up to 300mm wafer sizes.

Anton DeProft, ICOS president and CEO, said, “We plan to integrate our own developed 3D inspection capability into the acquired systems in order to address the segment of the market that demands a combination of 2D and 3D wafer inspection systems.”

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...