KIC to co-sponsor lead-free workshop This two-day, hands-on training program will provide participants with a broader knowledge of lead-free materials interactions, as well as a greater understanding of the conversion process. A sample lead-free board manufactured over the two-day course will be produced and taken away by each attendee. Additionally, engineering and technical representatives will be available for one-on-one discussion. (August 17, 2004) Cranston, R.I.—AIM announced today the formation of AIM Semiconductor Packaging Materials. This new division is a direct subsidiary of AIM Specialty Materials, which specializes in indium- and gold-alloys for a variety of joining applications.