KIC to co-sponsor lead-free workshop

This two-day, hands-on training program will provide participants with a broader knowledge of lead-free materials interactions, as well as a greater understanding of the conversion process. A sample lead-free board manufactured over the two-day course will be produced and taken away by each attendee. Additionally, engineering and technical representatives will be available for one-on-one discussion.

(August 17, 2004) Cranston, R.I.&#8212AIM announced today the formation of AIM Semiconductor Packaging Materials. This new division is a direct subsidiary of AIM Specialty Materials, which specializes in indium- and gold-alloys for a variety of joining applications.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Novel Wafer Analyzer for up to 300mm wafer using high speed Raman Imaging Technology
08/08/2016Nanophoton introduces RAMANdrive - a new Wafer Analyzer - for a wide range of applications at semiconductor market a...
Pfeiffer Vacuum introduces HiPace 2800 turbopump for ion implantation applications
07/06/2016Pfeiffer Vacuum has introduced the HiPace 2800 IT turbopump that is designed for ion implantation applications....
NanoFocus AG introduces new inspection system for semiconductors industry
05/31/2016NanoFocus AG, the developer and manufacturer of optical 3D surface measuring technology, introduces the new measuring system µ...