KIC to co-sponsor lead-free workshop

This two-day, hands-on training program will provide participants with a broader knowledge of lead-free materials interactions, as well as a greater understanding of the conversion process. A sample lead-free board manufactured over the two-day course will be produced and taken away by each attendee. Additionally, engineering and technical representatives will be available for one-on-one discussion.

(August 17, 2004) Cranston, R.I.—AIM announced today the formation of AIM Semiconductor Packaging Materials. This new division is a direct subsidiary of AIM Specialty Materials, which specializes in indium- and gold-alloys for a variety of joining applications.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

VaporSorb filter line protects advanced yield production from Entegris
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....
SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...