Carsem expands its MLP capacity

“Although this package still represents less than 5% of the IC packages assembled world wide it continues to be a very popular choice for many of the new generation devices, especially in the area of RF applications,” stated Paul Smith, Carsem’s director of marketing.

(September 8, 2004) Mountain View, Calif.&#8212The MicroElectronics Packaging and Test Engineering Council (MEPTEC) will host a technical symposium titled “Innovations in Equipment and Materials for Microelectronics Packaging: Complexity Drives Collaboration,” on November 11, 2004 at the Hyatt San Jose in San Jose, Calif.

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