Carsem expands its MLP capacity

“Although this package still represents less than 5% of the IC packages assembled world wide it continues to be a very popular choice for many of the new generation devices, especially in the area of RF applications,” stated Paul Smith, Carsem’s director of marketing.

(September 8, 2004) Mountain View, Calif.—The MicroElectronics Packaging and Test Engineering Council (MEPTEC) will host a technical symposium titled “Innovations in Equipment and Materials for Microelectronics Packaging: Complexity Drives Collaboration,” on November 11, 2004 at the Hyatt San Jose in San Jose, Calif.

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