February 11, 2005 – STEAG HamaTech announced today that it will work with SEMATECH to develop cleaning technology for 30nm soft defect removal, concentrating on EUV masks and advanced PSM for 193nm immersion lithography, in collaboration with material suppliers, research institutes. and other equipment suppliers.
Based on its current technology capability and its aggressive technology roadmap, STEAG HamaTech has been asked to join the 5-year SEMATECH North Program located at Albany NanoTech, a leading nanotechnology R&D center located at the University at Albany-State University of New York.
“We are very proud to be a technology partner in this very ambitious project,” said STEAG HamaTech CEO, Dr. Stefan Reineck. “Serving the industry with leading technology and equipment has been our mission for close to 20 years now, and we are looking forward to an intense cooperation with SEMATECH, its members and partner companies in the years to come.”
Utilizing its advanced modular processing platform, ModuTrack, STEAG HamaTech will work with SEMATECH to develop a new mask cleaning technology, which STEAG HamaTech will then commercialize and make available to the industry. SEMATECH, its membership, and the industry are expected to benefit from this project through accelerated market availability of this advanced mask cleaning technology, targeted at the 45nm device technology node and below.