EU Debates RoHS Exemptions

(March 29, 2005) Brussels, Belgium&#8212The outcome of a recent EU Commision TAC meeting concerning RoHS exemptions was the reaffirmation of its original decision to let the exemptions stand &#8212 defying a EU Parliment request to “re-examine” their decision.

(March 30, 2005) Clinton, N.Y. &#8212 Indium Corp. of America will be exhibiting at SMT/Hybrid/Packaging 2005 conference in Nuremberg, Germany, on April 19-20. Their exhibit will feature advanced technology lead-free electronics assembly materials, spanning solder pastes, wave solder fluxes, rework materials and solder fabrications, such as solder preforms, solder ribbon and wire, and solder spheres.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...