STATS ChipPAC Adds 300-mm Wafer Bumping to Portfolio Adding 300-mm wafer bumping on 12-in. silicon wafers greatly expands STATS ChipPAC’s full turnkey service offering for advanced flip chip technology. The new wafer-bumping services will be located in Taiwan, in close proximity to the company’s existing 300-mm bumped wafer sort services, and to foundries. (May 11, 2005) San Jose, Calif. — Worldwide semiconductor manufacturing equipment billings reached US$9.35 billion in Q1 2005, 2.3% above the same quarter one year ago and 6.5% more than Q4 2004, according to SEMI. Monthly, this data is gathered in cooperation with the Semiconductor Equipment Association of Japan (SEAJ) from 150+ global equipment companies.