New UV thermal processing platform

December 7, 2005 – At Semicon Japan, a new ultraviolet thermal processing platform from Novellus was introduced that blends industry-standard lamp-based UV light sources with the company’s multistation sequential processing architecture.

With transistor and interconnect fabrication applications that require 5-10 minutes of total annealing, the SOLA (sequentially optimized luminescent anneal) tool should deliver 20-40 wafers/hr proportional throughputs.

Based on the Vector platform, the 300mm tool features four stations through which each wafer passes in series (see figure). Multistation single-wafer processing in this manner averages nonuniformities within each station for improved within-wafer uniformity.

Each station allows for different temperatures, light frequencies, and lumen intensities to be set, so that multistep anneals can be performed even though the time at each station remains constant.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...