ASMI clamping down on deposition, ALD development

January 27, 2006 – In an move to return to profitability for all of its frontend segments, ASM International NV, Bilthoven, The Netherlands, said that it will scale back its NuTool operation to license the technology, and consolidate its wafer-handling platforms.

The NuTool copper plating, planarization, and electrochemical mechanical deposition processes operation will be reduced to “a small operation” to focus on process and IP licensing. ASMI will record charges for goodwill, asset writeoffs, contractual obligations, and settlement charges with former shareholders of approximately 42 million euros, almost all of which will be noncash, and be recorded in 4Q05. The company acquired the remaining 85% it did not own in the Milpitas, CA-based business in March 2004, in a stock swap deal worth approximately 38-57 million euros.

ASMI also said it will consolidate wafer-handling platforms used in its transistor capacitor product group, including atomic layer deposition (ALD) and plasma-enhanced atomic layer deposition (PEALD) processes acquired in April 2004 from South Korea’s Genitech Inc. Costs associated with the consolidation will be approximately 7 million euros in asset writeoffs and outstanding purchase commitments, also mostly recorded as noncash charges.

ASMI said sales of frontend equipment in 4Q05 “increased significantly” from 3Q05, and for the year were approximately flat with 2004. Further details of the restructuring of NuTool and other areas will be discussed in the company’s 2005 financial results on Feb. 21.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>


SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...