SUSS expands wafer bonder line April 6, 2006 – SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced it is extending its existing wafer bonder range to include a new platform designed specifically for research, development and other low volume bonding applications. Currently the bonder carries the project name of “Elan”. The company said the bonders are well suited for MEMS, advanced packaging and SOI applications and that they are compatible with SUSS MA/BA mask aligners for wafer processes requiring precise bond alignment. SUSS said the Elan wafer bonder has the same core technology as the higher end SUSS bonders, including high accuracy post bond alignment and computer controlled wafer processing. The standard machine is supplied on a metal frame platform with the vacuum chamber, control electronics and computer built-in. The typical wafer bonding processes developed on the Elan bonder, such as anodic, glass frit, eutectic, thermocompression, and polymer bonding are transferable to SUSS automated, high volume wafer bonding cluster tools. This is intended to allow a smooth transition from R&D to pilot line production through to mass production.