SPT, Microbonds align wire bonding strategies

June 29, 2006 – Small Precision Tools and Microbonds Inc. plan to align their technology roadmaps to combine SPT’s advanced wire bonding capillaries with Microbonds’ X-Wire insulated wire bonding technology. Areas to be targeted include stacked die, area array bonding, fine pitch/fine diameter wires, low-k processes, and insulated copper bonding wire.

“The trend to increased I/O density and 3-D packaging and assembly capabilities create increasingly complex multi-tier single die and multi-chip stacked die package designs resulting in significant stresses on bare bonding wire processes,” stated Peter Glutz, president and CEO of SPT Group. “We see insulated bonding wire as a strong enabler for these trends.”

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...