Two-in-One Packaging For Sensor Signal Conditioning

The ZMD31012 sensor contains two ZMD31010 devices in a single SSOP14 package. ZMD claims that incorporating two signal conditioners in one package, sized at 6.33-mm x 7.90-mm, increases both functionality and board real estate.
The chip is designed to enable sensor manufacturers to monitor two independent channels for redundant applications, differential pressure, and flow, and accommodates separate digital compensation of sensor offset, sensitivity, temperature drift, and non-linearity. The company reports that this chip refines calibration of resistive bridge sensors via EEPROM.
Consumption is 2mA, with response time at 1ms. The ZMD31012 functions across a temperature range of -50۫ C to +150۫ C. It communicates via ZMD’s ZACwire serial interface to the host computer and can be mass-calibrated using a Microsoft Windows environment. ZMD, Dresden, Germany, www.zmd.biz.

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