Insulated Wire Technology Hits Mainstream

Microbonds sees the collaborative effort as one angle to a 360&#176 approach to ensure product compatibility. “The interaction of materials and processes in finer and denser packages creates this inevitable trend towards collaboration,” said John Scott, CEO of Microbonds, adding that thorough testing before market was a natural interest for both companies. He said they have reached out to every technology or process that their technology touches, and cited collaborations with Cookson Electronics, Small Precision Tools, ASM, Kulicke and Soffa, and a licensing agreement with Tanaka Denshi Group intended to connect the Canadian company with Asian markets.

By Meredith Courtemanche, assistant editor


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