Flower served as director of the SMTA and helped to lead the 2003 “Where the Component Meets the Board” conference. As an editor with more than 20 years experience, she has created magazines such as Advanced Packaging‘s sister publication SMT Magazine. She will examine major trends from an editor’s point of view, incorporating Moore’s Law, news and trade publications, conferences, and the manufacturing facilities worldwide that all affect the advancement of the electronics industry. The 30-minute keynote should bring a humorous and compellingly insight into the electronics manufacturing world as a whole, linking the sometimes fragmented elements of assembly together into a cohesive industry.
(October 6, 2006) MOUNTAIN VIEW, CA Apache Design Solutions and NEC Electronics collaborated to address power integrity challenges common to system-in-package (SiP) designs. The companies developed a methodology based on system-on-chip (SoC) solutions from Apache, with NEC Electronics providing adaptations for SiP technologies and design.