Symposium to Draw Roadmaps
The microelectronics packaging and test engineering council, MEPTEC, will hold the packaging roadmaps symposium, “IC Packaging and Test Roadmaps: Device Trends Impact on Packaging and Test Technology, and the Supply Chain,” November 16, 2006, in San Jose, CA.
A family of self-filleting die-attach paste adhesives, AAA3300, offers properties comparable to die-attach film. The adhesive is said to enable thin-die assembly at improved yields with conventional assembly techniques, and exhibits capillary flow to 100% die coverage in specified temperature ramp-up. The paste does not produce a bulky fillet, which could overflow to the top of a thin die before cure onset; it wets well with BGA substrates and die tops.