Upcoming Events

Symposium to Draw Roadmaps
The microelectronics packaging and test engineering council, MEPTEC, will hold the packaging roadmaps symposium, “IC Packaging and Test Roadmaps: Device Trends Impact on Packaging and Test Technology, and the Supply Chain,” November 16, 2006, in San Jose, CA.

A family of self-filleting die-attach paste adhesives, AAA3300, offers properties comparable to die-attach film. The adhesive is said to enable thin-die assembly at improved yields with conventional assembly techniques, and exhibits capillary flow to 100% die coverage in specified temperature ramp-up. The paste does not produce a bulky fillet, which could overflow to the top of a thin die before cure onset; it wets well with BGA substrates and die tops.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



Edwards launches new Smart Thermal Management System at SEMICON Europa 2016
10/25/2016Smart TMS helps semiconductor, flat panel display and solar manufacturers improve their process performance and safety by red...
Tektronix introduces Keithley S540 power semiconductor test system
10/19/2016Tektronix, Inc., a worldwide provider of measurement solutions, today introduced the Keithley S540 Power Semiconductor Test System, a ...
Novel Wafer Analyzer for up to 300mm wafer using high speed Raman Imaging Technology
08/08/2016Nanophoton introduces RAMANdrive - a new Wafer Analyzer - for a wide range of applications at semiconductor market a...