FormFactor unveils MEMS-based DRAM wafer testing product

Apr. 13, 2007–FormFactor, Inc. has released its PH150XP wafer probe card, a new product in the company’s line of DRAM wafer testing products. The PH150XP probe card promises several yield and throughput enhancements to enable DRAM manufacturers to achieve additional reductions in their overall cost of test.

MEMS microsprings technology is at the core of FormFactor’s IP associated with our advanced wafer probe cards, says David Viera of FormFactor. “The contact technology comprised of MEMS microsprings can include more than 20 thousand MEMS springs on each card.”

The PH150XP complements FormFactor’s new Harmony XP wafer probe product, introduced in January 2007. While the Harmony XP probe card is designed for full-area 300-mm wafer testing for 1GB and higher-density DRAM devices, the PH150XP is a more cost-effective solution for testing smaller-sized, smaller density DRAM devices (512MB and below) where tester resources mandate four or more touchdowns per wafer.

“With demand for cellular phones, MP3 players and other mobile handset products continuing to drive the need for consumer DRAM devices, our customers are looking to us to provide wafer probe solutions that help enable them to meet their time-to-market requirements at the lowest cost of test,” states company CEO Igor Khandros.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...