SolVision Inspects Flip Chip Substrates

(April 17, 2007) BOUCHERVILLE, Quebec — SolVision installed a Nano 3D SX bump metrology system at a flip chip substrate manufacturer based in Japan. The repeat order resulted from the machine’s flexibility, support for lead-free bumps, and multi-die-substrate capabilities, said Jean-Lévy Beaudoin, product manager, substrate inspection, SolVision. The machine will be used for flip chip substrate inspection.

By Meredith Courtemanche, assistant editor

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