IEEE Awards Packaging Professionals

(June 15, 2007) PISCATAWAY, NJ &#151 During the Electronic Components and Technology Conference in Reno, NV, the IEEE presented Dimitry Grabbe; Rao R. Tummala; Philip Garrou, Ph.D.; Chin C. Lee, Ph.D.; Herbert Reichl, Ph.D.; and Myung Jin Yim, Ph.D., its technical awards for contributions to components, packaging and electronics manufacturing technology.

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