Ormecon introduces nanometal finish for printed circuit boards

September 28, 2007 — Ormecon International has introduced a new nanosize surface finish for the printed circuit board market. With a thickness of 55 nanometers, the layer consists of a nanoparticle complex formed between organic nanometal and silver.

According to Ormecon, this ultrathin layer provides a much more powerful protection against oxidation than any other established metallic finish, which are between six and 100 times thicker than the new nanofinish.

The Korean company YooJin will install the first industrial line for the nanofinish, Ormecon said in a news release, and the line will go into operation in the second half of October. The company said the JooJin installation will mark the first time a nanosized surface finish is used for printed circuit boards.

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