(October 4, 2007) YPSILANTI, MI— Integrated Sensing Systems, Inc. (ISSYS) was awarded a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The 2-year project, “Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems,” is aimed towards development of a novel packaging method to simplify the packaging of MEMS and their associated electronics.
POST A COMMENT
Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.