300-mm Wafer Bonding Tool The GEMINI platform is a production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D integration, and advanced packaging, as well as compound semiconductor applications. The tool is 300-mm-ready and incorporates EV Group’s patented SmartView bond alignment principle, as well as up to four wafer-bond chambers, capable of achieving post-bond alignment accuracies in the sub-micron range. The SmartView bond aligner reportedly is able to perform high-precision aligned direct bonding without the necessity of transferring the aligned wafers to a separate high-force bond chamber. The system can directly handle thin wafers down to 200 µm, however, the handling concept can be combined with EV Group’s thin-wafer carrier handling technology that is capable of handling wafers down to 50 µm mounted temporarily on wafer carriers. EV Group, St. Florian/Inn, Austria; www.evgroup.com.