IIT Bombay chooses EVG MEMS tools for automotive development February 8, 2008 — EV Group (EVG), a supplier of wafer-bonding and lithography equipment, has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG’s MEMS-focused systems. IIT Bombay purchased the EVG620TB bond and mask aligner and EVG501 wafer bonder for a new Indian government-supported automotive MEMS R&D project being pursued in close cooperation with the Indian Institute of Science, Bangalore, which previously purchased the same EVG equipment. The new EVG systems are slated for installation this month in IIT Bombay’s Mumbai facility. “We created the Centre of Excellence in Nanoelectronics at IIT Bombay for the specific purpose of conducting research in nanoscale devices and microfabricated sensors, and we are pleased to note that it is considered one of India’s leading laboratories in this field,” said V. Ramgopal Rao, chief investigator for the Nanoelectronics Centre Project, IIT Bombay. The EVG620TB performs precise wafer/substrate alignment with 1 micron alignment accuracy for wafer-bonding applications. It features a high-resolution, bottom-side split-field microscope and special capabilities to support MEMS processing requirements, including bond alignment for double and triple stacks, and universal align/bond chucks to transfer aligned wafers to wafer-bonding systems in the EVG500 family. The EVG501 performs anodic, thermo-compression, fusion bonding or low-temperature plasma bonding via a single, universal bond chamber in which the top and bottom of the wafer are heated independently to compensate for different coefficients of thermal expansion. The system can support all MEMS wafer sizes and materials up to 150mm, with full support for fragile or bowed wafers, and is designed for ease of transfer from R&D to volume production.