March 3, 2008 — Stefan Wurm, program manager, EUV strategy at SEMATECH, updates Solid State Technology‘s Senior Technical Editor Debra Vogler on that group’s progress in immersion lithography and EUV. Highlighted is progress on EUV mask defectivity and the first integrated chip with a layer made using EUV lithography. He also discusses the nanocomposite approach to high-index immersion lithography and the consortium’s efforts to monitor non-optical lithography methods (e.g., NIL).
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